Optoelectronic component, contact-making device, and optoelectronic subassembly

Patent metadata

Field	Value
Publication number	US-9583740-B2
Application number	US-201415029678-A
Country	US
Kind code	B2
Filing date	Oct 16, 2014
Priority date	Oct 16, 2013
Publication date	Feb 28, 2017
Grant date	Feb 28, 2017

Abstract

An optoelectronic component include a carrier body, an optoelectronic layer structure formed above the carrier body and having at least one contact region for contacting the optoelectronic layer structure, a covering body arranged above the optoelectronic layer structure, at least one contact cutout extending through the covering body and/or the carrier body. The contact cutout has a first and a second cutout regions, which lead into one another and which extend from an outer surface of the covering body and/or of the carrier body in a layer plane direction where the contact region is formed. A first clear width of the contact cutout near the corresponding outer surface in the first cutout region is greater than a second clear width in the second cutout region near the corresponding outer surface. The second clear width is less than a third clear width of the second cutout region near the contact region.

First claim

The invention claimed is:

1. An optoelectronic component, comprising:
a carrier body,
an optoelectronic layer structure formed above the carrier body and having at least one contact region for electrically contacting the optoelectronic layer structure,
a covering body arranged above the optoelectronic layer structure,
at least one contact cutout, extending through the covering body and/or the carrier body and having a first cutout region and a second cutout region, which lead into one another and which extend in each case from an outer surface of the covering body and/or of the carrier body in a direction toward a layer plane in which the contact region is formed, wherein a first clear width of the contact cutout near the corresponding outer surface in the first cutout region is greater than a second clear width in the second cutout region near the corresponding outer surface, and wherein the second clear width of the second cutout region near the corresponding outer surface is less than a third clear width of the second cutout region near the contact region, and wherein at least one part of the contact region is exposed at least in the second cutout region.

2. The optoelectronic component as claimed in claim 1 , wherein the optoelectronic layer structure has an encapsulation layer and/or an adhesion medium layer, and wherein the contact cutout extends through the encapsulation layer and/or through the adhesion medium layer.

3. The optoelectronic component as claimed in claim 1 , wherein the covering body comprises metal or glass.

4. The optoelectronic component as claimed in claim 1 , wherein the carrier body and the covering body have exposed side edges and are formed flush with one another at the side edges.

5. The optoelectronic component as claimed in claim 1 , wherein the first clear width is equal to the third clear width.

6. The optoelectronic component as claimed in claim 1 , wherein the entire first cutout region has the first clear width.

7. The optoelectronic component as claimed in claim 1 , wherein the contact region is exposed at least partly in the first cutout region.

8. The optoelectronic component as claimed in claim 1 , wherein the contact cutout has a third cutout region, which is formed between the first and second cutout regions and the inner clear width of which near the layer plane of the contact region is greater than the outer clear width thereof near the corresponding surface, wherein a first transition from the third clear width to the second clear width in the second cutout region is further away from the layer plane of the contact region than a second transition from the inner clear width to the outer clear width in the third cutout region.

9. A contacting device for electrically contacting an optoelectronic component, comprising at least one plug element which has a first axial section, having a first external dimension, near a first axial end of the plug element and which has, adjoining the first axial section, a second axial section, having a second external dimension which is smaller than the first external dimension, wherein the plug element has a plug cutout, which extends in an axial direction through the plug element and in which is arranged a contact pin, which protrudes from the first axial end of the plug element, and wherein the contact pin is arranged movably in an axial direction and is mechanically coupled to a spring element that applies a force to the contact pin in the direction of the first axial end of the plug element, wherein the plug element has a stop in the plug cutout, said stop being formed such that it prevents the contact pin from being forced out completely from the plug element.

10. The contacting device as claimed in claim 9 , wherein the plug element has, adjoining the second axial section, a third axial section, having a third external dimension, which is larger than the second external dimension.

11. The contacting device as claimed in claim 9 , further comprising a carrier element, on which the plug element and at least one further plug element are arranged.

12. The contacting device as claimed in claim 11 , wherein the carrier element is formed by a printed circuit board having at least one electrically conductive conductor track that is electrically coupled to the plug element.

13. An optoelectronic assembly comprising an optoelectronic component,
the optoelectronic component, comprising:
a carrier body,
an optoelectronic layer structure formed above the carrier body and having at least one contact region for electrically contacting the optoelectronic layer structure,
a covering body arranged above the optoelectronic layer structure,
at least one contact cutout, extending through the covering body and/or the carrier body and having a first cutout region and a second cutout region,
which lead into one another and which extend in each case from an outer surface of the covering body and/or of the carrier body in a direction toward a layer plane in which the contact region is formed, wherein a first clear width of the contact cutout near the corresponding outer surface in the first cutout region is greater than a second clear width in the second cutout region near the corresponding outer surface, and wherein the second clear width of the second cutout region near the corresponding outer surface is less than a third clear width of the second cutout region near the contact region, and wherein at least one part of the contact region is exposed at least in the second cutout region, and
a contacting device for electrically contacting the optoelectronic component, wherein the contacting device comprises at least one plug element which has, near a first axial end of the plug element, a first axial section, having a first external dimension, and which has, adjoining the first axial section, a second axial section, having a second external dimension, which is smaller than the first external dimension, wherein the first external dimension of the first axial section is smaller than or of the same size as the first clear width of the first cutout region of the contact cutout and the third clear width of the second cutout region of the contact cutout, and wherein the first external dimension of the first axial section is larger than the second clear width of the second cutout region of the contact cutout, and wherein the second external dimension of the second axial section of the plug element is smaller than or of the same size as the second clear width.

14. The optoelectronic assembly as claimed in claim 13 , wherein the contacting device comprises at least one plug element which has a first axial section, having a first external dimension, near a first axial end of the plug element and which has, adjoining the first axial section, a second axial section, having a second external dimension which is smaller than the first external dimension, wherein the plug element has a plug cutout, which extends in an axial direction through the plug element and in which is arranged a contact pin, which protrudes from the first axial end of the plug element, and wherein the contact pin is arranged movably in an axial direction and is mechanically coupled to a spring element that applies a force to the contact pin in the direction of the first axial end of the plug element, wherein the plug element has a stop in the plug cutout, said stop being formed such that it prevents the contact pin from being forced out completely from the plug element.

15. The optoelectronic assembly as claimed in claim 14 , wherein the plug element is arranged in the second section of the contact cutout such tha

Assignees

• Osram Oled Gmbh

Inventors

• Farrnbacher Joerg
• Schicktanz Simon

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/00 Primary

  Interconnections or connectors in packages · CPC title

• H10K59/873

  Encapsulations · CPC title

• H10K59/8722

  Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title

• H10K59/805

  Electrodes · CPC title