Semiconductor-element manufacturing method and wafer mounting device

Patent metadata

Field	Value
Publication number	US-2016155656-A1
Application number	US-201314906286-A
Country	US
Kind code	A1
Filing date	Oct 15, 2013
Priority date	Oct 15, 2013
Publication date	Jun 2, 2016
Grant date	—

Abstract

According to the present invention, a semiconductor-element manufacturing method including the steps of cutting out a ring portion of a wafer with laser light to form a flat wafer, the ring portion being formed on a periphery of the wafer and thicker than a central portion of the wafer, the wafer having a first surface and a second surface opposite to the first surface, with the first surface of the wafer being held on a vacuum stage by suction, attaching the first surface to dicing tape after detaching the flat wafer from the vacuum stage with the second surface of the flat wafer being held by a vacuum end-effector by suction, and dicing the flat wafer attached to the dicing tape.

First claim

1 . A semiconductor-element manufacturing method comprising the steps of:
cutting out a ring portion of a wafer with laser light to form a flat wafer, the ring portion being formed on a periphery of the wafer and thicker than a central portion of the wafer, the wafer having a first surface and a second surface opposite to the first surface, with the first surface of the wafer being held on a vacuum stage by suction; attaching the first surface to dicing tape after detaching the flat wafer from the vacuum stage with the second surface of the flat wafer being held by a vacuum end-effector by suction; and dicing the flat wafer attached to the dicing tape.

2 . The semiconductor-element manufacturing method according to claim 1 , wherein in the cutting step, a YAG laser is used.

3 . The semiconductor-element manufacturing method according to claim 1 , wherein in the cutting step, the ring portion is cut out from the wafer after a water-soluble protective film is formed on the second surface.

4 . The semiconductor-element manufacturing method according to claim 1 , wherein in the cutting step, the ring portion is cut out from the wafer after a central portion of the second surface is covered with a rubber ring and a dustproof cover.

5 . The semiconductor-element manufacturing method according to claim 1 , wherein in the cutting step, the ring portion is cut out from the wafer while airflows from a central portion of the second surface to a peripheral portion thereof are being generated.

6 . The semiconductor-element manufacturing method according to claim 1 , wherein in the cutting step, water is jetted onto a portion irradiated with the laser light.

7 . The semiconductor-element manufacturing method according to claim 1 , wherein in the cutting step, the laser light is applied to a boundary between the central portion and the ring portion.

8 . A wafer mounting device comprising:
a cutting unit forming a flat wafer, the cutting unit comprising: a vacuum stage holding a first surface of a wafer by suction, the wafer having a ring portion formed on a periphery thereof and thicker than a central portion of the wafer, the wafer having a second surface opposite to the first surface; and a laser oscillator cutting out the ring portion from the wafer with laser light; an attaching unit having dicing tape provided therein; and a vacuum end-effector moving the flat wafer from the vacuum stage and attaching the flat wafer to the dicing tape while holding the second surface of the flat wafer by vacuum suction.

Assignees

• Mitsubishi Electric Corp

Inventors

• Matsumura Tamio

Classifications

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/742

  involving stretching of the auxiliary support post dicing · CPC title

• H10P72/0442

  Apparatus for placing on an insulating substrate, e.g. tape · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title