Bump on pad (bop) bonding structure in semiconductor packaged device
US-2017345783-A1 · Nov 30, 2017 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L23/488 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 409 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 25 |
| 2016 | 28 |
| 2017 | 30 |
| 2018 | 46 |
| 2019 | 42 |
| 2020 | 61 |
| 2021 | 46 |
| 2022 | 36 |
| 2023 | 36 |
| 2024 | 33 |
| 2025 | 23 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Seal ring structure with a metal pad
US-9812409-B2 · Nov 7, 2017 · US
Metal to metal bonding for stacked (3D) integrated circuits
US-9673176-B2 · Jun 6, 2017 · US
Metal to metal bonding for stacked (3D) integrated circuits
US-9653432-B2 · May 16, 2017 · US
Metal to metal bonding for stacked (3D) integrated circuits
US-9653431-B2 · May 16, 2017 · US
Method of producing a large number of support apparatus which can be surface-mounted, arrangement of a large number of support apparatus which can be surface-mounted, and support apparatus which can be surface-mounted
US-9627304-B2 · Apr 18, 2017 · US
Pin grid interposer
US-9607937-B2 · Mar 28, 2017 · US
Electronic apparatus and method for fabricating the same
US-9530745-B2 · Dec 27, 2016 · US
Metal to metal bonding for stacked (3D) integrated circuits
US-9515051-B2 · Dec 6, 2016 · US
Fabricating pillar solder bump
US-9508594-B2 · Nov 29, 2016 · US
Electronic apparatus and method for fabricating the same
US-9490232-B2 · Nov 8, 2016 · US
Offset integrated circuit packaging interconnects
US-9478482-B2 · Oct 25, 2016 · US
Copper-containing layer on under-bump metallization layer
US-9472524-B2 · Oct 18, 2016 · US
Semiconductor device and method of manufacturing the same
US-9466558-B2 · Oct 11, 2016 · US
Semiconductor device and methods of manufacturing semiconductor devices
US-9455161-B2 · Sep 27, 2016 · US
Pillar bumps and process for making same
US-9449931-B2 · Sep 20, 2016 · US
Semiconductor device
US-9449951-B2 · Sep 20, 2016 · US
Adjusting sizes of connectors of package components
US-9430605-B2 · Aug 30, 2016 · US
Low-cost low-profile solder bump process for enabling ultra-thin wafer-level packaging (WLP) packages
US-9425064-B2 · Aug 23, 2016 · US
Power module
US-9426915-B2 · Aug 23, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L23/488?
- CPC H01L23/488 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L23/488 (Electricity)?
- Our database includes 409 publications tagged with this CPC code.
- Is patent activity under CPC H01L23/488 growing?
- Publication counts under this code: 33 in 2024 vs 23 in 2025 (latest complete years).