Spacer system for a semiconductor switching device

Patent metadata

Field	Value
Publication number	US-9698067-B2
Application number	US-201514940635-A
Country	US
Kind code	B2
Filing date	Nov 13, 2015
Priority date	May 13, 2013
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

A spacer system for a semiconductor switching device which is formed as a spacer ring and a plurality of insulating elements and supporting elements are arranged in an alternating manner around a circumference of the spacer ring. The insulating element includes a recess receiving a cathode gate connector element. The supporting element includes a projection receiving a spring system for clamping while assembling the switching device. The switching device includes a substrate, a cathode pole piece, an anode pole piece, strain buffer plates and a gate ring. Further connector elements, are electrically connecting the cathode pole piece and the gate ring of the semiconductor switching device to an external circuit unit. The space between the connector elements is minimized in order to reduce the gate circuit impedance, thus enabling an increased maximum turn-off current and further allowing for the use of larger semiconductor switching devices for high power applications.

First claim

What is claimed is:

1. A spacer system for a semiconductor switching device comprising a plurality of insulating elements and a plurality of supporting elements, wherein the spacer system is formed as a spacer ring and the plurality of insulating elements and the plurality of supporting elements are arranged in an alternating manner around a circumference of the spacer ring and
wherein at least one of the plurality of insulating elements comprises a recess receiving a gate connector element and at least one of the plurality of supporting elements comprises a projection receiving a spring system for clamping while assembling the semiconductor switching device.

2. The spacer system according to claim 1 , wherein the gate connector element is guided by the at least one of the plurality of insulating elements below the spring system and wherein the gate connector element is pressed between the at least one of the plurality of insulating elements and the spring system.

3. The spacer system according to claim 2 , wherein a section of the gate connector element bridges a height difference during clamping of the switching device for assembling the device.

4. The spacer system according to claim 2 , wherein the spacer system is received by a cathode strain buffer plate of the semiconductor switching device and is smaller in diameter than the cathode strain buffer plate or formed as a spring element.

5. The spacer system according to claim 2 , further comprising at least one of an alignment element for the spring system, a support element for a gate ring, and an alignment element of a cathode strain buffer plate.

6. The spacer system according to claim 1 , wherein a section of the gate connector element bridges a height difference during clamping of the switching device for assembling the device.

7. The spacer system according to claim 1 , wherein the spacer system is received by a cathode strain buffer plate of the semiconductor switching device and is smaller in diameter than a cathode strain buffer plate or formed as a spring element.

8. The spacer system according to claim 1 , further comprising at least one of an alignment element for the spring system, a support element for a gate ring, and an alignment element of a cathode strain buffer plate.

9. The spacer system according to claim 1 , wherein the spring system is comprised of Belleville springs or of wavelike springs.

10. The spacer system according to claim 1 , wherein the recess and the projection are formed integrally or separately and are comprised of glimmer, polymer, dielectric, ceramic material or a compound material.

11. The spacer system according to claim 1 , wherein at least one of the plurality of insulating elements has a thickness of less than 500 μm and at least one of the plurality of supporting elements has a thickness of more than 1 mm.

12. A semiconductor switching device, comprising a substrate, a cathode pole piece, an anode pole piece, strain buffer plates and a gate ring, wherein connector elements are electrically connecting the cathode pole piece and the gate ring of the semiconductor switching device to an external circuit unit, the semiconductor switching device further comprising a spacer system comprising a plurality of insulating elements and a plurality of supporting elements, wherein the spacer system is formed as a spacer ring and the plurality of insulating elements and the plurality of supporting elements are arranged in an alternating pattern around a circumference of the spacer ring and wherein a section of a gate connector element is bent during clamping of the switching device while assembling the device and
wherein at least one of the plurality of insulating elements comprises a recess receiving the gate connector element and at least one of the plurality of supporting elements comprises a projection receiving a spring system and wherein the gate connector element is guided by the at least one of the plurality of insulating elements below the spring system.

13. The semiconductor switching device according to claim 12 , wherein the semiconductor switching device is a gate commutated thyristor.

14. The semiconductor switching device according to claim 12 , further comprising a housing tube made of an insulating material or a ceramic material.

15. The semiconductor switching device according to claim 12 , wherein the cathode pole piece comprises a cathode strain buffer plate and wherein the anode pole piece comprises an anode strain buffer plate, wherein a housing flange is aligned to the cathode pole piece and an anode flange is aligned to the anode pole piece, and wherein in particular a housing comprises at least one creepage section at the outside thereof in order to deviate creepage currents from the anode to the gate connector.

16. The semiconductor switching device according to claim 15 , wherein the substrate and the strain buffer plates are affixed by an alignment pin or ring or wherein the strain buffer plates are affixed by an alignment pin or ring and the substrate is affixed by an edge rubber and wherein further the cathode strain buffer plate has a thickness lower than a thickness of the anode strain buffer plate and the cathode strain buffer plate is formed as a cup with an opening of the cup facing the cathode pole piece and the cup receiving the cathode pole piece.

17. The semiconductor switching device according to claim 12 , wherein the substrate and the strain buffer plates are affixed by an alignment pin or ring or wherein the strain buffer plates are affixed by an alignment pin or ring and the substrate is affixed by an edge rubber and wherein further the cathode strain buffer plate has a thickness lower than a thickness of the anode strain buffer plate and the cathode strain buffer plate is formed as a cup with an opening of the cup facing the cathode pole piece and the cup receiving the cathode pole piece.

18. The semiconductor switching device according to claim 12 , wherein the gate connector element is guided by the at least one of the plurality of insulating elements below the spring system and wherein the gate connector element is pressed between the at least one of the plurality of insulating elements and the spring system.

19. The semiconductor switching device according to claim 18 , wherein the semiconductor switching device is a gate commutated thyristor.

20. The semiconductor switching device according to claim 18 , wherein a housing tube is made of an insulating material or a ceramic material.

21. The semiconductor switching device according to claim 18 , wherein the cathode pole piece comprises a cathode strain buffer plate and wherein the anode pole piece comprises an anode strain buffer plate, wherein a housing flange is aligned to the cathode pole piece and an anode flange is aligned to the anode pole piece, and wherein in particular a housing comprises at least one creepage section at the outside thereof in order to deviate creepage currents from the anode to the gate connector.

22. The semiconductor switching device according to claim 18 , wherein the substrate and the strain buffer plates are affixed by an alignment pin or ring or wherein the strain buffer plates are affixed by an alignment pin or ring and the substrate is affixed by an edge rubber and wherein further the cathode strain buffer plate has a thickness lower than a thickness of the anode strain buffer plate and the cathode strain buffer plate is formed as a cup with an opening of the cup facing the cathode

Assignees

• Abb Schweiz Ag

Inventors

• Stiasny Thomas

Classifications

• H10W46/301

  for alignment · CPC title

• H10W46/00

  Marks applied to devices, e.g. for alignment or identification · CPC title

• H10W78/00

  Detachable holders for supporting packaged chips in operation · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10W76/138 Primary

  having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type · CPC title