Aluminum alloy magnetic disk substrate and method for producing same
US-2019390304-A1 · Dec 26, 2019 · US
Pretreatment of the material to be coated
Pretreatment of the material to be coated · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C18/18 |
| Official title | Pretreatment of the material to be coated |
| Display label | Pretreatment of the material to be coated |
| Total patents | 122 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 12 |
| 2016 | 16 |
| 2017 | 7 |
| 2018 | 14 |
| 2019 | 20 |
| 2020 | 11 |
| 2021 | 10 |
| 2022 | 9 |
| 2023 | 9 |
| 2024 | 10 |
| 2025 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Plating method, plating apparatus and recording medium
US-2019267242-A1 · Aug 29, 2019 · US
Plating method, plating apparatus and recording medium
US-2019256980-A1 · Aug 22, 2019 · US
Semiconductor device and method for manufacturing semiconductor device
US-2019244819-A1 · Aug 8, 2019 · US
Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US-2019106793-A1 · Apr 11, 2019 · US
Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US-2019106792-A1 · Apr 11, 2019 · US
Process for manufacturing battery components
US-10256498-B2 · Apr 9, 2019 · US
A logo on a device
US-2019091784-A1 · Mar 28, 2019 · US
Method for producing wiring structure
US-2019080912-A1 · Mar 14, 2019 · US
Plating method
US-2019017173-A1 · Jan 17, 2019 · US
Method for metalizing polymer substrate and polymer article prepared thereof
US-10179949-B2 · Jan 15, 2019 · US
Film having plated-layer precursor layer, film having patterned plated layer, electroconductive film, and touch panel
US-2018371618-A1 · Dec 27, 2018 · US
Method for metalizing polymer substrate and polymer article prepared thereof
US-10161045-B2 · Dec 25, 2018 · US
Method for metalizing polymer substrate and polymer article prepared thereof
US-10138557-B2 · Nov 27, 2018 · US
Plating method, plating system and storage medium
US-10030308-B2 · Jul 24, 2018 · US
Method for electroless plating
US-2018179634-A1 · Jun 28, 2018 · US
Method for manufacturing wiring pattern, method for manufacturing conductive film, and method for manufacturing transistor
US-2018171482-A1 · Jun 21, 2018 · US
Inkjet printing of conductive carbon nanotubes
US-9984785-B2 · May 29, 2018 · US
Adhesion promoting agents for metallization of substrate surfaces
US-9920432-B2 · Mar 20, 2018 · US
Method of manufacturing conductive laminate, conductive laminate, plated layer precursor layer-attached substrate, plated layer-attached substrate, and touch sensor
US-2018057943-A1 · Mar 1, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C18/18?
- CPC C23C18/18 is the Cooperative Patent Classification code for “Pretreatment of the material to be coated.”
- How many patents are filed under CPC C23C18/18 (Pretreatment of the material to be coated)?
- Our database includes 122 publications tagged with this CPC code.
- Is patent activity under CPC C23C18/18 growing?
- Publication counts under this code: 10 in 2024 vs 4 in 2025 (latest complete years).