Semiconductor packages and manufacturing methods thereof
US-12266847-B2 · Apr 1, 2025 · US
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Wan Albert patents
Wan Albert is listed as an inventor on 49 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wan Albert |
| Total patents | 49 |
| First publication | Nov 30, 2017 |
| Latest publication | Apr 1, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor device having antenna and manufacturing method thereof
US-12057415-B2 · Aug 6, 2024 · US
Biobased water repellent auxiliary and method of manufacturing the same
US-2024218589-A1 · Jul 4, 2024 · US
Semiconductor packages and manufacturing methods thereof
US-2024128635-A1 · Apr 18, 2024 · US
Semiconductor packages and manufacturing methods thereof
US-11855333-B2 · Dec 26, 2023 · US
Semiconductor device having antenna and manufacturing method thereof
US-2023307391-A1 · Sep 28, 2023 · US
Semiconductor device having antenna on chip package and manufacturing method thereof
US-11705409-B2 · Jul 18, 2023 · US
Aqueous polyurethane dispersion and textile
US-2023203233-A1 · Jun 29, 2023 · US
Semiconductor packages and manufacturing methods thereof
US-11515618-B2 · Nov 29, 2022 · US
Semiconductor packages and manufacturing methods thereof
US-2022368005-A1 · Nov 17, 2022 · US
Recent patents
Latest publications not already listed above.
Method for decolorization of polyester fabric
US-2022204720-A1 · Jun 30, 2022 · US
Package structure and manufacturing method thereof
US-11335655-B2 · May 17, 2022 · US
Integrated fan-out package and manufacturing method thereof
US-11282810-B2 · Mar 22, 2022 · US
Semiconductor packages and manufacturing mehtods thereof
US-2021257717-A1 · Aug 19, 2021 · US
Semiconductor packages and manufacturing methods thereof
US-10978782-B2 · Apr 13, 2021 · US
Package structure and manufacturing method thereof
US-2021098396-A1 · Apr 1, 2021 · US
Package structure and method of fabricating package structure
US-10879197-B2 · Dec 29, 2020 · US
Semiconductor device and manufacturing method thereof
US-10872842-B2 · Dec 22, 2020 · US
Semiconductor package, semiconductor device and method for packaging semiconductor device
US-10867882-B2 · Dec 15, 2020 · US
Package structure and manufacturing method thereof
US-10867940-B2 · Dec 15, 2020 · US
Integrated fan-out package and manufacturing method thereof
US-2020335477-A1 · Oct 22, 2020 · US
Semiconductor device having antenna and manufacturing method thereof
US-2020335459-A1 · Oct 22, 2020 · US
Semiconductor device and manufacturing method thereof
US-2020273773-A1 · Aug 27, 2020 · US
Method of manufacturing integrated fan-out package
US-10756052-B2 · Aug 25, 2020 · US
Semiconductor packages and manufacturing mehtods thereof
US-2020258799-A1 · Aug 13, 2020 · US
Semiconductor device having antenna and manufacturing method thereof
US-10741508-B2 · Aug 11, 2020 · US
Semiconductor packages and manufacturing methods thereof
US-10636713-B2 · Apr 28, 2020 · US
Semiconductor package, semiconductor device and method for packaging semiconductor device
US-2020091031-A1 · Mar 19, 2020 · US
Package structure and manufacturing method thereof
US-2020058607-A1 · Feb 20, 2020 · US
Packaging of semiconductor device with antenna and heat spreader
US-10490479-B1 · Nov 26, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 47 |
| Ind Tech Res Inst | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/09 | 44 |
| H10W44/248 | 40 |
| H10W70/60 | 40 |
| H10W44/20 | 40 |
| H01L23/66 | 38 |