Control systems employing deflection sensors to control clamping forces applied by electrostatic chucks, and related methods

US9558981B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9558981-B2
Application numberUS-201414158112-A
CountryUS
Kind codeB2
Filing dateJan 17, 2014
Priority dateNov 19, 2013
Publication dateJan 31, 2017
Grant dateJan 31, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A control system that includes deflection sensors which can control clamping forces applied by electrostatic chucks, and related methods are disclosed. By using a sensor to determine a deflection of a workpiece supported by an electrostatic chuck, a control system may use the deflection measured to control a clamping force applied to the workpiece by the electrostatic chuck. The control system applies a clamping voltage to the electrostatic chuck so that the clamping force reaches and maintains a target clamping force. In this manner, the clamping force may secure the workpiece to the electrostatic chuck to enable manufacturing operations to be performed while preventing workpiece damage resulting from unnecessary higher values of the clamping force.

First claim

Opening claim text (preview).

What is claimed is: 1. A control system, comprising: an electrostatic chuck; a sensor positioned to determine a deflection of a workpiece into at least one recess of the electrostatic chuck as the electrostatic chuck applies a clamping force to the workpiece, wherein the sensor comprises an end portion of an optical fiber that is configured to emit a radiation from within the at least one recess; and a controller programmed to determine from the deflection the clamping force applied to the workpiece by the electrostatic chuck, and to adjust a clamping voltage at the electrostatic chuck so that the clamping force reaches and maintains a target clamping force. 2. The control system of claim 1 , wherein the sensor comprises an interferometric displacement sensor. 3. The control system of claim 1 , wherein the electrostatic chuck comprises a material comprising at least one of aluminum oxide or aluminum nitride. 4. The control system of claim 1 , wherein the at least one recess of the electrostatic chuck is formed by adjacent mesas of a plurality of mesas of the electrostatic chuck, and the plurality of mesas are configured to support the workpiece. 5. The control system of claim 1 , wherein the sensor is configured to emit a radiation to a surface of the workpiece and to measure the radiation reflected to determine the deflection. 6. The control system of claim 5 , wherein the optical fiber is positioned to receive a portion of the radiation which is reflected from the surface of the workpiece to determine the deflection of the workpiece. 7. A plasma chamber, including a control system, comprising: an electrostatic chuck; a sensor positioned to determine a deflection of a workpiece into at least one recess of the electrostatic chuck as the electrostatic chuck applies a clamping force to the workpiece, wherein the sensor comprises an end portion of an optical fiber that is configured to emit a radiation from within the at least one recess; and a controller programmed to adjust a clamping voltage based on the deflection. 8. The plasma chamber of claim 7 , wherein the sensor comprises an interferometric displacement sensor. 9. The control system of claim 7 , wherein the controller comprises a proportional-integral-derivative (PID) controller. 10. The control system of claim 9 , wherein the PID controller determines a clamping voltage correction. 11. The control system of claim 10 , wherein the controller applies a clamping voltage to the electrostatic clamp, wherein the clamping voltage is the sum of the clamping voltage correction and a clamping voltage setpoint. 12. The control system of claim 10 , wherein the PID controller receives a clamping force error, wherein the clamping force error is a difference between the clamping force and a clamping force setpoint. 13. A method for controlling a clamping force of an electrostatic chuck, comprising: determining with a sensor a deflection of a workpiece into at least one recess of an electrostatic chuck, wherein the sensor comprises an end portion of an optical fiber that is configured to emit a radiation from within the at least one recess; determining with a controller a measured clamping force applied to the workpiece by the electrostatic chuck; and applying with the controller a clamping voltage to the electrostatic chuck so that the clamping force reaches and maintains a target clamping force. 14. The method of claim 13 , wherein the determining with the sensor comprises emitting a radiation to a surface of the workpiece and measuring a portion of the radiation which is reflected. 15. The method of claim 13 , wherein the sensor comprises an interferometric displacement sensor.

Assignees

Inventors

Classifications

  • Monitoring of warpages, curvatures, damages, defects or the like · CPC title

  • H10P72/722Primary

    Details of electrostatic chucks · CPC title

  • Electricity · mapped topic

  • Electricity · mapped topic

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Frequently asked questions

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What does patent US9558981B2 cover?
A control system that includes deflection sensors which can control clamping forces applied by electrostatic chucks, and related methods are disclosed. By using a sensor to determine a deflection of a workpiece supported by an electrostatic chuck, a control system may use the deflection measured to control a clamping force applied to the workpiece by the electrostatic chuck. The control system …
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification H10P72/722. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 31 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).