Core substrates with embedded components
US-2026068705-A1 · Mar 5, 2026 · US
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Verhaverbeke Steven patents
Verhaverbeke Steven is listed as an inventor on 158 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Verhaverbeke Steven |
| Total patents | 158 |
| First publication | Mar 24, 2015 |
| Latest publication | Mar 5, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Interposer devices having multiple sets of components formed thereon
US-2026068701-A1 · Mar 5, 2026 · US
Semiconductor device packages
US-2026040980-A1 · Feb 5, 2026 · US
Laser ablation system for package fabrication
US-12518986-B2 · Jan 6, 2026 · US
Semiconductor device packages
US-12482736-B2 · Nov 25, 2025 · US
Method and apparatus for laser drilling blind vias
US-2025281998-A1 · Sep 11, 2025 · US
Finishing on packaging substrate with ultra high-density interconnects
US-2025279348-A1 · Sep 4, 2025 · US
High connectivity device stacking
US-12388049-B2 · Aug 12, 2025 · US
Substrate holder
US-2025242445-A1 · Jul 31, 2025 · US
Package core assembly and fabrication methods
US-12374611-B2 · Jul 29, 2025 · US
Recent patents
Latest publications not already listed above.
Method and apparatus for laser drilling blind vias
US-12358073-B2 · Jul 15, 2025 · US
Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration
US-12354968-B2 · Jul 8, 2025 · US
Package core assembly and fabrication methods
US-12087679-B2 · Sep 10, 2024 · US
Efficient autocatalytic metallization of polymeric surfaces
US-2024222142-A1 · Jul 4, 2024 · US
Planarization methods for packaging substrates
US-11931855-B2 · Mar 19, 2024 · US
Fluoropolymer stamp fabrication method
US-11927885-B2 · Mar 12, 2024 · US
Package structure and fabrication methods
US-11887934-B2 · Jan 30, 2024 · US
Package core assembly and fabrication methods
US-11881447-B2 · Jan 23, 2024 · US
Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration
US-2024021533-A1 · Jan 18, 2024 · US
High connectivity device stacking
US-2024021582-A1 · Jan 18, 2024 · US
Package core assembly and fabrication methods
US-11862546-B2 · Jan 2, 2024 · US
Substrate structuring methods
US-11837680-B2 · Dec 5, 2023 · US
Methods of forming microvias with reduced diameter
US-11798903-B2 · Oct 24, 2023 · US
Laser ablation system for package fabrication
US-2023282498-A1 · Sep 7, 2023 · US
High connectivity device stacking
US-11742330-B2 · Aug 29, 2023 · US
Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration
US-11715700-B2 · Aug 1, 2023 · US
Methods of micro-via formation for advanced packaging
US-11705365-B2 · Jul 18, 2023 · US
High pressure and high temperature anneal chamber
US-11694912-B2 · Jul 4, 2023 · US
Package structure and fabrication methods
US-2023187370-A1 · Jun 15, 2023 · US
Laser ablation system for package fabrication
US-11676832-B2 · Jun 13, 2023 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 157 |
| Applied Materials Inc | 1 |
| Foad Majeed A | 1 |
| Newman Jacob | 1 |
| Marin Jose Antonio | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/095 | 57 |
| H10W70/635 | 55 |
| H10W70/614 | 44 |
| H10W70/698 | 42 |
| H10W70/60 | 41 |