Methods for temporarily bonding a device wafer to a carrier wafer, and related assemblies

Patent metadata

Field	Value
Publication number	US-9716023-B2
Application number	US-201414332096-A
Country	US
Kind code	B2
Filing date	Jul 15, 2014
Priority date	Jul 15, 2014
Publication date	Jul 25, 2017
Grant date	Jul 25, 2017

Abstract

A method of bonding a device wafer to a carrier wafer includes disposing a first adhesive over a central portion of a carrier wafer, the first adhesive having a first glass transition temperature, disposing a second adhesive over a peripheral portion of the carrier wafer, the second adhesive having a second glass transition temperature greater than the first glass transition temperature, and bonding the first adhesive to an active front side of the device wafer and the second adhesive to a peripheral portion of the front side of the device wafer. Related assemblies may be used in such methods.

First claim

What is claimed is:

1. A method of bonding a device wafer to a carrier wafer, comprising:
disposing a first thermoplastic adhesive having a first glass transition temperature of less than or equal to about 200° C. over a central portion of a carrier wafer;
disposing a second thermoplastic adhesive having a second glass transition temperature of at least about fifteen degrees Celsius (15° C.) greater and less than about twenty-five degrees Celsius (25° C.) greater than the first glass transition temperature over a peripheral portion of the carrier wafer; and
bonding the first thermoplastic adhesive to at least a portion of a front side of a device wafer and the second thermoplastic adhesive to a peripheral portion of the front side of the device wafer.

2. The method of claim 1 , wherein disposing the first thermoplastic adhesive over the central portion of the carrier wafer comprises disposing the first thermoplastic adhesive over substantially the entire surface of the carrier wafer and at least partially removing the first thermoplastic adhesive from the peripheral portion of the carrier wafer.

3. The method of claim 2 , wherein at least partially removing the first thermoplastic adhesive from the peripheral portion of the carrier wafer comprises removing the first thermoplastic adhesive from an area extending from a periphery of the carrier wafer up to about twenty (20) mm radially inward.

4. The method of claim 2 , wherein at least partially removing the first thermoplastic adhesive from the peripheral portion of the carrier wafer comprises applying a solvent to the first thermoplastic adhesive disposed over the peripheral portion of the carrier wafer.

5. The method of claim 2 , wherein disposing the second thermoplastic adhesive over the peripheral portion of the carrier wafer comprises disposing the second thermoplastic adhesive over the area of the peripheral portion of the carrier wafer from which the first thermoplastic adhesive is removed.

6. The method of claim 5 , further comprising removing an outer peripheral portion of the second thermoplastic adhesive with a solvent.

7. The method of claim 1 , wherein disposing the first thermoplastic adhesive over the central portion of the carrier wafer and disposing the second thermoplastic adhesive over the peripheral portion of the carrier wafer comprise disposing the second thermoplastic adhesive over the peripheral portion of the carrier wafer and subsequently disposing the first thermoplastic adhesive over the central portion of the carrier wafer and at least a portion of the second thermoplastic adhesive.

8. The method of claim 7 , further comprising removing a portion of the second thermoplastic adhesive and the first thermoplastic adhesive from an outermost area of the peripheral portion of the carrier wafer.

9. The method of claim 1 , wherein bonding the first thermoplastic adhesive to the at least a portion of the front side of the device wafer and the second thermoplastic adhesive to the peripheral portion of the front side of the device wafer comprises heating the first thermoplastic adhesive and the second thermoplastic adhesive and pressing the front side of the device wafer onto the heated first adhesive and second adhesive.

10. The method of claim 9 , wherein heating the first thermoplastic adhesive and the second thermoplastic adhesive comprises heating the first thermoplastic adhesive and the second thermoplastic adhesive to at least about one hundred fifty degrees Celsius (150° C.).

11. The method of claim 1 , further comprising reducing a thickness of the device wafer by removing material from a backside of the device wafer.

12. The method of claim 1 , wherein bonding the second thermoplastic adhesive to the peripheral portion of the front side of the device wafer further comprises bonding the second adhesive to a lateral side surface of the device wafer adjacent to and surrounding the active surface.

13. A method of bonding a device wafer to a carrier wafer, comprising:
disposing a first adhesive having a first glass transition temperature over substantially an entire surface of a carrier wafer and removing the first adhesive from an area extending from a periphery of the carrier wafer more than about twenty (20) mm radially inward to leave the first adhesive over a central portion of the carrier wafer;
disposing a second adhesive having a second glass transition temperature greater than the first glass transition temperature over a peripheral portion of the carrier wafer; and
bonding the first adhesive to a central portion of a front side of a device wafer and the second adhesive to a peripheral portion of the front side of the device wafer.

14. A method of bonding a device wafer to a carrier wafer, comprising:
disposing a first adhesive having a first glass transition temperature over a central portion of a carrier wafer;
disposing a second adhesive having a second glass transition temperature greater than the first glass transition temperature over a peripheral portion of the carrier wafer, comprising disposing the second adhesive over the peripheral portion of the carrier wafer to leave a gap between the second adhesive and the first adhesive; and
bonding the first adhesive to at least a portion of a front side of a device wafer and the second adhesive to a peripheral portion of the front side of the device wafer.

15. A method of bonding a device wafer to a carrier wafer, comprising:
disposing a first adhesive having a first glass transition temperature over a central portion of a carrier wafer;
disposing a second adhesive having a second glass transition temperature greater than the first glass transition temperature over a peripheral portion of the carrier wafer; and
bonding the first adhesive to at least a portion of a front side of a device wafer and the second adhesive to a peripheral portion of the front side of the device wafer, comprising:
heating the first adhesive and the second adhesive; and
pressing the front side of the device wafer onto the heated first adhesive and second adhesive, comprising pressing the device wafer and the carrier wafer together with between about eight (8) kN and thirty (30) kN of force.

16. A method of bonding a device wafer to a carrier wafer, comprising:
disposing a first adhesive with a first glass transition temperature over a carrier wafer;
removing the first adhesive from a peripheral portion of the carrier wafer;
disposing a second adhesive with a second glass transition temperature higher than the first glass transition temperature over the peripheral portion of the carrier wafer and out of contact with the first adhesive; and
bonding the first adhesive to a central portion of a device wafer and the second adhesive to a peripheral portion of the device wafer.

17. A method of bonding a device wafer to a carrier wafer, comprising:
disposing a first adhesive having a first glass transition temperature over a portion of a carrier wafer;
disposing a second adhesive having a second glass transition temperature over a portion of the carrier wafer; and
bonding the first adhesive to a central portion of an active surface of a device wafer and bonding the second adhesive to a lateral side surface of the device wafer adjacent to and surrounding the active surface of the device wafer and to a peripheral portion of the active surface of the device wafer extending radially inward from the lateral side surface of the device wafer.

18. The method of claim 17 , wherein bonding the second adhesive to the peripheral portion of the active su

Assignees

• Micron Technology Inc

Inventors

• Farrens Sharon N
• Bowen Neal
• Bayless Andrew M

Classifications

• H10P72/7422

  used to protect an active side of a device or wafer · CPC title

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/7412

  the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/74 Primary

  using temporarily an auxiliary support · CPC title