High temperature electrostatic chuck bonding adhesive
US-11264261-B2 · Mar 1, 2022 · US
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Thach Senh patents
Thach Senh is listed as an inventor on 17 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Thach Senh |
| Total patents | 17 |
| First publication | Jan 27, 2015 |
| Latest publication | Mar 1, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Method of processing a substrate support assembly
US-10557202-B2 · Feb 11, 2020 · US
Real time monitoring with closed loop chucking force control
US-10460916-B2 · Oct 29, 2019 · US
Pixilated cooling, temperature controlled substrate support assembly
US-10403534-B2 · Sep 3, 2019 · US
Real time monitoring with closed loop chucking force control
US-2018330926-A1 · Nov 15, 2018 · US
Electrostatic chuck with external flow adjustments for improved temperature distribution
US-10121688-B2 · Nov 6, 2018 · US
Substrate support assembly having a plasma resistant protective layer
US-2018151401-A1 · May 31, 2018 · US
Substrate support assembly having a plasma resistant protective layer
US-9916998-B2 · Mar 13, 2018 · US
Control systems employing deflection sensors to control clamping forces applied by electrostatic chucks, and related methods
US-9875923-B2 · Jan 23, 2018 · US
Method of processing a substrate support assembly
US-2017167018-A1 · Jun 15, 2017 · US
Recent patents
Latest publications not already listed above.
Control systems employing deflection sensors to control clamping forces applied by electrostatic chucks, and related methods
US-2017103911-A1 · Apr 13, 2017 · US
Electrostatic chuck with external flow adjustments for improved temperature distribution
US-9622375-B2 · Apr 11, 2017 · US
Control systems employing deflection sensors to control clamping forces applied by electrostatic chucks, and related methods
US-9558981-B2 · Jan 31, 2017 · US
Electrostatic chuck with internal flow adjustments for improved temperature distribution
US-9520315-B2 · Dec 13, 2016 · US
High temperature electrostatic chuck bonding adhesive
US-9520314-B2 · Dec 13, 2016 · US
Pixilated cooling, temperature controlled substrate support assembly
US-2015129165-A1 · May 14, 2015 · US
Single-body electrostatic chuck
US-8941969-B2 · Jan 27, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 17 |
| Thach Senh | 3 |
| Parkhe Vijay D | 2 |
| Busche Matthew J | 2 |
| Boyd Jr Wendell | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/72 | 14 |
| H10P72/722 | 13 |
| H01L21/6833 | 12 |
| H01L21/6831 | 11 |
| H10P72/0434 | 8 |