Substrate support assembly having a plasma resistant protective layer

Patent metadata

Field	Value
Publication number	US-9916998-B2
Application number	US-201314086799-A
Country	US
Kind code	B2
Filing date	Nov 21, 2013
Priority date	Dec 4, 2012
Publication date	Mar 13, 2018
Grant date	Mar 13, 2018

Abstract

A substrate support assembly comprises a ceramic body and a thermally conductive base bonded to a lower surface of the ceramic body. The substrate support assembly further comprises a protective layer covering an upper surface of the ceramic body, wherein the protective layer comprises at least one of yttrium aluminum garnet (YAG) or a ceramic compound comprising Y 4 Al 2 O 9 and a solid-solution of Y 2 O 3 —ZrO 2 .

First claim

What is claimed is:

1. A substrate support assembly comprising:
a ceramic body;
a thermally conductive base bonded to a lower surface of the ceramic body; and
a bulk sintered ceramic wafer bonded to an upper surface of the ceramic body by a diffusion bond,
wherein the bulk sintered ceramic wafer comprises a ceramic compound comprising Y 4 Al 2 O 9 and a solid-solution of Y 2 O 3 —ZrO 2 , wherein the bulk sintered ceramic wafer has a hardness between about 14 GPa and about 16 GPa, and
wherein the bulk sintered ceramic wafer comprises a plurality of mesas formed on a surface of the bulk sintered ceramic wafer, and wherein the ceramic body and the bulk sintered ceramic wafer each comprise a plurality of through holes that penetrate the bulk sintered ceramic wafer and the ceramic body.

2. The substrate support assembly of claim 1 , wherein the ceramic body comprises Al 2 O 3 , the diffusion bond comprises an interface layer comprising Y 3 Al 5 O 12 (YAG), and the ceramic body is a flat electrostatic puck.

3. A method comprising:
applying a bulk sintered ceramic wafer to an upper surface of a ceramic body, the bulk sintered ceramic wafer comprising a ceramic compound of Y 4 Al 2 O 9 and a solid-solution of Y 2 O 3 —ZrO 2 , wherein the bulk sintered ceramic wafer acts as a protective layer for the ceramic body and has a hardness between about 14 GPa and about 16 GPa;
heating the ceramic body and the bulk sintered ceramic wafer to form a diffusion bond between the ceramic body and the bulk sintered ceramic wafer, the diffusion bond comprising an interface layer between the upper surface of the ceramic body and the bulk sintered ceramic wafer, wherein the interface layer comprises first elements from the bulk sintered ceramic wafer that have reacted with second elements from the ceramic body to cause the diffusion bond;
drilling a plurality of through holes that penetrate the bulk sintered ceramic wafer and the ceramic body;
forming a plurality of mesas on a surface of the bulk sintered ceramic wafer; and
bonding a thermally conductive base to a lower surface of the ceramic body.

4. The method of claim 3 , wherein the ceramic body comprises Al 2 O 3 , the interface layer comprises Y 3 Al 5 O 12 (YAG), and the ceramic body is a flat electrostatic puck.

5. The substrate support assembly of claim 1 , wherein the ceramic compound comprises from 50 to 75 mol % of Y 2 O 3 , from 10 to 30 mol % ZrO 2 , and from 10 to 30% Al 2 O 3 .

6. The substrate support assembly of claim 1 , wherein the bulk sintered ceramic wafer has a density of around 4.90 g/cm 3 .

7. The substrate support assembly of claim 1 , wherein the interface layer is non-reactive and non-porous.

8. The substrate support assembly of claim 1 , wherein the bulk sintered ceramic wafer has a thickness of about 200 micrometers.

9. The substrate support assembly of claim 1 , wherein the plurality of mesas formed on a surface of the bulk sintered ceramic wafer are about 10 to 15 micrometers tall and about 200 micrometers in diameter.

10. The substrate support assembly of claim 1 , wherein the plurality of through holes that penetrate the bulk sintered ceramic wafer and the ceramic body have a diameter of about 4 to 7 millimeters.

11. The substrate support assembly of claim 1 , wherein the ceramic compound comprises 62.93 mol % of Y 2 O 3 , 23.23 mol % ZrO 2 , and 13.94 mol % Al 2 O 3 .

Assignees

• Applied Materials Inc

Inventors

• Sun Jennifer Y
• Thach Senh
• Kanungo Biraja P
• Firouzdor Vahid

Classifications

• H10P72/7616

  characterised by a coating, a hardness or a material · CPC title

• H10P72/7614

  characterised by a plurality of individual support members, e.g. support posts or protrusions · CPC title

• H10P72/72 Primary

  using electrostatic chucks · CPC title

• Y10T156/1041

  Subsequent to lamination · CPC title

• H01L21/6831 Primary

  Electricity · mapped topic