High temperature electrostatic chuck bonding adhesive

Patent metadata

Field	Value
Publication number	US-11264261-B2
Application number	US-201615374702-A
Country	US
Kind code	B2
Filing date	Dec 9, 2016
Priority date	Dec 19, 2008
Publication date	Mar 1, 2022
Grant date	Mar 1, 2022

Abstract

Methods and apparatus for bonding an electrostatic chuck to a component of a substrate support are provided herein. In some embodiments, an adhesive for bonding components of a substrate support may include a matrix of silicon-based polymeric material having a filler dispersed therein. The silicon based polymeric material may be a polydimethylsiloxane (PDMS) structure having a molecular weight with a low molecular weight (LMW) content Σ D3-D10 of less than about 500 ppm. In some embodiments, the filler may comprise between about 50 to about 70 percent by volume of the adhesive layer. In some embodiments, the filler may comprise particles of aluminum oxide (Al2O3), aluminum nitride (AlN), yttrium oxide (Y2O3), or combinations thereof. In some embodiments, the filler may comprise particles having a diameter of about 10 nanometers to about 10 microns.

First claim

The invention claimed is:

1. An adhesive for bonding components of a substrate support, comprising:
a matrix of silicon-based polymeric material having a filler dispersed therein,
wherein the silicon-based polymeric material comprises a polydimethylsiloxane (PDMS) structure having dimethyisiloxane units comprising a mixture of molecular weights, wherein the mixture of molecular weights comprises a low molecular weight (LMW) content Σ D3-D10 of less than about 500 ppm,
wherein the filler comprises yttrium oxide (Y 2 O 3 ), wherein said yttrium comprises 50 to about 70 percent by volume of the adhesive, wherein the filler in the silicon-based polymeric material comprises 50 to about 70 percent by volume of the adhesive; wherein all fillers in the silicon-based polymeric material comprise 50 to about 70 percent by volume of the adhesive,
Wherein the adhesive is effective to bond an electrostatic chuck to a substrate without delamination when operating the electrostatic chuck at a temperature of 120° C.

2. The adhesive of 1 , wherein the adhesive has a metal content of less than about 1 percent.

3. The adhesive of claim 1 , wherein the adhesive is substantially non-reactive with halogen containing chemistries.

4. The adhesive of claim 1 , wherein the adhesive has a thermal conductivity of at least about 0.5 W/mK.

5. The adhesive of claim 1 , wherein the filler comprises particles having a diameter of about 10 nanometers to about 10 microns.

6. The adhesive of claim 1 , wherein the matrix of silicon-based polymeric material having a filler dispersed therein further comprises catalyst, and wherein the adhesive has a thermal conductivity of at least about 0.5 W/mk.

7. The adhesive of claim 6 , wherein the catalyst is a platinum catalyst.

8. The adhesive of claim 7 , wherein the matrix and catalyst have a mass ratio of between about 5:1 to about 20:1.

9. The adhesive of claim 1 , wherein the adhesive has a bulk purity of greater than 99%.

10. The adhesive for bonding components of a substrate support of claim 1 , wherein the silicon-based polymeric material comprises a polydimethylsiloxane (PDMS) structure having dimethylsiloxane units comprising a mixture of molecular weights, wherein the mixture of molecular weights comprises a low molecular weight (LMW) content Σ D3-D10 of less than about 500 ppm.

11. The adhesive for bonding components of a substrate support of claim 1 , wherein the adhesive is capable of withstanding a process environment having a high plasma density of about E10-E12 ions/cm 3 .

12. The adhesive for bonding components of a substrate support of claim 1 , further comprising a platinum catalyst.

13. The adhesive for bonding components of a substrate support of claim 1 , wherein the silicon-based polymeric material consists essentially of a polydimethylsiloxane (PDMS).

14. The adhesive of claim 1 , wherein the adhesive is effective to bond an electrostatic chuck to a substrate without delamination when operating the electrostatic chuck at a temperature of 180° C.

15. An adhesive for bonding components of a substrate support, comprising:
a matrix of silicon-based polymeric material having a filler dispersed therein, wherein the silicon-based polymeric material comprises a polydimethylsiloxane (PDMS) structure having dimethylsiloxane units comprising a mixture of molecular weights, wherein the mixture of molecular weights comprises a low molecular weight (LMW) content Σ D3-D10 of less than about 500 ppm, wherein the filler is about 67% by volume of the adhesive, and wherein the filler comprises aluminum oxide (Al 2 O 3 ), aluminum nitride (AlN), yttrium oxide (Y 2 O 3 ), or combinations thereof.

16. The adhesive of claim 15 , wherein the filler comprises aluminum oxide (Al 2 O 3 ), aluminum nitride (AlN), or combinations thereof.

17. The adhesive of claim 15 , wherein the filler comprises aluminum oxide (Al 2 O 3 ), yttrium oxide (Y 2 O 3 ), or combinations thereof.

18. The adhesive of claim 15 , wherein the filler comprises aluminum nitride (AlN), yttrium oxide (Y 2 O 3 ), or combinations thereof.

19. The adhesive of claim 15 , wherein the filler comprises aluminum oxide (Al 2 O 3 ).

20. The adhesive of claim 15 , wherein the filler comprises aluminum nitride (AlN).

21. The adhesive of claim 15 , wherein the filler comprises yttrium oxide (Y 2 O 3 ).

22. The adhesive of claim 15 , wherein the adhesive is effective to bond an electrostatic chuck to a substrate without delamination when operating the electrostatic chuck at a temperature of 180° C.

Assignees

• Applied Materials Inc

Inventors

• Sun Jennifer Y
• Thach Senh
• Duan Ren-Guan

Classifications

• H10P72/72

  using electrostatic chucks · CPC title

• H10P72/722 Primary

  Details of electrostatic chucks · CPC title

• C08K3/22

  of metals · CPC title

• Y10T279/23

  with magnetic or electrostatic means · CPC title

• C09J201/02 Primary

  characterised by the presence of specified groups {, e.g. terminal or pendant functional groups} · CPC title