Resin multilayer substrate and method for manufacturing resin multilayer substrate
US-12120817-B2 · Oct 15, 2024 · US
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Takada Ryosuke patents
Takada Ryosuke is listed as an inventor on 30 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Takada Ryosuke |
| Total patents | 30 |
| First publication | Apr 21, 2016 |
| Latest publication | Oct 15, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Resin film
US-2024287268-A1 · Aug 29, 2024 · US
Resin multilayer substrate and method for manufacturing resin multilayer substrate
US-12036776-B2 · Jul 16, 2024 · US
Resin sheet and resin multilayer substrate
US-2024206060-A1 · Jun 20, 2024 · US
Electro-optic polymer
US-2024182607-A1 · Jun 6, 2024 · US
Resin substrate and method for manufacturing resin substrate
US-11659652-B2 · May 23, 2023 · US
Laminated body and method for manufacturing the same
US-11558958-B2 · Jan 17, 2023 · US
Laminated body and method for manufacturing the same
US-2022377886-A1 · Nov 24, 2022 · US
Multilayer substrate, interposer, and electronic device
US-11510315-B2 · Nov 22, 2022 · US
Laminated body and method for manufacturing the same
US-11445606-B2 · Sep 13, 2022 · US
Recent patents
Latest publications not already listed above.
Resin sheet and resin multilayer substrate
US-2022153943-A1 · May 19, 2022 · US
Resin multilayer substrate and method for manufacturing resin multilayer substrate
US-2022151066-A1 · May 12, 2022 · US
Resin multilayer substrate and electronic apparatus
US-11266016-B2 · Mar 1, 2022 · US
Multilayer wiring board, electronic device and method for producing multilayer wiring board
US-11257779-B2 · Feb 22, 2022 · US
Multilayer substrate, interposer, and electronic device
US-2021345487-A1 · Nov 4, 2021 · US
Resin multilayer substrate and method for manufacturing resin multilayer substrate
US-2021283890-A1 · Sep 16, 2021 · US
Resin multilayer substrate and electronic apparatus
US-2021267051-A1 · Aug 26, 2021 · US
Resin substrate and method for manufacturing resin substrate
US-2021267045-A1 · Aug 26, 2021 · US
Multilayer substrate, interposer, and electronic device
US-11089680-B2 · Aug 10, 2021 · US
Laminated body and method for manufacturing the same
US-2021212203-A1 · Jul 8, 2021 · US
Method of manufacturing treated sheet and method of manufacturing resin multilayer substrate
US-11001042-B2 · May 11, 2021 · US
Multilayer wiring substrate
US-10959327-B2 · Mar 23, 2021 · US
Interposer and electronic device
US-10806033-B2 · Oct 13, 2020 · US
Multilayer substrate, interposer, and electronic device
US-2020245460-A1 · Jul 30, 2020 · US
Interposer and electronic device
US-2020205289-A1 · Jun 25, 2020 · US
Multilayer wiring board, electronic device and method for producing multilayer wiring board
US-2020091104-A1 · Mar 19, 2020 · US
Multilayer wiring substrate
US-2019269010-A1 · Aug 29, 2019 · US
Method of manufacturing treated sheet and method of manufacturing resin multilayer substrate
US-2018186138-A1 · Jul 5, 2018 · US
Copolymer, resin composition containing the copolymer, film and phase difference film
US-9815927-B2 · Nov 14, 2017 · US
Copolymer, resin composition containing the copolymer, film and phase difference film
US-2016108158-A1 · Apr 21, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Murata Manufacturing Co | 28 |
| Fujifilm Corp | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K2201/0141 | 18 |
| H05K2201/0129 | 16 |
| B32B27/08 | 12 |
| H05K3/4632 | 10 |
| H05K3/4644 | 10 |