Semiconductor device

Patent metadata

Field	Value
Publication number	US-9490200-B2
Application number	US-201514841643-A
Country	US
Kind code	B2
Filing date	Aug 31, 2015
Priority date	May 14, 2009
Publication date	Nov 8, 2016
Grant date	Nov 8, 2016

Abstract

Disclosed is a semiconductor device having a structure capable of reducing the self-inductance of internal wiring. The semiconductor device includes: a lower board having a lower conductor layer formed on the surface thereof; a switching element bonded to the lower conductor layer in an element bonding area; a terminal bonded to the lower conductor layer in a terminal bonding area; an upper board stacked on the lower board in a board bonding area between the element bonding area and the terminal bonding area, and having an upper conductor layer on the surface thereof; and a switching element connecting member which connects the switching element with the upper conductor layer.

First claim

The invention claimed is:

1. A power module comprising:
a first board assembly; and
a second board assembly, wherein
the first board assembly includes:
a first lower board having a first lower conductor layer formed on a surface thereof;
a plurality of first semiconductor devices bonded to the first lower conductor layer in a first element bonding area;
a first power supply terminal bonded to the first lower conductor layer in a first terminal bonding area; and
a first upper board stacked on the first lower board in a first board bonding area, and having a first upper conductor layer on a surface thereof;
the second board assembly includes:
a second lower board having a second lower conductor layer formed on a surface thereof;
a plurality of second semiconductor devices bonded to the second lower conductor layer in a second element bonding area;
an output terminal electrically connected to the first upper conductor layer, and bonded to the second lower conductor layer in a second terminal bonding area;
a second upper board stacked on the second lower board in a second board bonding area, and having a second upper conductor layer on a surface thereof; and
a second power supply terminal bonded to the second upper conductor layer.

2. The power module according to claim 1 , wherein
the first board assembly further comprising a first connecting member which connects the plurality of first semiconductor devices with the first upper conductor layer;
the second board assembly further comprising a second connecting member which connects the plurality of second semiconductor devices with the second upper conductor layer.

3. The power module according to claim 1 , further comprising a case which surrounds the first board assembly and the second board assembly, wherein
a part of the output terminal is led out of the case.

4. The power module according to claim 3 , wherein
a part of the output terminal penetrates the side plate of the case and is led out of the case.

5. The power module according to claim 4 , wherein
a part of the output terminal is elongated parallel to the second lower board and is led out of the case.

6. The power module according to claim 1 , wherein the first power supply terminal and second power supply terminal have plate-shaped parts facing each other with a predetermined interval kept therebetween.

7. The power module according to claim 1 , wherein
the plurality of first semiconductor devices includes a plurality of first switching elements and a first diode element;
the plurality of second semiconductor devices includes a plurality of second switching elements and a second diode element.

8. The power module according to claim 7 , wherein
the first board assembly further comprises a first switching element connecting member which connects the plurality of first switching elements with the first upper conductor layer and is elongated parallel to a direction from the first element bonding area to the first terminal bonding area; and
a first diode element connecting member which connects the first diode element with the first upper conductor layer,
the second board assembly further comprises a second switching element connecting member which connects the plurality of second switching elements with the second upper conductor layer and is elongated parallel to a direction from the second element bonding area to the second terminal bonding area; and
a second diode element connecting member which connects the second diode element with the second upper conductor layer.

9. The power module according to claim 7 , wherein
the plurality of first switching elements include a plurality of first switching elements arranged spaced from the first diode element at almost the same intervals around the first diode element and in a direction which is different from a direction opposed to one another;
the plurality of second switching elements include a plurality of second switching elements arranged spaced from the second diode element at almost the same intervals around the second diode element and in a direction which is different from a direction opposed to one another.

10. The power module according to claim 9 , wherein
the first upper conductor layer is formed in a rectangular shape, the plurality of first switching elements are facing one side of the rectangular-shaped first upper conductor layer, and the first switching elements include a pair of first switching elements facing both end portions of the one side of the first upper conductor layer;
the second upper conductor layer is formed in a rectangular shape, the plurality of second switching elements are facing one side of the rectangular-shaped second upper conductor layer, and the second switching elements include a pair of second switching elements facing both end portions of the one side of the second upper conductor layer.

11. The power module according to claim 9 , wherein
the first diode elements includes a plurality of first diode elements;
the first upper conductor layer is formed in a rectangular shape, the plurality of first diode elements are facing one side of the rectangular-shaped first upper conductor layer, and the first diode elements include a pair of first diode elements facing both end portions of the one side of the first upper conductor layer;
the second diode elements includes a plurality of second diode elements;
the second upper conductor layer is formed in a rectangular shape, the plurality of second diode elements are facing one side of the rectangular-shaped second upper conductor layer, and the second diode elements include a pair of first diode elements facing both end portions of the one side of the second upper conductor layer.

12. The power module according to claim 7 , wherein the first switching elements and second switching elements are elements using a SiC semiconductor.

Assignees

• Rohm Co Ltd

Inventors

• Yoshihara Katsuhiko
• Ishii Masaru
• Kitaguro Kouichi

Classifications

• H10W90/764

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/731

  of die-attach connectors · CPC title