Method for manufacturing a cover for an electronic package and electronic package comprising a cover

Patent metadata

Field	Value
Publication number	US-10833208-B2
Application number	US-201916581978-A
Country	US
Kind code	B2
Filing date	Sep 25, 2019
Priority date	Jan 3, 2017
Publication date	Nov 10, 2020
Grant date	Nov 10, 2020

Abstract

A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.

First claim

The invention claimed is:

1. An electronic package, comprising:
a carrier substrate;
a first electronic chip having a back face fixed to a front mounting face of the carrier substrate and having a front face including at least one integrated optical element; and
an encapsulation cover over said first electronic chip, said encapsulation cover comprising a substrate that is overmolded around a first optical insert configured to allow light radiation to pass from one side of the overmolded substrate to another side of the overmolded substrate, wherein said overmolded substrate is provided with a ring-shaped rib surrounding said first electronic chip at a distance,
wherein said encapsulation cover is fixed at least above said mounting face of said carrier substrate in a position such that the encapsulation cover extends above the first electronic chip, the encapsulation cover being fixed above said carrier substrate by way of an adhesive mounting said ring-shaped rib.

2. The package according to claim 1 , wherein the adhesive is an annular bead of adhesive interposed between a peripheral zone of the carrier substrate and a peripheral zone of said overmolded substrate.

3. The package according to claim 1 , wherein the adhesive is an annular strip of adhesive interposed between a peripheral zone of the carrier substrate and a peripheral zone of said overmolded substrate.

4. The package according to claim 1 , wherein said overmolded substrate is further provided with an intermediate rib delimiting two chambers, and wherein the adhesive is a strip of adhesive mounting said intermediate rib of the encapsulation cover above said carrier substrate.

5. The package according to claim 4 , wherein said first electronic chip is located within one of said two chambers and further comprising a second electronic chip located within another of said two chambers.

6. The package according to claim 4 , wherein said first electronic chip extends through a notch of said intermediate rib, and wherein the adhesive fixes the intermediate rib on said first electronic chip.

7. The package according to claim 6 , wherein said first electronic chip includes a first optical sensor within one of said two chambers and a second optical sensor within another of said two chambers.

8. The package according to claim 7 , further including a second electronic chip provided with an optical transmitter within said another of said two chambers.

9. The package according to claim 4 , wherein said first optical insert is located on one side of said intermediate rib and further including a second optical insert located on another side of said intermediate rib.

10. The package according to claim 1 , wherein opposite faces of the first optical insert are coplanar with one side and another side of said overmolded substrate.

11. The package according to claim 1 , wherein said overmolded substrate is made of an opaque material.

12. The package according to claim 1 , wherein an outer surface of the ring-shaped rib is a cut surface.

Assignees

• St Microelectronics Grenoble 2

Inventors

• Saxod Karine
• Mas Alexandre
• Saugier Eric
• Lobascio Gaetan
• Besancon Benoit

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10H20/8506

  Containers · CPC title

• H10F77/413

  directly associated or integrated with the devices, e.g. back reflectors (directly associated or integrated with photovoltaic cells H10F77/42) · CPC title

• H10F77/407

  indirectly associated with the devices · CPC title

• H10F77/93

  Interconnections · CPC title