Laminated body and method for manufacturing the same

US11445606B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11445606-B2
Application numberUS-202117206303-A
CountryUS
Kind codeB2
Filing dateMar 19, 2021
Priority dateOct 4, 2018
Publication dateSep 13, 2022
Grant dateSep 13, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A stacked body includes a first resin layer including a thermoplastic first resin as a main material, a pattern including a conductor layer on one principal surface of the first resin layer, and a second resin layer including a thermoplastic second resin as a main material. The first resin layer is softer than the second resin layer. The first resin layer has a lower dielectric constant than the second resin layer. A pattern including the conductor layer is at least partially embedded in the first resin layer, and includes a portion in contact with the first resin layer along a layer direction (X-Y plane) of the first resin layer and a portion in contact with the first resin layer along a stacking direction (X-Z plane) of the first resin layer, the second resin layer, and the pattern including the conductor layer.

First claim

Opening claim text (preview).

What is claimed is: 1. A stacked body comprising: a first resin layer including thermoplastic; a conductor pattern provided on one principal surface of the first resin layer; and a second resin layer including thermoplastic; wherein the first resin layer is softer than the second resin layer; the first resin layer has a lower dielectric constant than the second resin layer; the conductor pattern includes a portion in contact with the first resin layer along a layer direction of the first resin layer and a portion in contact with the first resin layer along a stacking direction of the first resin layer, the second resin layer, and the conductor pattern; the conductor pattern is in contact with the second resin layer; and in a cross section in the stacking direction of the stacked body, in a peripheral length of the conductor pattern, a length of a portion where the conductor pattern is in contact with the first resin layer is larger than a length of a portion in contact with the second resin layer. 2. The stacked body according to claim 1 , wherein a thickness of the second resin layer is larger than a thickness of the first resin layer. 3. The stacked body according to claim 1 , wherein a main material of the first resin layer is fluororesin; and a main material of the second resin layer is a liquid crystal polymer. 4. The stacked body according to claim 1 , wherein a surface roughness of one principal surface in contact with the first resin layer of the conductor pattern is larger than a surface roughness of the other principal surface. 5. The stacked body according to claim 1 , wherein the second resin layer sandwiches the first resin layer from both sides in the stacking direction. 6. The stacked body according to claim 1 , further comprising: a plurality of stacked sheets including a single first resin layer, a single second resin layer, and a single layer of the conductor pattern; wherein the conductor pattern of one stacked sheet of plurality of stacked sheets adjacent in the stacking direction and the second resin layer of another stacked sheet of the plurality of stacked sheet are in contact with each other. 7. The stacked body according to claim 6 , wherein the plurality of stacked sheets include a first stacked sheet, a second stacked sheet, and a third stacked sheet sequentially arranged in the stacking direction; the conductor pattern provided on the second stacked sheet is a signal conductor pattern; the conductor pattern provided on the first stacked sheet is a first ground conductor pattern; the conductor pattern provided on the third stacked sheet is a second ground conductor pattern; and the signal conductor pattern, the first ground conductor pattern, and the second ground conductor pattern define a main portion of a transmission line. 8. The stacked body according to claim 7 , wherein the signal conductor pattern is sandwiched between a second protruding portions of the single second resin layer of the first stacked sheet in a plane direction perpendicular or substantially perpendicular to the stacking direction. 9. The stacked body according to claim 8 , wherein a surface roughness on the single first resin layer side of the signal conductor pattern is smaller than a surface roughness on the single first resin layer side of the first ground conductor pattern. 10. The stacked body according to claim 7 , wherein the first stacked sheet includes a first interlayer connecting conductor conducting to the first ground conductor pattern; the second stacked sheet includes a second interlayer connecting conductor conducting to the second ground conductor patter; and the first interlayer connecting conductor and the second interlayer connecting conductor overlap each other in the stacking direction. 11. The stacked body according to claim 1 , further comprising: a plurality of stacked sheets including a single first resin layer, a single second resin layer, and a single layer of the conductor pattern; wherein each of two stacked sheets of the plurality of stacked sheets adjacent to each other in the stacking direction includes an interlayer connecting conductor that penetrates the first resin layer and the second resin layer and includes an opposite surface wider than a surface in contact with the conductor pattern; and the opposite surfaces of the interlayer connecting conductors face each other and the interlayer connecting conductors are directly joined. 12. A stacked body comprising: a first resin layer including thermoplastic; a conductor pattern provided on one principal surface of the first resin layer; and two second resin layers including thermoplastic; wherein the first resin layer is softer than the second resin layer; the conductor pattern includes a portion in contact with the first resin layer along a layer direction of the first resin layer and a portion in contact with the first resin layer along a stacking direction of the first resin layer, the second resin layer, and the conductor pattern; the conductor pattern is in contact with one of the second resin layers; another one of the second resin layers is in contact with a surface opposite to that of the conductor pattern in the first resin layer; and the another one of the second resin layers includes a second protruding portion along a corner portion of the conductor pattern embedded in the first resin layer. 13. The stacked body according to claim 12 , wherein the first resin layer has a lower dielectric constant than the second resin layer. 14. The stacked body according to claim 12 , wherein a cross-sectional shape of the conductor pattern in the stacking direction of the stacked body includes a corner portion embedded in the first resin layer. 15. The stacked body according to claim 14 , wherein the first resin layer includes a first protruding portion along the corner portion of the conductor pattern embedded in the first resin layer on a surface opposite to a surface on which the conductor pattern is provided. 16. The stacked body according to claim 14 , further comprising: an inclined portion at an edge of the conductor pattern in the cross-sectional shape; wherein the corner portion embedded in the first resin layer has an acute angle. 17. The stacked body according to claim 12 , wherein the first resin layer sandwiches the conductor pattern from both sides in the stacking direction. 18. The stacked body according to claim 12 , wherein the conductor pattern is sandwiched in the layer direction by a plurality of the second protruding portions. 19. A method for manufacturing a stacked body, the method comprising: providing a conductor foil on a first resin layer including a first resin as a main material; stacking a second resin layer including a second resin as a main material on the first resin layer to form a stacked sheet including the first resin layer, the second resin layer, and the conductor foil; patterning the conductor foil; and stacking and heat-pressing a plurality of the stacked sheets to cause at least a portion of the conductor foil to be embedded in the first resin layer; wherein the conductor foil is in contact with the second resin layer; and in a cross section in a stacking direction of a stacked body, in a peripheral length of the conductor foil, a length of a portion at which the conductor foil is in contact with the first resin layer is larger than a length of a portion in contact with the second resin layer. 20. A method for manufacturing a stacked body,

Assignees

Inventors

Classifications

  • H05K1/036Primary

    Multilayers with layers of different types · CPC title

  • PCBs, i.e. printed circuit boards · CPC title

  • characterised by {at least one} layer folded at the edge, e.g. over another layer {; characterised by at least one layer enveloping or enclosing a material} · CPC title

  • Electric or magnetic properties · CPC title

  • onto a polymeric substrate · CPC title

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Frequently asked questions

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What does patent US11445606B2 cover?
A stacked body includes a first resin layer including a thermoplastic first resin as a main material, a pattern including a conductor layer on one principal surface of the first resin layer, and a second resin layer including a thermoplastic second resin as a main material. The first resin layer is softer than the second resin layer. The first resin layer has a lower dielectric constant than th…
Who is the assignee on this patent?
Murata Manufacturing Co
What technology area does this patent fall under?
Primary CPC classification H05K1/036. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 13 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).