Method for metalizing polymer substrate and polymer article prepared thereof

US10179949B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10179949-B2
Application numberUS-201615217730-A
CountryUS
Kind codeB2
Filing dateJul 22, 2016
Priority dateJan 27, 2014
Publication dateJan 15, 2019
Grant dateJan 15, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for metalizing a polymer substrate and a polymer article prepared thereof. First, a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. Then, a surface of the polymer substrate is irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. The surface of the polymer substrate is then subjected to chemical plating.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for metalizing a polymer substrate, comprising: providing a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer, the base polymer comprising a polymer, wherein the at least one metal compound has a formula selected from one of the following formulas (Cu a M 1 1-a ) 3 (PO 4 ) 2 (I), (Cu b M 2 1-b ) 2 (OH)PO 4 (II), and (Cu c M 3 1-c ) 2 P 2 O 7 (III), where M 1 comprises at least one element selected from group IIA of periodic table of elements, 0<a≤1; M 2 comprises at least one element selected from group IIA of periodic table of elements, 0<b<1; and M 3 comprises at least one element selected from group IIA of periodic table of elements, 0<c≤1; irradiating a surface of the polymer substrate with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°; and performing chemical plating on the surface of the polymer substrate. 2. The method according to claim 1 , wherein the polymer substrate is provided by molding a mixture of the base polymer and the at least one metal compound. 3. The method according to claim 1 , wherein based on the total weight of the polymer substrate, the content of the at least one metal compound is about 0.1 wt % to about 30 wt %. 4. The method according to claim 1 , wherein the at least one metal compound comprises at least one selected from a group consisting of Cu 2.7 Mg 0.3 (PO 4 ) 2 , Cu 1.5 Mg 1.5 (PO 4 ) 2 , Cu 1.5 Ba 0.75 Sr 0.75 (PO 4 ) 2 , Cu 0.15 Mg 2.85 (PO 4 ) 2 , Cu 1.5 Ca 1.5 (PO 4 ) 2 , Cu 0.15 Ca 2.85 (PO 4 ) 2 , Cu 2 Ba(PO 4 ) 2 , CuSr 2 (PO 4 ) 2 , Cu 0.4 Sr 2.6 (PO 4 ) 2 , Cu 2 P 2 O 7 , and Cu 3 (PO 4 ) 2 . 5. The method according to claim 1 , wherein the irradiating comprises irradiating the surface of the polymer substrate with an energy beam such that the water contact angle of the surface of the polymer substrate is at least 130°. 6. The method according to claim 5 , wherein the irradiating comprises irradiating the surface of the polymer substrate with an energy beam such that the water contact angle of the surface of the polymer substrate is about 130° to about 160°. 7. The method according to claim 1 , wherein the energy beam comprises at least one of a laser, an electron beam, and an ion beam. 8. The method according to claim 7 , wherein the laser has a wavelength of about 157 nm to about 10.6 μm. 9. The method according to claim 7 , wherein the laser has a power of about 10 W to about 20 W. 10. The method according to claim 7 , wherein the laser has a scanning speed of about 500 mm/s to about 8000 mm/s. 11. The method according to claim 1 , wherein based on the total weight of the base polymer, the content of the polymer is at least 50 wt %. 12. The method according to claim 1 , further comprising cleaning the surface of the polymer substrate before chemical plating. 13. The method according to claim 1 , wherein the polymer comprises a polyester. 14. The method according to claim 1 , wherein the polymer comprises a polyamide. 15. The method according to claim 1 , wherein the polymer comprises an ester group in a backbone. 16. The method according to claim 1 , wherein the polymer comprises an amide group in a backbone. 17. The method according to claim 1 , wherein the polymer comprises an ester and amide group in a backbone. 18. The method according to claim 1 , wherein the at least one metal compound has the formula (Cu a M 1 1-a ) 3 (PO 4 ) 2 (I), and M 1 comprises at least one element selected from Mg, Ca, Ba, and Sr. 19. The method according to claim 1 , wherein the at least one metal compound is Cu 2 P 2 O 7 .

Assignees

Inventors

Classifications

  • using reducing agents · CPC title

  • Organic substrates, e.g. resin, plastic · CPC title

  • Oxides; Hydroxides {(graphene oxides C08K3/042)} · CPC title

  • of iron · CPC title

  • Pretreatment of the material to be coated · CPC title

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What does patent US10179949B2 cover?
A method for metalizing a polymer substrate and a polymer article prepared thereof. First, a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. Then, a surface of the polymer substrate is irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. The surface of the polym…
Who is the assignee on this patent?
Byd Co Ltd
What technology area does this patent fall under?
Primary CPC classification C23C18/1608. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jan 15 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).