Semiconductor device package and methods of formation
US-2025372540-A1 · Dec 4, 2025 · US
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Yang Tien-Chung patents
Yang Tien-Chung is listed as an inventor on 66 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Yang Tien-Chung |
| Total patents | 66 |
| First publication | Feb 7, 2017 |
| Latest publication | Dec 4, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Reduction of cracks in redistribution structure
US-2025364384-A1 · Nov 27, 2025 · US
Semiconductor device package and methods of formation
US-2025364441-A1 · Nov 27, 2025 · US
Semiconductor device package and methods of formation
US-2025364391-A1 · Nov 27, 2025 · US
Semiconductor device package and methods of formation
US-12482763-B2 · Nov 25, 2025 · US
Semiconductor packaging
US-2025357458-A1 · Nov 20, 2025 · US
Reduction of cracks in redistribution structure
US-12476178-B2 · Nov 18, 2025 · US
Fan-out package structures with cascaded openings in enhancement layer
US-12469807-B2 · Nov 11, 2025 · US
Semiconductor package and manufacturing method thereof
US-2025323177-A1 · Oct 16, 2025 · US
Chip package structure and method for forming the same
US-2025246567-A1 · Jul 31, 2025 · US
Recent patents
Latest publications not already listed above.
Semiconductor device with electromagnetic interference film and method of manufacture
US-12243833-B2 · Mar 4, 2025 · US
Device ID setting method and electronic device applying the device ID setting method
US-12237039-B2 · Feb 25, 2025 · US
Semiconductor device with electromagnetic interference film and method of manufacture
US-2024387401-A1 · Nov 21, 2024 · US
Semiconductor package with under-bump metallization providing improved package reliability
US-2024379571-A1 · Nov 14, 2024 · US
Method for identifying size of object, optical sensing apparatus and system
US-12019809-B2 · Jun 25, 2024 · US
Device id setting method and electronic device applying the device id setting method
US-2024153543-A1 · May 9, 2024 · US
Device ID setting method and electronic device applying the device ID setting method
US-11915780-B2 · Feb 27, 2024 · US
Reduction of cracks in redistribution structure
US-2024063099-A1 · Feb 22, 2024 · US
Integrated fan-out package and method of making same
US-2024047321-A1 · Feb 8, 2024 · US
Semiconductor device package and methods of formation
US-2024038649-A1 · Feb 1, 2024 · US
Semiconductor device package and methods of formation
US-2024038682-A1 · Feb 1, 2024 · US
Fan-out package structures with cascaded openings in enhancement layer
US-2024038701-A1 · Feb 1, 2024 · US
Semiconductor packaging
US-2023420438-A1 · Dec 28, 2023 · US
Semiconductor structure
US-11842983-B2 · Dec 12, 2023 · US
Method for identifying object, optical sensing apparatus and system
US-2023244319-A1 · Aug 3, 2023 · US
Method for identifying object, optical sensing apparatus and system
US-11662828-B2 · May 30, 2023 · US
Device id setting method and electronic device applying the device id setting method
US-2023066270-A1 · Mar 2, 2023 · US
Method for identifying object, optical sensing apparatus and system
US-2022382378-A1 · Dec 1, 2022 · US
Force sensor device and method for detecting force based on temporal or spatial differential image
US-2022137723-A1 · May 5, 2022 · US
Semiconductor structure
US-2022068880-A1 · Mar 3, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 58 |
| Pixart Imaging Inc | 9 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/60 | 49 |
| H10W90/00 | 43 |
| H10W74/117 | 37 |
| H10W70/09 | 36 |
| H10W70/614 | 36 |