Low profile zero/low insertion force package top side flex cable connector architecture

US9640887B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9640887-B2
Application numberUS-201615135413-A
CountryUS
Kind codeB2
Filing dateApr 21, 2016
Priority dateDec 20, 2011
Publication dateMay 2, 2017
Grant dateMay 2, 2017

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An integrated circuit package is presented. In an embodiment, the integrated circuit package has contact pads formed on the top side of a package substrate, a die electrically attached to the contact pads, and input/output (I/O) pads formed on the top side of the package substrate. The I/O pads are electrically connected to the contact pads. The integrated circuit package also includes a flex cable receptacle electrically connected to the I/O pads on the top side of the package substrate. The flex cable receptacle is non-compressively attachable to a flex cable connector and includes receptacle connection pins electrically connected to the I/O pads.

First claim

Opening claim text (preview).

What is claimed is: 1. A flex cable assembly, comprising: a flex cable comprising: a connector portion formed on at least one of two ends of the flex cable, wherein the connector portion includes a plurality of cable contacts; and a transmission portion formed between the two ends of the flex cable, wherein the transmission portion comprises a plurality of traces electrically coupled to the plurality of cable contacts a flex cable stiffener disposed on a top side of the connector portion of the flex cable; and a flex cable connector attached to a bottom side of the connector portion of the flex cable, wherein the flex cable connector includes a plurality of connector connection pins electrically coupled to the plurality of cable contacts, and the flex cable connector is attachable to a flex cable receptacle that is mounted on a package substrate of an integrated circuit package. 2. The flex cable assembly of claim 1 , wherein the flex cable connector is a pin carrier. 3. The flex cable assembly of claim 2 , wherein the flex cable receptacle is one of a low-insertion force socket or a zero-insertion force socket with a cam box. 4. The flex cable assembly of claim 2 , wherein the pin carrier further comprises a pin shroud. 5. The flex cable assembly of claim 2 , wherein the pin carrier has a core made of a material selected from a group consisting of a liquid crystal polymer dielectric and a printed circuit board material. 6. The flex cable assembly of claim 1 , wherein the flex cable connector is one of a low-insertion force socket or a zero-insertion force socket with a cam box.

Assignees

Inventors

Classifications

  • Reinforced areas, e.g. for a specific part of a flexible printed circuit · CPC title

  • Flip chip · CPC title

  • Frame holders · CPC title

  • Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support · CPC title

  • Surface mounted metallic pins · CPC title

Patent family

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Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9640887B2 cover?
An integrated circuit package is presented. In an embodiment, the integrated circuit package has contact pads formed on the top side of a package substrate, a die electrically attached to the contact pads, and input/output (I/O) pads formed on the top side of the package substrate. The I/O pads are electrically connected to the contact pads. The integrated circuit package also includes a flex c…
Who is the assignee on this patent?
Intel Corp
What technology area does this patent fall under?
Primary CPC classification H01R12/62. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 02 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).