Film having plated-layer precursor layer, film having patterned plated layer, electroconductive film, and touch panel

Patent metadata

Field	Value
Publication number	US-2018371618-A1
Application number	US-201816115886-A
Country	US
Kind code	A1
Filing date	Aug 29, 2018
Priority date	Mar 11, 2016
Publication date	Dec 27, 2018
Grant date	—

Abstract

The film having a plated-layer precursor layer of the present invention is a film having a plated-layer precursor layer including a substrate, and an undercoat and a plated-layer precursor layer disposed on the substrate in this order from the substrate side, in which the undercoat has a hardness on the surface thereof of 10 N/mm2 or less and a friction coefficient with release paper of 5 or less.

First claim

What is claimed is:

1 . A film having a plated-layer precursor layer, comprising:
a substrate; an undercoat disposed on the substrate; and a plated-layer precursor layer disposed on the undercoat, wherein the undercoat has a hardness on the surface thereof of 10 N/mm 2 or less and a friction coefficient with release paper of 5 or less.

2 . The film having a plated-layer precursor layer according to claim 1 , wherein the plated-layer precursor layer contains a polymerization initiator and Compound X or Composition Y below.
Compound X: a compound having a functional group capable of interacting with a plating catalyst or a precursor thereof, and a polymerizable group Composition Y: a composition containing a compound having a functional group capable of interacting with a plating catalyst or a precursor thereof, and a compound having a polymerizable group

3 . A film having a patterned plated layer, comprising:
a substrate; an undercoat disposed on the substrate; and a patterned plated layer disposed on the undercoat, wherein the undercoat has a hardness on the surface thereof of 10 N/mm 2 or less and a friction coefficient with release paper of 5 or less.

4 . An electroconductive film comprising:
the film having a patterned plated layer according to claim 3 ; and a metal layer disposed on the patterned plated layer in the film having a patterned plated layer.

5 . An electroconductive film comprising:
the film having a patterned plated layer according to claim 3 , and a metal layer disposed on the patterned plated layer in the film having a patterned plated layer, wherein the metal layer is formed by an electroless plating treatment.

6 . A touch panel comprising:
the electroconductive film according to claim 4 .

7 . A touch panel comprising:
the electroconductive film according to claim 5 .

Assignees

• Fujifilm Corp

Inventors

• Ichiki Takahiko
• Tsukamoto Naoki
• Senga Takeshi
• Kasahara Takehiro
• Terao Yuko
• Kanayama Shuuji

Classifications

• G06F3/044

  by capacitive means · CPC title

• C23C18/18 Primary

  Pretreatment of the material to be coated · CPC title

• H05K2203/072

  Electroless plating, e.g. finish plating or initial plating · CPC title

• H05K1/0296

  Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18) · CPC title

• C23C18/31

  Coating with metals · CPC title