Method for manufacturing a cover for an electronic package and electronic package comprising a cover
US-11688815-B2 · Jun 27, 2023 · US
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Besancon Benoit patents
Besancon Benoit is listed as an inventor on 20 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Besancon Benoit |
| Total patents | 20 |
| First publication | May 4, 2017 |
| Latest publication | Jun 27, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for manufacturing an encapsulation cover for an electronic package and electronic package comprising a cover
US-11114312-B2 · Sep 7, 2021 · US
Method for manufacturing a cover for an electronic package and electronic package comprising a cover
US-2021043780-A1 · Feb 11, 2021 · US
Method for manufacturing a cover for an electronic package and electronic package comprising a cover
US-10833208-B2 · Nov 10, 2020 · US
Method for manufacturing a cover for an electronic package and electronic package comprising a cover
US-2020020815-A1 · Jan 16, 2020 · US
Method for making a cover for an electronic package and electronic package comprising a cover
US-10483408-B2 · Nov 19, 2019 · US
Method for manufacturing an encapsulation cover for an electronic package and electronic package comprising a cover
US-2019252212-A1 · Aug 15, 2019 · US
Method for manufacturing an encapsulation cover for an electronic package and electronic package comprising a cover
US-10325784-B2 · Jun 18, 2019 · US
Electronic device comprising an encapsulating block locally of smaller thickness
US-10186466-B2 · Jan 22, 2019 · US
Method for manufacturing a cover for an electronic package and electronic package comprising a cover
US-2018190511-A1 · Jul 5, 2018 · US
Recent patents
Latest publications not already listed above.
Method for making a cover for an electronic package and electronic package comprising a cover
US-2018190838-A1 · Jul 5, 2018 · US
Method for manufacturing an encapsulation cover for an electronic package and electronic package comprising a cover
US-2018190512-A1 · Jul 5, 2018 · US
Electronic device comprising an encapsulating block locally of smaller thickness
US-2018033710-A1 · Feb 1, 2018 · US
Method for collective (wafer-scale) fabrication of electronic devices and electronic device
US-9870947-B1 · Jan 16, 2018 · US
Method for collective (wafer-scale) fabrication of electronic devices and electronic device
US-2018005889-A1 · Jan 4, 2018 · US
Package including stacked die and passive component
US-2017345805-A1 · Nov 30, 2017 · US
Electronic device comprising an encapsulating block locally of smaller thickness
US-9818664-B2 · Nov 14, 2017 · US
Electronic device with electronic chips and heat sink
US-2017317059-A1 · Nov 2, 2017 · US
Electronic device comprising an encapsulating block locally of smaller thickness
US-2017250119-A1 · Aug 31, 2017 · US
Electronic device equipped with a heat sink
US-2017127567-A1 · May 4, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| St Microelectronics Grenoble 2 | 12 |
| Stmicroelectronics (Grenoble 2) Sas | 8 |
| St Microelectronics Sa | 2 |
| Commissariat Energie Atomique | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/884 | 12 |
| H10W72/0198 | 11 |
| H10W90/724 | 9 |
| H10W74/016 | 9 |
| H01L21/565 | 9 |