Dual Compressive Connector
US-2016359254-A1 · Dec 8, 2016 · US
Interconnections
Interconnections · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10F77/93 |
| Official title | {Interconnections} |
| Display label | Interconnections |
| Total patents | 624 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 46 |
| 2016 | 57 |
| 2017 | 55 |
| 2018 | 66 |
| 2019 | 58 |
| 2020 | 84 |
| 2021 | 63 |
| 2022 | 69 |
| 2023 | 48 |
| 2024 | 42 |
| 2025 | 32 |
| 2026 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Optical semiconductor device
US-9508662-B2 · Nov 29, 2016 · US
Electronic device comprising an optical sensor chip
US-9478677-B2 · Oct 25, 2016 · US
Method for producing optoelectronic semiconductor devices and optoelectronic semiconductor device
US-2016300825-A1 · Oct 13, 2016 · US
Optoelectronic Semiconductor Apparatus and Carrier Assembly
US-2016293587-A1 · Oct 6, 2016 · US
Solid image-pickup device with through hole passing through substrate
US-9455286-B2 · Sep 27, 2016 · US
Interconnect structure for CIS flip-chip bonding and methods for forming the same
US-9397137-B2 · Jul 19, 2016 · US
Optoelectronic semiconductor apparatus and carrier assembly
US-9397076-B2 · Jul 19, 2016 · US
Dual compressive connector
US-9391385-B2 · Jul 12, 2016 · US
Optical sensor device
US-2016190352-A1 · Jun 30, 2016 · US
Electronic device mounted on a substrate
US-2016172347-A1 · Jun 16, 2016 · US
Epoxy resin composition for optical semiconductor device, and lead frame for optical semiconductor device, encapsulation type optical semiconductor element unit and optical semiconductor device each obtainable by using the epoxy resin composition
US-2016111611-A1 · Apr 21, 2016 · US
Solid-state imaging device and method for manufacturing solid-state imaging device
US-9312296-B2 · Apr 12, 2016 · US
Device having at least one optoelectronic semiconductor component
US-2016005940-A1 · Jan 7, 2016 · US
Optoelectronic package
US-2015380895-A1 · Dec 31, 2015 · US
Diode-included connector, photovoltaic laminate and photovoltaic assembly using same
US-2015372638-A1 · Dec 24, 2015 · US
Electrical contact structure with a redistribution layer connected to a stud
US-9214579-B2 · Dec 15, 2015 · US
Electronic device comprising an optical sensor chip
US-2015357484-A1 · Dec 10, 2015 · US
Reflective contact layer system for an optoelectronic component and method for producing same
US-9196789-B2 · Nov 24, 2015 · US
Controlled-impedance out-of-substrate package structures employing electrical devices, and related assemblies, components, and methods
US-9179548-B2 · Nov 3, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10F77/93?
- CPC H10F77/93 is the Cooperative Patent Classification code for “Interconnections.”
- How many patents are filed under CPC H10F77/93 (Interconnections)?
- Our database includes 624 publications tagged with this CPC code.
- Is patent activity under CPC H10F77/93 growing?
- Publication counts under this code: 42 in 2024 vs 32 in 2025 (latest complete years).