Semiconductor packages and manufacturing methods thereof

Patent metadata

Field	Value
Publication number	US-10636713-B2
Application number	US-201816219979-A
Country	US
Kind code	B2
Filing date	Dec 14, 2018
Priority date	May 26, 2016
Publication date	Apr 28, 2020
Grant date	Apr 28, 2020

Abstract

Sensor packages and manufacturing methods thereof are disclosed. One of the sensor packages includes a semiconductor chip and a redistribution layer structure. The semiconductor chip has a sensing surface. The redistribution layer structure is arranged to form an antenna transmitter structure aside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip.

First claim

What is claimed is:

1. A semiconductor package, comprising:
a semiconductor chip; and
a redistribution layer structure arranged to form an antenna transmitter structure and an antenna receiver structure over the semiconductor chip, wherein from a top view, the antenna transmitter structure is outside of a chip region of the semiconductor chip, and the antenna receiver structure is within the chip region of the semiconductor chip.

2. The semiconductor package of claim 1 , wherein the antenna transmitter structure surrounds the antenna receiver structure.

3. The semiconductor package of claim 1 , wherein the transmitter structure has a ring shape, a bar shape, a spiral shape, a wave shape, a meandering shape or a combination thereof.

4. The semiconductor package of claim 1 , wherein the antenna receiver structure has a plurality of first patterns over the semiconductor chip.

5. The semiconductor package of claim 4 , wherein each of the plurality of first patterns has an island shape, a snake shape, a bar shape, a fishbone shape, a fence shape, a grid shape, a ring shape or a combination thereof.

6. The semiconductor package of claim 4 , wherein the antenna receiver structure further has a plurality of second patterns over the plurality of first patterns.

7. The semiconductor package of claim 6 , wherein the plurality of second patterns are aligned with the plurality of first patterns.

8. The semiconductor package of claim 6 , wherein the antenna receiver structure further has a plurality of third patterns over the plurality of second patterns, the plurality of third patterns are aligned with the plurality of second patterns, and the plurality of second patterns are not aligned with the plurality of first patterns.

9. The semiconductor package of claim 6 , wherein the plurality of second patterns are not aligned with the plurality of first patterns.

10. The semiconductor package of claim 1 , wherein the semiconductor package is a fingerprint semiconductor package.

11. A semiconductor package, comprising:
a semiconductor chip; and
a redistribution layer structure arranged to form a plurality of sensing patterns, an antenna transmitter structure and an antenna receiver structure,
wherein the sensing patterns are configured to detect target molecules and disposed over the semiconductor chip, and the antenna transmitter structure and the antenna receiver structure are disposed aside the sensing patterns.

12. The semiconductor package of claim 11 , wherein the semiconductor package further comprises a polymer layer covering the antenna transmitter structure and the antenna receiver structure while exposing top surfaces of the sensing patterns.

13. The semiconductor package of claim 12 , further comprising molecular linkers respectively covering the exposed top surfaces of the sensing patterns.

14. The semiconductor package of claim 11 , wherein the antenna receiver structure is electrically connected to a through-via aside the semiconductor chip.

15. The semiconductor package of claim 11 , wherein each of the antenna transmitter structure and the antenna receiver structure has a bar shape, a spiral shape, a wave shape, a meandering shape or a combination thereof.

16. The semiconductor package of claim 11 , wherein each of the sensing patterns has a split-ring shape.

17. The semiconductor package of claim 11 , wherein the antenna transmitter structure and the antenna receiver structure are laterally aside a redistribution layer of the redistribution layer structure.

18. A method of forming a semiconductor package, comprising:
providing a semiconductor chip;
forming a redistribution layer, an antenna transmitter structure and an antenna receiver structure over the semiconductor chip, wherein the redistribution layer, the antenna transmitter structure and the antenna receiver structure are laterally separated from each other; and
forming a polymer layer over the redistribution layer structure.

19. The method of claim 18 , wherein the antenna receiver structure comprises a plurality of first patterns over the semiconductor chip.

20. The method of claim 18 , wherein the formation of the redistribution layer structure further comprises forming a plurality of sensing patterns configured to detect target molecules and locate over the semiconductor chip between the antenna transmitter structure and the antenna receiver structure.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chiang Yung-Ping
• Shih Chao-Wen
• Chang Shou-Zen
• Wan Albert
• Hsieh Yu-Sheng

Classifications

• H01Q9/04

  Resonant antennas · CPC title

• H01Q21/065

  Patch antenna array · CPC title

• H01Q1/2283 Primary

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title

• H01L23/3128

  Electricity · mapped topic

• H01L2224/13147

  Electricity · mapped topic