Low-cost low-profile solder bump process for enabling ultra-thin wafer-level packaging (WLP) packages

Patent metadata

Field	Value
Publication number	US-9425064-B2
Application number	US-201213718130-A
Country	US
Kind code	B2
Filing date	Dec 18, 2012
Priority date	Dec 18, 2012
Publication date	Aug 23, 2016
Grant date	Aug 23, 2016

Abstract

Techniques are described herein for a dip soldering process which provides a low-profile, low-cost solder bump formation process which may be implemented to promote package thickness scaling (e.g., reduce the overall package thickness). For example, the dip soldering process disclosed herein may enable ultra-thin wafer-level packages (WLP), ultra-thin wafer level quad-flat no-leads (WQFN) packages, or the like.

First claim

What is claimed is:

1. A process comprising:
positioning a plurality of semiconductor wafers over a receptacle, the plurality of semiconductor wafers disposed within a holder configured to hold the plurality of semiconductor wafers in a vertically oriented configuration, the receptacle containing liquid solder, wherein a flux is disposed over the receptacle, each semiconductor wafer of the plurality of semiconductor wafers further comprising silicon;
prior to transitioning the plurality of semiconductor wafers through the flux and a solder bath, pre-heating respective semiconductor wafers of the plurality of semiconductor wafers to a temperature that is twenty to thirty degrees Celsius below a melting point of the liquid solder to minimize breakage of the respective semiconductor wafers of the plurality of semiconductor wafers;
transitioning the plurality of semiconductor wafers through the flux to apply the flux to an underbump metallurgy of respective semiconductor wafers of the plurality of semiconductor wafers;
transitioning the plurality of semiconductor wafers into the solder bath;
placing the plurality of semiconductor wafers into the receptacle to coat the underbump metallurgy with the liquid solder; and
removing the plurality of semiconductor wafers from the receptacle to allow the liquid solder coated on the underbump metallurgy to solidify and form a solder bump on the underbump metallurgy of the plurality of semiconductor wafers.

2. The process as claimed in claim 1 , further comprising:
after removing the plurality of semiconductor wafers from the receptacle, removing the flux from the plurality of semiconductor wafers.

3. The process as claimed in claim 1 , wherein the underbump metallurgy is photodefined and is formed of one of: copper, nickel, gold, and electroless nickel immersion gold.

4. The process as claimed in claim 1 , wherein the flux is configured for inhibiting oxidation on a surface of the respective semiconductor wafers of the plurality of semiconductor wafers, the flux being one of: a water-soluble flux, a no-clean flux, and a rosin flux.

5. The process as claimed in claim 1 , wherein the solder bump has a height ranging from 1 micrometer to 100 micrometers.

6. The process as claimed in claim 1 , wherein the solder bump has a height ranging from 1 micrometer to 50 micrometers.

7. The process as claimed in claim 6 , wherein the liquid solder in the solder bath is at a temperature of at least 230 degrees Celsius.

8. The process as claimed in claim 1 , further comprising:
after removing the plurality of semiconductor wafers from the receptacle, applying a compressed gas stream to respective semiconductor wafers of the plurality of semiconductor wafers for controlling a height of the solder bump formed on the underbump metallurgy.

9. A process comprising:
pre-heating a plurality of silicon wafers to a temperature of one hundred and fifty degrees Celsius prior to transitioning the plurality of silicon wafers through a flux to minimize breakage of the plurality of silicon wafers, the plurality of silicon wafers disposed within a holder configured to hold the plurality of silicon wafers in a vertically oriented configuration;
positioning the plurality of silicon wafers over a receptacle, the receptacle containing liquid solder, wherein the flux is disposed over the receptacle;
transitioning the plurality of silicon wafers through the flux to apply the flux to an underbump metallurgy of the plurality of silicon wafers, the plurality of silicon wafers transitioned through the flux at an angle of ninety degrees (90°) relative to a surface of the flux, the flux being one of: a liquid, a foam, or a paste;
transitioning the plurality of silicon wafers through the flux into the receptacle to coat the underbump metallurgy with the liquid solder;
removing the plurality of silicon wafers from the receptacle to allow the liquid solder coated on the underbump metallurgy to solidify and form a solder bump on the underbump metallurgy; and
removing the flux from the plurality of silicon wafers.

10. The process as claimed in claim 9 , wherein the flux is configured for inhibiting oxidation on a surface of the plurality of silicon wafers, the flux being one of: a water-soluble flux, a no-clean flux, and a rosin flux.

11. The process as claimed in claim 9 , further comprising:
after removing the plurality of silicon wafers from a solder bath, applying a compressed gas stream to the plurality of silicon wafers for controlling a height of the solder bump formed on the underbump metallurgy, the compressed gas stream being one of: a compressed air stream and a compressed nitrogen stream.

12. The process as claimed in claim 9 , wherein the solder bump has a height ranging from 1 micrometer to 100 micrometers.

13. The process as claimed in claim 12 , wherein the solder bump has a height of 40 micrometers.

14. The process as claimed in claim 9 , further comprising:
dicing respective silicon wafers of the plurality of silicon wafers to form a plurality of integrated circuit devices.

15. The process as claimed in claim 9 , wherein the underbump metallurgy is photodefined and is formed of one of: copper, nickel, gold, and electroless nickel immersion gold.

Assignees

• Maxim Integrated Products

Inventors

• Thambidurai Karthik
• Khandekar Viren
• Zhou Tiao

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/01971

  Cleaning, e.g. oxide removal · CPC title

• H10W72/01271

  Cleaning, e.g. oxide removal or de-smearing · CPC title

• H10W72/01251

  Changing the shapes of bumps · CPC title

• H10W72/01233

  in liquid form, e.g. spin coating, spray coating or immersion coating · CPC title