Reading circuit for a pixel array
US-12081888-B2 · Sep 3, 2024 · US
This page is not indexed by search engines while we improve data quality.
Mas Alexandre patents
Mas Alexandre is listed as an inventor on 14 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Mas Alexandre |
| Total patents | 14 |
| First publication | Jul 5, 2018 |
| Latest publication | Sep 3, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for manufacturing a cover for an electronic package and electronic package comprising a cover
US-11688815-B2 · Jun 27, 2023 · US
Reading circuit for a pixel array
US-2022368847-A1 · Nov 17, 2022 · US
Method for manufacturing an encapsulation cover for an electronic package and electronic package comprising a cover
US-11114312-B2 · Sep 7, 2021 · US
Method for manufacturing a cover for an electronic package and electronic package comprising a cover
US-2021043780-A1 · Feb 11, 2021 · US
Method for manufacturing a cover for an electronic package and electronic package comprising a cover
US-10833208-B2 · Nov 10, 2020 · US
Method for manufacturing a cover for an electronic package and electronic package comprising a cover
US-2020020815-A1 · Jan 16, 2020 · US
Method for making a cover for an electronic package and electronic package comprising a cover
US-10483408-B2 · Nov 19, 2019 · US
Method for manufacturing an encapsulation cover for an electronic package and electronic package comprising a cover
US-2019252212-A1 · Aug 15, 2019 · US
Method for manufacturing an encapsulation cover for an electronic package and electronic package comprising a cover
US-10325784-B2 · Jun 18, 2019 · US
Recent patents
Latest publications not already listed above.
Method for manufacturing a cover for an electronic package and electronic package comprising a cover
US-2018190511-A1 · Jul 5, 2018 · US
Method for making a cover for an electronic package and electronic package comprising a cover
US-2018190838-A1 · Jul 5, 2018 · US
Electronic device having a grooved chip
US-2018190562-A1 · Jul 5, 2018 · US
Method for manufacturing an encapsulation cover for an electronic package and electronic package comprising a cover
US-2018190512-A1 · Jul 5, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| St Microelectronics Grenoble 2 | 14 |
| St Microelectronics Tours Sas | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/884 | 11 |
| H10H20/8506 | 6 |
| H10F77/413 | 6 |
| H10F77/407 | 6 |
| H10F77/93 | 6 |