Method for manufacturing a cover for an electronic package and electronic package comprising a cover
US-11688815-B2 · Jun 27, 2023 · US
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Patent family 59031039
This patent family groups 6 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 59031039 |
| Family type | — |
| Earliest priority | Jan 3, 2017 |
| First filing country | US |
| Member publications | 6 |
| Countries | US |
| Representative publication | US11688815B2 — Method for manufacturing a cover for an electronic package and electronic package comprising a cover |
Representative publication
Best representative member for this family based on priority and filing country.
US11688815B2 — Method for manufacturing a cover for an electronic package and electronic package comprising a cover (published Jun 27, 2023)
Member publications
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US-10483408-B2 · Nov 19, 2019 · US
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US-2018190838-A1 · Jul 5, 2018 · US