Pixilated cooling, temperature controlled substrate support assembly

Patent metadata

Field	Value
Publication number	US-10403534-B2
Application number	US-201414536803-A
Country	US
Kind code	B2
Filing date	Nov 10, 2014
Priority date	Nov 11, 2013
Publication date	Sep 3, 2019
Grant date	Sep 3, 2019

Abstract

Implementations described herein provide a pixelated substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a cooling base comprising the substrate support assembly, which in turn, allows both lateral and azimuthal tuning of a substrate processed on the substrate support assembly. A processing chamber having a pixelated substrate support assembly and method for processing a substrate using a pixelated substrate support assembly are also provided.

First claim

We claim:

1. A substrate support assembly, comprising:
a substrate support member having an upper surface configured to support a substrate, and a lower surface opposite the upper surface; and
a cooling base comprising:
a base body having an upper surface and a lower surface, the upper surface of the base body coupled to the lower surface of the substrate support member;

a plurality of cells formed in the base body, each cell comprising:
a first cell surface opposite the upper surface of the base body such that a web of base material is defined between the first cell surface and the upper surface of the base body, the first cell surface being the web of base material;
a protruded fluid outlet having an orientation selected to direct fluid exiting the protruded fluid outlet against the first cell surface, wherein the protruded fluid outlet extends into each cell of the plurality of cells; and
a divider plate positioned opposite the first cell surface, the divider plate including a plurality of apertures formed therethrough, each aperture of the plurality of apertures coupling each cell to a return plenum;
an outlet port coupled to the return plenum;

a plurality of fluid inlet passages each paired with a-respective one of protruded fluid outlets; and
at least one thermal choke extending from the substrate support member in between a first cell of the plurality of cells and a second cell of the plurality of cells, the second cell being adjacent to the first cell, wherein the at least one thermal choke is disposed in between a first sidewall of the first cell and a second sidewall of the second cell, each of the first sidewall and the second sidewall being formed from the web of base material.

2. The substrate support assembly of claim 1 , wherein the cells are arranged in a grid.

3. The substrate support assembly of claim 1 , wherein the cells are arranged in a polar array.

4. The substrate support assembly of claim 1 , further comprising:
another thermal choke disposed between an edge of the cooling base and the plurality of cells.

5. The substrate support assembly of claim 1 , wherein the at least one thermal choke comprises: a groove in the upper surface of the base body.

6. The substrate support assembly of claim 5 , wherein the groove is filled with bonding material having a thermal coefficient less than a thermal coefficient of a material comprising the cooling base.

7. The substrate support assembly of claim 5 , wherein the groove is filled with a material bonding the substrate support member to the cooling base.

8. The substrate support assembly of claim 1 , wherein the substrate support member is an electrostatic chuck.

9. The substrate support assembly of claim 1 further comprising:
a fluid distributor having a first orifice and a second orifice, each orifice having a different size and configured to direct fluid into separate cells at different rates.

10. The substrate support assembly of claim 1 further comprising:
a fluid distributor configured to direct fluid into separate cells at different rates, the fluid distributor positioned in a support member coupled to the cooling base.

11. The substrate support assembly of claim 1 further comprising: a fluid distributor configured to direct fluid into separate cells at different rates, the fluid distributor positioned remote from the substrate support assembly.

12. The substrate support assembly of claim 1 , wherein the substrate support member is a ceramic electrostatic chuck, and wherein the cooling base comprises aluminum.

13. A processing chamber, comprising:
a chamber body,
an electrostatic chuck disposed in the chamber body, the electrostatic chuck having an upper surface configured to support a substrate and a lower surface; and
a metallic cooling base having an upper surface and a lower surface, the upper surface of the cooling base bonded to the lower surface of the electrostatic chuck, the cooling base comprising:
a plurality of cells formed in the cooling base, each cell configured to receive an independently controllable flow of heat transfer fluid, each cell having a web of base material disposed between the cell and the electrostatic chuck, each web of base material being thermally isolated from at least one adjacent web of base material, each cell comprising:
a first cell surface opposite the upper surface of the cooling base such that a web of base material is defined between the first cell surface and the upper surface of the cooling base;
a protruded fluid outlet having an orientation selected to direct fluid exiting the protruded fluid outlet against the first cell surface; and
a divider plate positioned opposite the first cell surface, the divider plate including a plurality of apertures formed therethrough, each aperture of the plurality of apertures coupling each cell to a return plenum;
an outlet port coupled to the return plenum;

a plurality of fluid inlet passages each paired with a respective one of protruded fluid outlets; and
at least one thermal choke extending from the electrostatic chuck in between a first cell of the plurality of cells and a second cell of the plurality of cells, the second cell being adjacent to the first cell, wherein the at least one thermal choke is disposed in between a first sidewall of the first cell and a second sidewall of the second cell, each of the first sidewall and the second sidewall being formed from the web of base material.

14. The processing chamber of claim 13 , further comprising one or more thermal chokes disposed between neighboring cells.

15. The processing chamber of claim 14 , wherein the one or more thermal chokes extend between sidewalls of neighboring cells.

16. The processing chamber of claim 13 , wherein the cells are arranged in a grid or polar array.

17. The processing chamber of claim 13 further comprising:
another thermal choke disposed between an edge of the cooling base and the plurality of cells.

18. The processing chamber of claim 14 , wherein the at least one thermal choke comprises:
a groove in the upper surface of the cooling base.

19. The processing chamber of claim 18 , wherein the groove is filled with a material having a thermal coefficient less than a thermal coefficient of a material comprising the cooling base.

20. A method for controlling a temperature of a substrate, comprising:
processing a substrate supported on a substrate support assembly having an electrostatic chuck disposed on a cooling base; and
while processing the substrate, flowing a heat transfer fluid into a first cell formed in a cooling base at a rate different than a rate of heat transfer fluid flowing into a second cell formed in the cooling base, the first and second cells laterally separated by a thermal choke, wherein flowing the heat transfer fluid comprising:
directing fluid exiting a protruded fluid outlet against a surface opposite an upper surface of the cooling base such that a web of base material is defined between the first cell surface and the upper surface of the cooling base;
and
flowing the fluid through an interior volume of the first cell, to an outlet of each cell, wherein each fluid passage of a plurality of fluid inlet passages is paired with a respective one of protruded fluid outlets and at least one thermal choke separates the first cell from a second, neighboring cell.

Assignees

• Applied Materials Inc

Inventors

• Parkhe Vijay D
• Boyd Jr Wendell
• Busche Matthew James
• Makhratchev Konstantin
• Ono Masanori
• Thach Senh

Classifications

• H10P72/0434 Primary

  mainly by convection · CPC title

• H10P72/72

  using electrostatic chucks · CPC title

• H10P72/722 Primary

  Details of electrostatic chucks · CPC title

• H01L21/67109

  Electricity · mapped topic

• H01L21/6831

  Electricity · mapped topic