Substrate holder

Patent metadata

Field	Value
Publication number	US-2025242445-A1
Application number	US-202519032966-A
Country	US
Kind code	A1
Filing date	Jan 21, 2025
Priority date	Jan 31, 2024
Publication date	Jul 31, 2025
Grant date	—

Abstract

A substrate holder includes a chuck base forming a chucking vacuum line and a particle vacuum line. The particle vacuum line is to extract particles produced from substrate processing. The substrate holder further includes one or more chuck posts extending from an upper surface of the chuck base. The chucking vacuum line is routed through the one or more chuck posts to chuck a substrate. The substrate holder further includes one or more die collect components disposed on the upper surface of the chuck base. A device is to be supported by at least one of the one or more die collect components responsive to being cut from the substrate.

First claim

What is claimed is:

1 . A substrate holder comprising:
a chuck base forming a chucking vacuum line and a particle vacuum line, the particle vacuum line to extract particles produced from substrate processing; one or more chuck posts extending from an upper surface of the chuck base, the chucking vacuum line being routed through the one or more chuck posts to chuck a substrate; and one or more die collect components disposed on the upper surface of the chuck base, wherein a device is to be supported by at least one of the one or more die collect components responsive to being cut from the substrate.

2 . The substrate holder of claim 1 , wherein at least a portion of the upper surface is configured to at least one of dissipate or randomize laser reflection.

3 . The substrate holder of claim 1 , wherein the device is to be cut from the substrate via a laser, wherein spacing between the substrate and the chuck base is to prevent reflection of the laser from impacting the device.

4 . The substrate holder of claim 1 , wherein the one or more chuck posts comprise a first chuck post configured to support a first portion of the substrate and a second chuck post configured to support a second portion of the substrate.

5 . The substrate holder of claim 1 , wherein the one or more chuck posts comprise a first chuck post that forms a chucking vacuum line lower channel that has a first width and a chucking vacuum line upper channel that has a second width that is greater than the first width.

6 . The substrate holder of claim 1 , wherein the one or more chuck posts comprise a single chuck post that supports a first portion of the substrate and a second portion of the substrate.

7 . The substrate holder of claim 6 , wherein the single chuck post is substantially annular, wherein the single chuck post comprises an outer sidewall and an inner sidewall, wherein the chucking vacuum line is formed between the outer sidewall and the inner sidewall.

8 . The substrate holder of claim 1 , wherein the one or more die collect components are made of thermoplastic.

9 . The substrate holder of claim 1 , wherein the one or more die collect components is a single die collect component that is substantially annular and surrounds a port of the particle vacuum line.

10 . The substrate holder of claim 1 , wherein the substrate holder is configured to produce the device that has rounded corners.

11 . The substrate holder of claim 1 , wherein the substrate holder is configured to produce the device that has hollowed corners filled with an epoxy.

12 . A substrate holder comprising:
a chuck base forming a chucking vacuum line and a particle vacuum line, the particle vacuum line to extract particles produced from substrate processing; and an annular chuck post extending from an upper surface of the chuck base, the chucking vacuum line being routed through the annular chuck post to chuck a substrate.

13 . The substrate holder of claim 12 further comprising an annular die collect component disposed on the upper surface of the chuck base, wherein a device is to be supported by the annular die collect component responsive to being cut from the substrate.

14 . The substrate holder of claim 13 , wherein the device is to be cut from the substrate via a laser, wherein spacing between the substrate and the chuck base is to prevent reflection of the laser from impacting the device.

15 . The substrate holder of claim 12 , wherein at least a portion of the upper surface is configured to at least one of dissipate or randomize laser reflection.

16 . The substrate holder of claim 12 , wherein the annular chuck post forms a chucking vacuum line lower channel that has a first width and a chucking vacuum line upper channel that has a second width that is greater than the first width.

17 . A method comprising:
causing a substrate to be disposed on one or more chuck posts that extend from an upper surface of a chuck base of a substrate holder, the chuck base forming a chucking vacuum line, the chucking vacuum line being routed through the one or more chuck posts; causing the substrate to be secured on the one or more chuck posts by suction through the chucking vacuum line; and causing a device to be laser cut from the substrate, wherein the device is to be supported by at least one die collect component responsive to being cut from the substrate.

18 . The method of claim 17 further comprising causing particle removal below the substrate by suction through a particle vacuum line, the chuck base forming the particle vacuum line.

19 . The method of claim 17 , wherein the causing of the device to be laser cut from the substrate comprises rounding corners of the device.

20 . The method of claim 17 , wherein the causing of the device to be laser cut from the substrate comprises hollowing corners of the device to form hollowed corners and filling the hollowed corners with epoxy.

Assignees

• Applied Materials Inc

Inventors

• Delmas Jean
• Stonas Bernhard Wolfgang
• Verhaverbeke Steven
• Leschkies Kurtis Siegfried
• Acharya Sumedh
• Patel Dakshalkumar Kantilal

Classifications

• B23K26/142

  for the removal of by-products · CPC title

• B23K37/0426

  Fixtures for other work · CPC title

• B23K26/382 Primary

  by boring · CPC title