Silicon-on-insulator die support structures and related methods
US-2026018417-A1 · Jan 15, 2026 · US
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Wang Soon Wei patents
Wang Soon Wei is listed as an inventor on 75 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wang Soon Wei |
| Total patents | 75 |
| First publication | Mar 8, 2016 |
| Latest publication | Jan 15, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor devices having die support structures and related methods
US-2025349549-A1 · Nov 13, 2025 · US
Die sidewall coatings and related methods
US-2025349550-A1 · Nov 13, 2025 · US
Silicon-on-insulator die support structures and related methods
US-12444609-B2 · Oct 14, 2025 · US
Leadless semiconductor packages, leadframes therefor, and methods of making
US-12424522-B2 · Sep 23, 2025 · US
Semiconductor packages with die including cavities and related methods
US-12374554-B2 · Jul 29, 2025 · US
Die sidewall coatings and related methods
US-12374555-B2 · Jul 29, 2025 · US
Semiconductor package with wettable flank and related methods
US-2025201675-A1 · Jun 19, 2025 · US
Leadless semiconductor packages, leadframes therefor, and methods of making
US-2025149412-A1 · May 8, 2025 · US
Semiconductor package with wettable flank
US-2025118635-A1 · Apr 10, 2025 · US
Recent patents
Latest publications not already listed above.
Image sensor packages and related methods
US-2025081647-A1 · Mar 6, 2025 · US
Semiconductor package with wettable flank and related methods
US-12243810-B2 · Mar 4, 2025 · US
Semiconductor package with wettable flank
US-12176272-B2 · Dec 24, 2024 · US
Die sidewall coatings and related methods
US-2024332025-A1 · Oct 3, 2024 · US
Semiconductor package having wettable flanks and related methods
US-2024332135-A1 · Oct 3, 2024 · US
Die sidewall coatings and related methods
US-12040192-B2 · Jul 16, 2024 · US
Semiconductor packages with die including cavities and related methods
US-2024203744-A1 · Jun 20, 2024 · US
Semiconductor packages with die including cavities
US-11908699-B2 · Feb 20, 2024 · US
Backmetal removal methods
US-11901184-B2 · Feb 13, 2024 · US
Semiconductor packages with die support structure for thin die
US-11894234-B2 · Feb 6, 2024 · US
Ultra-thin multichip power devices
US-11721654-B2 · Aug 8, 2023 · US
Semiconductor package with wettable flank and related methods
US-2023073773-A1 · Mar 9, 2023 · US
Semiconductor package with wettable flank
US-2023073330-A1 · Mar 9, 2023 · US
Semiconductor package with wettable flank
US-11532539-B2 · Dec 20, 2022 · US
Polymer resin and compression mold chip scale package
US-11508679-B2 · Nov 22, 2022 · US
Die sidewall coatings and related methods
US-2022351977-A1 · Nov 3, 2022 · US
Semiconductor packages with thin die and related methods
US-2022351978-A1 · Nov 3, 2022 · US
Silicon-on-insulator die support structures and related methods
US-2022301876-A1 · Sep 22, 2022 · US
Semiconductor packages with die including cavities and related methods
US-2022246434-A1 · Aug 4, 2022 · US
Semiconductor packages with thin die and related methods
US-11404276-B2 · Aug 2, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Semiconductor Components Ind Llc | 71 |
| Semiconductor Components Ind | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/014 | 66 |
| H10W72/0198 | 59 |
| H01L21/561 | 50 |
| H10P54/00 | 49 |
| H01L21/78 | 48 |