Methods for edge trimming of semiconductor wafers and related apparatus

Patent metadata

Field	Value
Publication number	US-11538711-B2
Application number	US-201816042597-A
Country	US
Kind code	B2
Filing date	Jul 23, 2018
Priority date	Jul 23, 2018
Publication date	Dec 27, 2022
Grant date	Dec 27, 2022

Abstract

Methods and apparatus for pre-treating semiconductor wafers before edge trimming to enhance wafer edge quality prior to thinning the semiconductor wafers from an initial thickness, and increasing yield post-thinning of the pre-treated, edge trimmed semiconductor wafers.

First claim

What is claimed is:

1. A method, comprising:
forming modified zones in material of at least a partial thickness of a semiconductor wafer inwardly of and adjacent to a peripheral edge thereof; and
contacting the semiconductor wafer between the modified zones and the peripheral edge of the semiconductor wafer with a blade to remove material of the semiconductor wafer to substantially the at least a partial thickness.

2. The method of claim 1 , wherein forming modified zones in material of a semiconductor wafer comprises directing a focal point of a laser beam to one or more locations within the material while at least one of moving the laser beam about a vertical central axis of the semiconductor wafer or rotating the semiconductor wafer about the vertical central axis, to form circumferentially extending modified zones.

3. The method of claim 2 , wherein directing a focal point of a laser beam to one or more locations within the material comprises moving the focal point of the laser beam vertically within the semiconductor wafer.

4. The method of claim 2 , further comprising:
moving the laser beam about a vertical central axis of the semiconductor wafer, or rotating the semiconductor wafer about the vertical central axis, while directing a focal point of a laser beam to locations within the semiconductor wafer to form modified zones throughout substantially an entire thickness of the semiconductor wafer; and
removing material of an entire thickness of the semiconductor wafer radially outward of the modified zones with the blade while rotating the blade about a horizontal axis.

5. The method of claim 4 , further comprising mounting the semiconductor wafer to a carrier wafer prior to forming the modified zones.

6. The method of claim 1 , further comprising mounting the semiconductor wafer to a carrier wafer after forming the modified zones, and rotating the semiconductor wafer on the carrier wafer while contacting the semiconductor wafer with the blade while rotating the blade about a horizontal axis.

7. The method of claim 1 , wherein contacting the semiconductor wafer between the modified zones and the peripheral edge of the semiconductor wafer with a blade to remove material to substantially the at least a partial thickness further comprises removing substantially all semiconductor wafer material to the at least a partial thickness radially outward of the modified zones about at least a portion of a circumference of the semiconductor wafer.

8. The method of claim 1 , wherein contacting the semiconductor wafer between the modified zones and the peripheral edge of the semiconductor wafer with a blade to remove material to substantially the at least a partial thickness further comprises leaving a portion of material to the at least a partial thickness located radially outward of the modified zones about at least a portion of a circumference of the semiconductor wafer.

9. The method of claim 8 , further comprising, after material of the semiconductor wafer is removed to substantially the at least a partial thickness:
inverting the semiconductor wafer and mounting the semiconductor wafer to a carrier wafer; removing material of the semiconductor wafer from a surface thereof opposite the carrier wafer to a selected thickness with a grinding wheel; and
removing the portion of material of the semiconductor wafer to the at least a partial thickness radially outward of the modified zones responsive to contact thereof with the grinding wheel.

10. The method of claim 1 , further comprising, after material of the semiconductor wafer is removed to substantially the at least a partial thickness:
inverting the semiconductor wafer and mounting the semiconductor wafer to a carrier wafer; and removing material of the semiconductor wafer from a surface thereof opposite the carrier wafer to reach a selected wafer thickness.

11. The method of claim 1 , wherein contacting the semiconductor wafer between the modified zones and the peripheral edge of the semiconductor wafer with a blade comprises lowering a blade rotating about a horizontal axis to contact the semiconductor wafer during rotation of the semiconductor wafer about a central vertical axis, and lowering the blade to remove semiconductor material to substantially the at least a partial thickness.

12. A method, comprising:
forming a trench in semiconductor material of a wafer inwardly of and adjacent to a peripheral edge thereof; and
contacting the wafer between the trench and the peripheral edge of the wafer with a blade to remove semiconductor material to substantially a depth of the trench.

13. The method of claim 12 , wherein forming a trench in semiconductor material of a wafer comprises:
directing a focal point of a laser beam into a surface of the semiconductor material of the wafer to ablate semiconductor material while at least one of moving the laser beam about a central vertical axis of the wafer or rotating the wafer about the central vertical axis; and
optionally, moving the focal point of the laser beam downwardly into the semiconductor material of the wafer during the at least one of moving the laser beam or rotating the wafer about the central vertical axis to increase a depth of the trench.

14. The method of claim 13 , further comprising directing another laser beam into the trench after formation of the trench to render sidewalls of the trench more vertical.

15. The method of claim 13 , wherein ablating semiconductor material comprises melting and vaporizing semiconductor material to form altered zones of semiconductor material defining at least sidewalls of the trench, and further comprising removing semiconductor material between a peripheral edge of the wafer and a radially inward sidewall of the trench with the blade, leaving an altered zone defining the radially inward sidewall of the trench substantially intact.

16. The method of claim 12 , further comprising, after semiconductor material of the wafer is removed to substantially the depth of the trench:
inverting the wafer and mounting the wafer to a carrier wafer; and removing semiconductor material of the wafer from a surface thereof opposite the carrier wafer to leave a selected thickness of semiconductor material less than a depth of the trench.

17. The method of claim 12 , wherein contacting the wafer between the trench and the peripheral edge of the wafer with a blade comprises lowering a blade rotating about a horizontal axis to contact the wafer during rotation of the wafer about a vertical axis, and lowering the blade to remove semiconductor material to substantially the depth of the trench.

18. An apparatus, comprising:
a stage configured to receive one of a device wafer or a carrier wafer having a device wafer mounted thereon;
a laser tool located above the stage and oriented to direct a laser beam downwardly toward the stage, the laser tool configured for generating a laser beam and adjusting a focal point of the laser beam vertically;
wherein at least one of the stage is rotatable about a vertical axis or the laser tool is programmable to direct the laser beam in a path radially inwardly of a peripheral edge of a device wafer supported by the stage;
another stage configured to receive the one of a device wafer or a carrier wafer having a device wafer mounted thereon and rotatable about a vertical axis; and
a vertically movable blade rotatable about a horizontal axis along a radius from the vertical axis of the another stage and positionable over the device wafer or the device wafer mounted on the carrier wafer received on the

Assignees

• Micron Technology Inc

Inventors

• Lin Jing-Cheng

Classifications

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• H10P72/7402 Primary

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• B26D1/143

  rotating about a stationary axis (B26D1/20 - B26D1/24 take precedence) · CPC title

• B24D5/02 Primary

  Wheels in one piece · CPC title