Wafer edge trim blade with slots

Patent metadata

Field	Value
Publication number	US-9676114-B2
Application number	US-201213408327-A
Country	US
Kind code	B2
Filing date	Feb 29, 2012
Priority date	Feb 29, 2012
Publication date	Jun 13, 2017
Grant date	Jun 13, 2017

Abstract

A wafer edge trim blade includes a round blade body and at least one slot formed inward from an outside edge of the round blade body. The at least one slot is configured to remove debris generated during wafer edge trimming using the wafer edge trim blade.

First claim

What is claimed is:

1. A wafer edge trim blade, comprising:
a round blade body having an outer diameter and an inner diameter, wherein the inner diameter defines an opening, a thickness of the round blade body ranges from 1.5 millimeters (mm) to 2.5 mm, the outer diameter of the round blade body ranges from 47 mm to 53 mm, the inner diameter of the round blade body ranges from 39 mm to 41 mm, an entirety of the round blade body between the outer diameter and the inner diameter comprises diamond grit and has a substantially uniform thickness; and
a plurality of slots extending inward from an outermost surface of the round blade body, wherein each slot of the plurality of slots is provided in the round blade body at different distances from one another.

2. The wafer edge trim blade of claim 1 , wherein a number of the plurality of slots ranges from 4 to 32.

3. The wafer edge trim blade of claim 1 , wherein each slot of the plurality of slots has a slot width ranging from 0.5 mm to 3 mm.

4. The wafer edge trim blade of claim 1 , wherein each slot of the plurality of slots has a slot depth ranging from 1 mm to 3 mm.

5. The wafer edge trim blade of claim 1 , wherein a first largest width of a rounded portion a first slot of the plurality of slots is smaller than or equal to a second largest width of one first slot that is farthest away from a center of the round blade body.

6. The wafer edge trim blade of claim 1 , wherein an inward portion of a first slot of the plurality of slots is rounded.

7. The wafer edge trim blade of claim 6 , wherein the rounded inward portion has a length ranging from 0.5 times to 1.5 times of a slot width of the first slot.

8. The wafer edge trim blade of claim 1 , an entirety of the round blade body between the outer diameter and the inner diameter comprises diamond grit.

9. The wafer edge trim blade of claim 8 , wherein the diamond grit have a size ranging from 2 μm to 16 μm.

10. A method of trimming an edge of a wafer comprising:
rotating a wafer edge trim blade having at least one slot formed inward from an outside edge of the wafer edge trim blade, wherein the wafer edge trim blade comprises:
a thickness of the wafer edge trim blade ranges from 1.5 millimeters (mm) to 2.5 mm,
an outer diameter of the wafer edge trim blade ranges from 47 mm to 53 mm,
an inner diameter of the wafer edge trim blade ranges from 39 mm to 41 mm, wherein the inner diameter defines an opening, and
the at least one slot has a constant slot width, and an entirety of a body of the wafer edge trim blade between the outer diameter and the inner diameter comprises diamond grit, and a thickness of the body is substantially uniform;

moving the wafer edge trim blade toward a wafer;
trimming the edge of the wafer using the wafer edge trim blade; and
removing debris by pushing the debris with the at least one slot.

11. The method of claim 10 , further comprising fixing the wafer edge trim blade to a wafer edge trimming machine.

12. The method of claim 10 , further comprising loading the wafer into a work area for wafer edge trimming.

13. A wafer edge trim blade, comprising:
a round blade body, wherein the round blade body has a substantially uniform thickness, and the round blade body comprising:
an outer diameter, wherein the outer diameter of the round blade body ranges from 47 millimeters (mm) to 53 mm;
an inner diameter, wherein the inner diameter of the round blade body defines an opening, the inner diameter of the round blade body ranges from 39 mm to 41 mm; and
the substantially uniform thickness of the round blade body ranges from 1.5 mm to 2.5 mm;
a diamond grit containing portion extending across an entirety of the round blade body from the outer diameter to the inner diameter; and
multiple slots inward from the outer diameter of the round blade body and distributed at equal distances around the outer diameter, wherein at least one slot of the multiple slots has parallel sidewalls.

14. The wafer edge trim blade of claim 13 , wherein the diamond grit have a size ranging from 2 μm to 16 μm.

15. The wafer edge trim blade of claim 13 , wherein each of the multiple slots have an inward portion that is rounded.

16. The wafer edge trim blade of claim 15 , wherein the rounded inward portion has a length ranging from 0.5 times to 1.5 times of a slot width of the at least one slot.

17. The wafer edge trim blade of claim 13 , wherein a number of slots of the multiple slots ranges from 4 to 32.

18. The wafer edge trim blade of claim 13 , wherein the at least one slot of the multiple slots has a slot width ranging from 0.5 mm to 3 mm.

19. The wafer edge trim blade of claim 13 , wherein the at least one slot of the multiple slots has a slot depth ranging from 1 mm to 3 mm.

Assignees

• Kuo Chun-Ting
• Chen Kei-Wei
• Wang Ying-Lang
• Wei Kuo-Hsiu
• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Kuo Chun-Ting
• Chen Kei-Wei
• Wang Ying-Lang
• Wei Kuo-Hsiu

Classifications

• Y10T83/9372

  Rotatable type · CPC title

• Y10T83/0448

  With subsequent handling [i.e., of product] · CPC title

• B28D5/022

  by cutting with discs or wheels · CPC title

• B28D1/121

  Circular saw blades · CPC title

• B28D1/04

  with circular {or cylindrical} saw-blades or saw-discs (B28D1/10 takes precedence) · CPC title