Method of manufacturing semiconductor device and substrate processing method
US-9837261-B2 · Dec 5, 2017 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L21/02172 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 381 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 23 |
| 2016 | 28 |
| 2017 | 34 |
| 2018 | 38 |
| 2019 | 44 |
| 2020 | 49 |
| 2021 | 36 |
| 2022 | 39 |
| 2023 | 43 |
| 2024 | 21 |
| 2025 | 19 |
| 2026 | 7 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium
US-9831083-B2 · Nov 28, 2017 · US
Method for producing metal oxide film and method for producing transistor
US-9799510-B2 · Oct 24, 2017 · US
Semiconductor Element and Fabrication Method Thereof
US-2017263819-A1 · Sep 14, 2017 · US
III-V semiconductor device with interfacial layer
US-9691872-B2 · Jun 27, 2017 · US
Methods for Improving Wafer Planarity and Bonded Wafer Assemblies Made from the Methods
US-2017178891-A1 · Jun 22, 2017 · US
Semiconductor device including h-BN insulating layer and its manufacturing method
US-9607824-B2 · Mar 28, 2017 · US
Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording medium
US-9558937-B2 · Jan 31, 2017 · US
Deposition of titanium nanolaminates for use in integrated circuit fabrication
US-9540729-B1 · Jan 10, 2017 · US
Method of fabricating semiconductor device
US-9530696-B1 · Dec 27, 2016 · US
Method of Manufacturing Semiconductor Device and Substrate Processing Method
US-2016365243-A1 · Dec 15, 2016 · US
Method of manufacturing device substrate and display device manufactured using the same
US-9500890-B2 · Nov 22, 2016 · US
Plasma assisted atomic layer deposition of multi-layer films for patterning applications
US-2016336178-A1 · Nov 17, 2016 · US
Method for patterning mesoporous inorganic oxide film, and electric device including mesoporous inorganic oxide film patterned by the same
US-2016315006-A1 · Oct 27, 2016 · US
Method of manufacturing semiconductor device and substrate processing apparatus
US-9472398-B2 · Oct 18, 2016 · US
Method of manufacturing semiconductor device, substrate processing apparatus, and semiconductor device
US-9466477-B2 · Oct 11, 2016 · US
Replacement metal gate dielectric cap
US-2016293731-A1 · Oct 6, 2016 · US
Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium
US-2016233085-A1 · Aug 11, 2016 · US
Low-temperature fabrication of nanomaterial-derived metal composite thin films
US-9412852-B2 · Aug 9, 2016 · US
Wet chemistry processes for fabricating a semiconductor device with increased channel mobility
US-9396946-B2 · Jul 19, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L21/02172?
- CPC H01L21/02172 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L21/02172 (Electricity)?
- Our database includes 381 publications tagged with this CPC code.
- Is patent activity under CPC H01L21/02172 growing?
- Publication counts under this code: 21 in 2024 vs 19 in 2025 (latest complete years).