Stream flow sparger for electroless nickel plating

Patent metadata

Field	Value
Publication number	US-10422039-B2
Application number	US-201615161002-A
Country	US
Kind code	B2
Filing date	May 20, 2016
Priority date	May 20, 2016
Publication date	Sep 24, 2019
Grant date	Sep 24, 2019

Abstract

Systems and methods for nickel plating include providing a tank that retains a plating bath into which a substrate is submerged, and creating a horizontal flow of processing solution in the plating bath to assist in carrying contaminants out of the plating bath. A sparger box may be positioned in the tank to deliver the processing solution into the plating bath in a horizontal direction. The processing solution, which carries the contaminants, may exit the plating bath through a plate member that includes a plurality of orifices and is also positioned in the tank. The orifices may have a variable opening size to help control outflow of the processing solution.

First claim

What is claimed is:

1. A nickel plating system, comprising:
a tank configured to hold a bath of processing solution and a plurality of contaminants, the tank configured to receive at least one substrate to receive nickel plating;
a flow device comprising a laminar sparger box, the laminar sparger box having a plurality of spaced apart walls that define an internal chamber, the laminar sparger box placed within the tank and connectably mounted to sidewalls of the tank, the flow device operable to provide horizontal flow of the processing solution within the bath across a length of the bath from the laminar sparger box to an opposite end of the bath, the processing solution carrying at least some of the plurality of contaminants;
a filter device in flow communication with an outlet from the tank and configured to remove the contaminants from the processing solution.

2. The system of claim 1 , wherein the laminar sparger box is arranged vertically at one end of the tank and includes six walls.

3. The system of claim 2 , wherein the laminar sparger box includes an inlet opening configured to receive a flow of the processing solution into the internal chamber, and a plurality of outlet openings oriented facing horizontally in the tank.

4. The system of claim 2 , wherein the flow device includes a plate assembly oriented vertically in the tank and positioned at an opposite end of the tank from the sparger box, the plate assembly including a plurality of orifices.

5. The system of claim 4 , wherein the plate assembly includes an adjustable plate and a fixed plate, the adjustable plate being movable relative to the fixed plate to adjust flow rate through the plurality of orifices.

6. The system of claim 4 , wherein the plurality of orifices are adjustable-sized orifices.

7. The system of claim 4 , further comprising a weir mounted to a top end of the plate assembly, the weir providing even flow of the processing solution over a top end of the plate assembly.

8. An electroless nickel plating system, comprising:
a tank configured to hold a bath of processing solution and a plurality of contaminant, the tank configured to receive at least one substrate to receive nickel plating;
a flow device comprising:
a laminar sparger box positioned within and connectably mounted to sidewalls of the tank at a first end of the tank, the laminar sparger box having a plurality of spaced apart walls that define an internal chamber, the laminar sparger box configured to deliver a flow of processing solution horizontally into the bath to create horizontal flow in the bath from one end of the bath to an opposite end of the bath, the plurality of contaminants being carried by the flow of processing solution;
a plate assembly positioned at a second end of the tank, the plate assembly comprising a plurality of orifices receptive of the flow of processing solution and plurality of contaminants.

9. The system of claim 8 , wherein the plurality of orifices are arranged facing horizontally in the tank.

10. The system of claim 8 , wherein the sparger box is oriented vertically at one end of the tank and the plate assembly is oriented vertically at an opposite end of the sparger box.

11. The system of claim 8 , further comprising:
at least one filtering member arranged in flow communication with an outlet of the tank and operable to remove contaminants from the processing solution removed from the tank.

12. The system of claim 8 , wherein the plate member comprises:
a first plate having the plurality of orifices formed therein; and
a second plate that is movable relative to the first plate to control a functional opening size of the plurality of orifices.

13. The system of claim 8 , further comprising a weir positioned mounted to the plate member at a location vertically above the plurality of orifices.

14. The system of claim 8 , further comprising a carriage operable to move the at least one substrate into and out of the volume of processing fluid.

15. The system of claim 1 , wherein the laminar sparger box is connectably mounted to vertical sidewalls of the tank.

Assignees

• Seagate Technology Llc

Inventors

• Chin Boon Kuan
• Goel James Tephon Anak

Classifications

• C23C18/1628

  Specific elements or parts of the apparatus · CPC title

• C23C18/32 Primary

  Coating with nickel, cobalt or mixtures thereof with phosphorus or boron (C23C18/50 takes precedence) · CPC title

• C23C18/1619

  Apparatus for electroless plating · CPC title

• C23C18/1617

  Purification and regeneration of coating baths · CPC title

• C23C18/1669

  Agitation, e.g. air introduction · CPC title