Multilayer substrate, interposer, and electronic device

Patent metadata

Field	Value
Publication number	US-11089680-B2
Application number	US-202016850174-A
Country	US
Kind code	B2
Filing date	Apr 16, 2020
Priority date	Oct 26, 2017
Publication date	Aug 10, 2021
Grant date	Aug 10, 2021

Abstract

A multilayer substrate includes a base body including a first main surface, a first external electrode provided on the first main surface and made of metal foil, a first interlayer connection conductor, and a second interlayer connection conductor having higher conductivity than the first interlayer connection conductor. The base body includes insulating base material layers that are stacked on one another. The first interlayer connection conductor is provided at least in an insulating base material layer on which the first external electrode is provided, and is connected to the first external electrode. The second interlayer connection conductor is disposed inside the base body, and is connected to the first external electrode through the first interlayer connection conductor.

First claim

What is claimed is:

1. A multilayer substrate comprising:
a base body including:
a plurality of insulating base material layers stacked on one another; and
a first main surface perpendicular or substantially perpendicular to a stacking direction in which the plurality of insulating base material layers are stacked;

a first external electrode on the first main surface and made of metal foil;
a first interlayer connection conductor connected to the first external electrode and disposed in the base body so as to penetrate one or more of the plurality of the insulating base material layers;
a second interlayer connection conductor disposed in the base body so as to penetrate one or more of the plurality of insulating base material layers; and
a third interlayer connection conductor disposed in the base body so as to penetrate one or more of the plurality of insulating base material layers; wherein
the second interlayer connection conductor includes a first end and a second end in the stacking direction;
the first end of the second interlayer connection conductor is directly connected to the first interlayer connection conductor;
the second end of the second interlayer connection conductor is directly connected to the third interlayer connection conductor; and
the second interlayer connection conductor has higher conductivity than the first interlayer connection conductor and the third interlayer connection conductor.

2. The multilayer substrate according to claim 1 , wherein the first interlayer connection conductor is provided at least in an insulating base material layer on which the first external electrode is provided, among the plurality of insulating base material layers.

3. The multilayer substrate according to claim 2 , wherein the first interlayer connection conductor is provided only in an insulating base material layer on which the first external electrode is provided.

4. The multilayer substrate according to claim 1 , wherein
the base body includes a second main surface that faces the first main surface;
the multilayer substrate further includes a second external electrode on the second main surface and made of metal foil; and
the third interlayer connection conductor is provided at least in an insulating base material layer on which the second external electrode is provided, among the plurality of insulating base material layers, and connected to the second external electrode.

5. The multilayer substrate according to claim 4 , wherein the third interlayer connection conductor is provided only in the insulating base material layer on which the second external electrode is provided.

6. The multilayer substrate according to claim 1 , wherein a length of the base body in the stacking direction is larger than a length of the base body in a direction perpendicular or substantially perpendicular to the stacking direction.

7. The multilayer substrate according to claim 1 , wherein
the base body includes an end surface perpendicular or substantially perpendicular to the first main surface; and
a planar conductor is provided on the end surface.

8. The multilayer substrate according to claim 1 , wherein the second interlayer connection conductor is disposed in two or more insulating base material layers among the plurality of insulating base material layers.

9. The multilayer substrate according to claim 1 , wherein a length of the second interlayer connection conductor in the stacking direction is larger than a length of an interlayer connection conductor in the stacking direction, the interlayer connection conductor being electrically connected to the second interlayer connection conductor.

10. The multilayer substrate according to claim 1 , further comprising:
a signal line defining at least a portion of a high-frequency transmission line; wherein
the signal line includes the first interlayer connection conductor and the second interlayer connection conductor.

11. The multilayer substrate according to claim 1 , wherein at least one of the plurality of insulating base material layers includes the first interlayer connection conductor and the second interlayer connection conductor, or the third interlayer connection conductor and the second interlayer connection conductor.

12. An interposer disposed between a first element and a second element and electrically connecting the first element and the second element, the interposer comprising:
a base body including:
a plurality of insulating base material layers stacked on one another; and
a first main surface and a second main surface perpendicular or substantially perpendicular to a stacking direction in which the plurality of insulating base material layers are stacked, the first main surface and the second main surface facing each other;

a first external electrode on the first main surface and made of metal foil;
a second external electrode on the second main surface and made of metal foil;
a first interlayer connection conductor connected to the first external electrode and disposed in the base body so as to penetrate one or more of the plurality of the insulating base material layers;
a second interlayer connection conductor disposed in the base body so as to penetrate one or more of the plurality of insulating base material layers; and
a third interlayer connection conductor connected to the second external electrode and disposed in the base body so as to penetrate one or more of the plurality of insulating base material layers; wherein
the second interlayer connection conductor includes a first end and a second end in the stacking direction;
the first end of the second interlayer connection conductor is directly connected to the first interlayer connection conductor;
the second end of the second interlayer connection conductor is directly connected to the third interlayer connection conductor; and
the second interlayer connection conductor has higher conductivity than the first interlayer connection conductor and the third interlayer connection conductor.

13. The interposer according to claim 12 , wherein
the first interlayer connection conductor is provided at least in an insulating base material layer on which the first external electrode is provided, among the plurality of insulating base material layers; and
the third interlayer connection conductor is provided at least in an insulating base material layer on which the second external electrode is provided, among the plurality of insulating base material layers.

14. The interposer according to claim 12 , wherein wiring between the first external electrode and the second external electrode is provided only by the first interlayer connection conductor, the second interlayer connection conductor, and the third interlayer connection conductor.

15. The interposer according to claim 12 , wherein
the base body includes an end surface perpendicular or substantially perpendicular to the first main surface; and
the interposer further includes a planar conductor on the end surface.

16. The interposer according to claim 12 , wherein at least one of the plurality of insulating base material layers includes the first interlayer connection conductor and the second interlayer connection conductor, or the third interlayer connection conductor and the second interlayer connection conductor.

17. An electronic device comprising:
a first element;
a second element; and
an interposer disposed between the first element and the second element and electrically connecting the first element and the second element, the interposer comprising:
a base

Assignees

• Murata Manufacturing Co

Inventors

• Koyama Hiromasa
• Takada Ryosuke
• Kasuya Atsushi

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W70/685

  comprising multiple insulating layers · CPC title

• H10W90/401

  characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title

• H05K2201/0145

  Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN] · CPC title

• H05K2201/042

  Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other · CPC title