Method for metalizing polymer substrate and polymer article prepared thereof

Patent metadata

Field	Value
Publication number	US-10161045-B2
Application number	US-201615217717-A
Country	US
Kind code	B2
Filing date	Jul 22, 2016
Priority date	Jan 27, 2014
Publication date	Dec 25, 2018
Grant date	Dec 25, 2018

Abstract

A method for metalizing a polymer substrate and a polymer article prepared by the method are provided. First, a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. Then, a surface of the polymer substrate is irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. The surface of the polymer substrate is then subjected to chemical plating.

First claim

What is claimed is:

1. A method for metalizing a polymer substrate, comprising:
providing a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer, the base polymer comprising a polymer, and the at least one metal compound comprising a tin oxide doped with at least one doping element selected from vanadium, antimony, indium, and molybdenum;
irradiating a surface of the polymer substrate with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°; and
performing chemical plating on the surface of the polymer substrate.

2. The method according to claim 1 , wherein the polymer substrate is provided by molding a mixture of the base polymer and the at least one metal compound.

3. The method according to claim 1 , wherein based on the total weight of the polymer substrate, the content of the at least one metal compound is about 0.1 wt % to about 30 wt %.

4. The method according to claim 1 , wherein based on the total amount of the doped tin oxide, the amount of the doping element calculated by oxides is about 0.1 mol % to about 15 mol %.

5. The method according to claim 1 , wherein the irradiating comprises irradiating the surface of the polymer substrate with an energy beam such that the water contact angle of the surface of the polymer substrate is at least 130°.

6. The method according to claim 5 , wherein the irradiating comprises irradiating the surface of the polymer substrate with an energy beam such that the water contact angle of the surface of the polymer substrate is about 130° to about 160°.

7. The method according to claim 1 , wherein the energy beam comprises at least one of a laser, an electron beam, and an ion beam.

8. The method according to claim 7 , wherein the laser has a wavelength of about 157 nm to about 10.6 μm.

9. The method according to claim 7 , wherein the laser has a power of about 10 W to about 20 W.

10. The method according to claim 7 , wherein the laser has a scanning speed of about 500 mm/s to about 8000 mm/s.

11. The method according to claim 1 , wherein based on the total weight of the base polymer, the content of the polymer in a backbone is at least 50 wt %.

12. The method according to claim 1 , further comprising cleaning the surface of the polymer substrate before chemical plating.

13. The method according to claim 1 , wherein the polymer comprises a polyester and/or a polyamide.

14. The method according to claim 1 , wherein the polymer comprises an ester group in a backbone.

15. The method according to claim 1 , wherein the polymer comprises an amide group in a backbone.

16. The method according to claim 1 , wherein the polymer comprises an ester and amide group in a backbone.

17. A method for metalizing a polymer substrate, comprising:
providing a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer;
irradiating a surface of the polymer substrate with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°; and
performing chemical plating on the surface of the polymer substrate.

18. A method of claim 17 , wherein the at least one metal compound comprises a tin oxide doped with at least one doping element selected from vanadium, antimony, indium, and molybdenum and the base polymer comprises a polymer selected from an ester group, an amide group, and an ester and amide combination group.

19. A method of claim 17 , wherein the irradiating comprises irradiating the surface of the polymer substrate with an energy beam such that the water contact angle of the surface of the polymer substrate is about 130° to about 160°.

Assignees

• Byd Co Ltd

Inventors

• Gong Qing
• Zhou Wei
• Sun Yongliang

Classifications

• C23C18/54

  Contact plating, i.e. electroless electrochemical plating · CPC title

• C23C18/1651

  Two or more layers only obtained by electroless plating · CPC title

• C23C18/1608 Primary

  from pretreatment step, i.e. selective pre-treatment · CPC title

• C08K2003/2248

  of copper · CPC title

• C08K2003/2265

  of iron · CPC title