Electrostatic chuck with external flow adjustments for improved temperature distribution

Patent metadata

Field	Value
Publication number	US-9622375-B2
Application number	US-201314145680-A
Country	US
Kind code	B2
Filing date	Dec 31, 2013
Priority date	Dec 31, 2013
Publication date	Apr 11, 2017
Grant date	Apr 11, 2017

Abstract

An electrostatic chuck is described with external flow adjustments for improved temperature distribution. In one example, an apparatus has a dielectric puck to electrostatically grip a silicon wafer. A cooling plate is fastened to and thermally coupled to the ceramic puck. A supply plenum receives coolant from an external source and a plurality of coolant chambers are thermally coupled to the cooling plate and receive coolant from the supply plenum. A return plenum is coupled to the cooling zones to exhaust coolant from the cooling zones and a plurality of flow control valves are positioned between the supply plenum and a respective one of the cooling zones to control the flow rate of coolant from the supply plenum to the cooling zones.

First claim

What is claimed is:

1. An electrostatic chuck for grip a workpiece for processing, the chuck comprising:
a dielectric puck to electrostatically grip a workpiece;
a cooling plate fastened to and thermally coupled to the dielectric puck;
a supply plenum to receive coolant from an external source;
a plurality of coolant chambers thermally coupled to the cooling plate, the coolant chambers each being in independently coupled to the supply plenum to receive coolant from the supply plenum;
a return plenum coupled to the cooling chambers to exhaust coolant from the cooling zones; and
a plurality of flow control valves between the supply plenum and a respective one of the cooling zones to control the flow rate of coolant from the supply plenum to the cooling zones.

2. The electrostatic chuck of claim 1 , further comprising a plurality of return ports to return coolant from the cooling zones for resupply to the supply plenum.

3. The electrostatic chuck of claim 1 , wherein the flow control valves each comprise:
a valve seat between the supply plenum and a respective cooling zone; and
a valve body movable with respect to the valve seat to control coolant flow through the valve seat.

4. The electrostatic chuck of claim 3 , wherein the valve bodies are threaded to the cooling plate so that rotation of the valve bodies with respect to the cooling plate moves the valve bodies with respect to the respective valve seat.

5. The electrostatic chuck of claim 1 , further comprising a removable valve controller to engage and independently control each valve to adjust the flow of coolant through each valve.

6. The electrostatic chuck of claim 5 , wherein the valve controllers comprise a gear motor to adjust the position of the valve body.

7. The electrostatic chuck of claim 1 , further comprising:
a motorized valve controller to engage and independently control each valve to adjust the flow of coolant through each valve;
a heat detector to detect heat on the dielectric puck; and
a processor coupled to the heat detector and to the valve controller to operate the motor of the valve controller to adjust coolant flow based on the detected heat.

8. An electrostatic chuck for grip a workpiece for processing, the chuck comprising:
a dielectric puck to electrostatically grip a workpiece;
a top plate of a cooling plate, the top plate being fastened to the dielectric puck;
a middle plate of a cooling plate the middle plate having a plurality of orifices and defining a plurality of coolant chambers between the middle plate and the top plate, the coolant chambers each being in communication with at least one orifice to allow coolant to flow through the middle plate to a respective coolant chamber;
a bottom plate of a cooling plate, the bottom plate defining a supply plenum between the bottom plate and the middle plate independently coupled to each of the orifices to independently supply coolant to each of the orifices; and
a plurality of valves to control coolant flow each through a respective one of the orifices.

9. The electrostatic chuck of claim 8 , wherein the plurality of valves comprise:
a plurality of valve seats in the middle plate each associated with an orifice; and
a plurality of valves bodies in the bottom plate, each positioned to seat in a respective one of the valve seats to control the flow of coolant chambers through the respective orifice.

10. The electrostatic chuck of claim 8 , wherein the middle plate defines return plenums to conduct coolant from the coolant chambers to a return port.

11. The electrostatic chuck of claim 10 , wherein the middle plate has hexagonal areas to define the coolant chambers and coolant channels of the return plenums surrounding each hexagonal area.

12. The electrostatic chuck of claim 11 , the middle plate further comprising a circular channel surrounding the hexagonal areas and wherein the coolant channels conduct the coolant into the circular channel of the middle plate.

13. The electrostatic chuck of claim 11 , wherein each hexagonal area is supplied by a different one of the plurality of valves.

Assignees

• Busche Matthew J
• Parkhe Vijay D
• Boyd Jr Wendell
• Thach Senh
• Makhratchev Konstantin
• Ono Masanori
• Applied Materials Inc

Inventors

• Busche Matthew J
• Parkhe Vijay D
• Boyd Jr Wendell
• Thach Senh
• Makhratchev Konstantin
• Ono Masanori

Classifications

• H10P72/0434

  mainly by convection · CPC title

• H10P72/0432

  mainly by conduction · CPC title

• H10P72/72

  using electrostatic chucks · CPC title

• H10P72/722 Primary

  Details of electrostatic chucks · CPC title

• H05K7/20218 Primary

  using a liquid coolant without phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954) · CPC title