Plating method

Patent metadata

Field	Value
Publication number	US-2019017173-A1
Application number	US-201816024913-A
Country	US
Kind code	A1
Filing date	Jul 2, 2018
Priority date	Jul 14, 2017
Publication date	Jan 17, 2019
Grant date	—

Abstract

A plating method includes a first mask forming step of ejecting a UV-curable ink in the form of ink droplets from an inkjet head so as to have the ejected ink droplets land on a plating target object and to form a first plating mask on the plating target object, a catalyst applying step of applying a catalyst for deposition of plating material to the plating target object on which the first plating mask is formed, a second mask forming step of having the ink droplets land on the first plating mask so as to form a second plating mask on the first plating mask, a plating step of performing electroless plating to the plating target object subsequent to the second mask forming step, and a mask removing step of removing the first plating mask and the second plating mask from the plating target object subsequent to the plating step.

First claim

What is claimed is:

1 . A plating method, comprising:
a first mask forming step of ejecting a UV-curable ink in the form of ink droplets from an inkjet head so as to have the ejected ink droplets land on a plating target object and to form a first plating mask on the plating target object, the first plating mask being formed to prevent a catalyst for deposition of plating material from attaching to the plating target object; a catalyst applying step of applying the catalyst to the plating target object on which the first plating mask is formed; a second mask forming step of having the ink droplets land on the first plating mask so as to form a second plating mask on the first plating mask; a plating step of performing electroless plating to the plating target object subsequent to the second mask forming step; and a mask removing step of removing the first plating mask and the second plating mask from the plating target object subsequent to the plating step.

2 . A plating method, comprising:
a catalyst applying step of applying a catalyst for deposition of plating material to a plating target object; a mask forming step of ejecting a UV-curable ink in the form of ink droplets from an inkjet head so as to have the ejected ink droplets land on the plating target object and to form a plating mask on the plating target object; a plating step of performing plating to the plating target object subsequent to the mask forming step; and a mask removing step of removing the plating mask from the plating target object subsequent to the plating step.

3 . The plating method according to claim 1 , wherein the UV-curable ink is a UV-curable and solvent-soluble ink, the UV-curable and solvent-soluble ink comprising:
a UV-curable compound polymerizable by ultraviolet irradiation into a UV-curable resin; and a solvent-soluble material soluble in a solvent.

4 . The plating method according to claim 3 , wherein the UV-curable ink is a SUV-curable and solvent-soluble ink, the SUV-curable and solvent-soluble ink being the UV-curable and solvent-soluble ink further comprising an organic solvent having compatibility with the UV-curable compound.

5 . The plating method according to claim 1 , further comprising a surface roughening step of subjecting the plating target object to a surface roughening treatment prior to the catalyst applying step.

6 . The plating method according to claim 1 , wherein the catalyst applying step is a wet process, and the plating step is a wet process.

7 . The plating method according to claim 2 , wherein the UV-curable ink is a UV-curable and solvent-soluble ink, the UV-curable and solvent-soluble ink comprising:
a UV-curable compound polymerizable by ultraviolet irradiation into a UV-curable resin; and a solvent-soluble material soluble in a solvent.

8 . The plating method according to claim 7 , wherein the UV-curable ink is a SUV-curable and solvent-soluble ink, the SUV-curable and solvent-soluble ink being the UV-curable and solvent-soluble ink further comprising an organic solvent having compatibility with the UV-curable compound.

9 . The plating method according to claim 2 , further comprising a surface roughening step of subjecting the plating target object to a surface roughening treatment prior to the catalyst applying step.

10 . The plating method according to claim 2 , wherein the catalyst applying step is a wet process, and the plating step is a wet process.

Assignees

• Mimaki Eng Co Ltd

Inventors

• Ohnishi Masaru

Classifications

• C23C18/1605 Primary

  by masking · CPC title

• C23C18/18

  Pretreatment of the material to be coated · CPC title

• C23C18/1893

  with use of organic or inorganic compounds other than metals, first · CPC title

• C23C18/22

  Roughening, e.g. by etching · CPC title

• C23C18/2086

  with use of organic or inorganic compounds other than metals, first · CPC title