System and method for producing devices including a semiconductor part and a non-semiconductor part

Patent metadata

Field	Value
Publication number	US-9659798-B2
Application number	US-201213558299-A
Country	US
Kind code	B2
Filing date	Jul 25, 2012
Priority date	Jan 21, 2011
Publication date	May 23, 2017
Grant date	May 23, 2017

Abstract

A system produces devices that include a semiconductor part and a non-semiconductor part. A front end is configured to receive a semiconductor part and to process the semiconductor part. A back end is configured to receive the processed semiconductor part and to assemble the processed semiconductor part and a non-semiconductor part into a device. A transfer device is configured to automatically handle the semiconductor part in the front end and to automatically transfer the processed semiconductor part to the back end.

First claim

What is claimed is:

1. A system for producing a device that include a semiconductor part and a non-semiconductor part, the system comprising:
a front end configured to receive the semiconductor part and to process the semiconductor part;
a back end configured to receive the processed semiconductor part and to assemble the processed semiconductor part and the non-semiconductor part into the device; and
a transfer device configured to automatically handle the semiconductor part in the front end and to automatically transfer the processed semiconductor part to the back end.

2. The system of claim 1 , wherein the transfer device comprises a robot having an arm provided with a gripper configured to grip the semiconductor part.

3. The system of claim 1 , wherein the front end comprises an etching station and a test station, and wherein the transfer device is configured to insert/remove a semiconductor part into/from a respective station.

4. The system of claim 3 , wherein the back end comprises an intermediate tray configured to receive a processed semiconductor part, and wherein the transfer device is configured to transfer the semiconductor part from an input of the front end to the etching station, from the etching station to the test station, and from the test station to the intermediate tray of the back end in case the processed semiconductor part passed the test, to a reject bin in case the processed semiconductor part did not pass the test, or back into the etch station in case the test indicates that additional etching is required.

5. The system of claim 1 , wherein the back end comprises an assembly station configured to assemble the processed semiconductor part and the non-semiconductor part into an assembled stack.

6. The system of claim 5 , wherein the assembly station is configured to receive one or more non-semiconductor parts and the processed semiconductor part for forming the assembled stack, and wherein the assembly station comprises:
a centering device configured to center the non-semiconductor parts of the assembled stack; and
a clamping device configured to apply a clamp force to a top and a bottom of the assembled stack.

7. The system of claim 6 , wherein the centering device comprises a plurality of centering elements arranged at different positions around a receiving area of the assembly station, wherein each of the centering elements is moveable in a vertical direction and in a radial direction, and wherein the assembly station is configured to form the assembled stack by:
receiving at least one first non-semiconductor part;
moving the centering elements radially inward for centering the first non-semiconductor part;
receiving the processed semiconductor part on the first non-semiconductor part, wherein a diameter of the processed semiconductor part is larger than the diameter of the first non-semiconductor part;
receiving at least one second non-semiconductor part on the processed semiconductor part;
moving the centering elements radially outward and vertically so as to allow the centering elements to pass the processed semiconductor part, and radially inward after having passed the processed semiconductor part for centering the second non-semiconductor part; and
activating the clamping device for applying the clamp force to the stack.

8. The system of claim 7 , wherein the clamping device is configured to raise the stack to a position elevated with respect to the receiving area, while maintaining the clamp force.

9. The system of claim 7 , wherein the back end comprises a transfer device and a position detecting device configured to detect a position of a processed semiconductor part held by the transfer device with respect to the transfer device, and wherein the transfer device is configured to be controlled on a basis of the detected position for placing the processed semiconductor part centered on the first non-semiconductor part.

10. The system of claim 9 , wherein the clamping device comprises a lower stamp and an upper stamp that are vertically moveable for an engagement with the assembled stack and for application of the clamp force, wherein the transfer device comprises a gripper configured to hold the processed semiconductor part for placement in the assembly station and to hold the assembled stack while applying the clamp force, and wherein the clamping device and the transfer device are configured such that the clamping device releases the clamp force only once the gripper of the transfer device engaged the assembled stack and applied the clamp force to the assembled stack so as to ensure a continuous application of the clamp force to the assembled stack.

11. The system of claim 7 , further comprising a first monitoring device configured to optically monitor an edge of the assembled stack to determine along a periphery at predefined intervals a first distance between an outer edge of the processed semiconductor part and an outer edge of the first and second non-semiconductor parts.

12. The system of claim 1 , further comprising a passivation station, wherein the passivation station comprises a nozzle device configured to apply a passivation material to an edge of a stack of assembled parts such that the edge of the processed semiconductor part is covered with the passivation material.

13. The system of claim 12 , wherein the nozzle device comprises a top nozzle and a bottom nozzle for applying the passivation material.

14. The system of claim 12 , further comprising
a first monitoring device configured to optically monitor the edge of the stack of assembled parts to determine along a periphery at predefined intervals a first distance between an outer edge of the processed semiconductor part and an outer edge of first and second non-semiconductor parts, and
a second monitoring device configured to optically monitor an edge of the stack of assembled parts to which the passivation material was applied to determine at a plurality of predefined intervals a second distance between an outer edge of the passivation material on the processed semiconductor part and an outer edge of the first and second non-semiconductors, wherein the system is configured to determine on a basis of the first and second distances a thickness of the passivation material in a radial direction provided on the edge of the processed semiconductor part.

15. The system of claim 14 , wherein the nozzle device is arranged radially moveable with regard to the edge of the stack of assembled parts, and wherein the nozzle device is configured to be controlled with respect to its position and/or amount of the passivation material dispensed on a basis of the determined thickness.

16. The system of claim 1 , further comprising a heating station, wherein the heating station comprises a pair of heating brackets configured to be moveable with respect to each other and to receive a stack of assembled and passivated parts there between.

17. The system of claim 16 , wherein the heating brackets are configured such that a gripper of a transfer device placing the stack there between releases the stack only once the heating brackets were closed and apply a clamp force so as to ensure a continuous application of the clamp force to the stack.

18. The system of claim 16 , comprising a plurality of heating stations configured to be selectively activated dependent on a number of stacks produced.

19. The system of claim 1 , wherein the device to be assembled comprises a power disc device including a semiconductor chip sandwiched between a plurality of metal disc

Assignees

• Neuhoff Oskar
• Gamon Tobias
• Haueis Norbert Martin
• Pikorz Dirk
• Larisch Michael Wolfgang
• Reithner Franz
• Infineon Technologies Ag

Inventors

• Neuhoff Oskar
• Gamon Tobias
• Haueis Norbert Martin
• Pikorz Dirk
• Larisch Michael Wolfgang
• Reithner Franz

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P72/7608

  characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10P72/0616

  Monitoring of warpages, curvatures, damages, defects or the like · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title