Multilayer substrate, interposer, and electronic device

Patent metadata

Field	Value
Publication number	US-11510315-B2
Application number	US-202117368912-A
Country	US
Kind code	B2
Filing date	Jul 7, 2021
Priority date	Oct 26, 2017
Publication date	Nov 22, 2022
Grant date	Nov 22, 2022

Abstract

A multilayer substrate includes a base body including a first main surface, a first external electrode provided on the first main surface and made of metal foil, a first interlayer connection conductor, and a second interlayer connection conductor having higher conductivity than the first interlayer connection conductor. The base body includes insulating base material layers that are stacked on one another. The first interlayer connection conductor is provided at least in an insulating base material layer on which the first external electrode is provided, and is connected to the first external electrode. The second interlayer connection conductor is disposed inside the base body, and is connected to the first external electrode through the first interlayer connection conductor.

First claim

What is claimed is:

1. A multilayer substrate comprising:
a base body including:
a plurality of insulating base material layers stacked on one another; and
a first main surface perpendicular or substantially perpendicular to a stacking direction in which the plurality of insulating base material layers are stacked;

a plurality of first external electrodes on the first main surface and made of metal foils;
a plurality of first interlayer connection conductors connected to the plurality of first external electrodes and disposed in the base body;
at least one second interlayer connection conductor disposed in the base body; and
at least one third interlayer connection conductor disposed in the base body; wherein
the multilayer substrate further includes a first interlayer connection portion connected to at least one metal foil of one of the plurality of first external electrodes and a second interlayer connection portion connected to at least another metal foil of the plurality of first external electrodes;
the first interlayer connection portion is provided by at least one of the plurality of first interlayer connection conductors, the at least one second interlayer connection conductor, and the at least one third interlayer connection conductor;
the second interlayer connection portion is provided by at least another one of the plurality of first interlayer connection conductors, or by at least another one of the plurality of first interlayer connection conductors and another third interlayer connection conductor;
the at least one second interlayer connection conductor has higher conductivity than the plurality of first interlayer connection conductors and the at least one third interlayer connection conductor; and
the plurality of first interlayer connection conductors, the at least one second interlayer connection conductor, and the at least one third interlayer connection conductor are respectively disposed in the base body so as to penetrate through one or more of the plurality of insulating base material layers.

2. The multilayer substrate according to claim 1 , wherein the at least one second interlayer connection conductor is directly connected to the at least one of the plurality of first interlayer connection conductors at one end in the stacking direction, and directly connected to the at least one third interlayer connection conductor at another end in the stacking direction.

3. The multilayer substrate according to claim 1 , wherein the at least one of the plurality of first interlayer connection conductors is provided at least in an insulating base material layer on which the plurality of first external electrodes are provided, among the plurality of insulating base material layers.

4. The multilayer substrate according to claim 3 , wherein the at least one of the plurality of first interlayer connection conductors is provided only in the insulating base material layer on which the plurality of first external electrodes are provided.

5. The multilayer substrate according to claim 1 , wherein
the base body further includes a second main surface that faces the first main surface;
the multilayer substrate further includes a second external electrode on the second main surface and made of metal foil; and
the at least one third interlayer connection conductor is provided at least in an insulating base material layer on which the second external electrode is provided, among the plurality of insulating base material layers, and connected to the second external electrode.

6. The multilayer substrate according to claim 5 , wherein the at least one third interlayer connection conductor is provided only in the insulating base material layer on which the second external electrode is provided.

7. The multilayer substrate according to claim 1 , wherein a length of the base body in the stacking direction is larger than a length of the base body in a direction perpendicular or substantially perpendicular to the stacking direction.

8. The multilayer substrate according to claim 1 , wherein
the base body includes an end surface perpendicular or substantially perpendicular to the first main surface; and
a planar conductor is provided on the end surface.

9. The multilayer substrate according to claim 1 , wherein the at least one second interlayer connection conductor is disposed in two or more insulating base material layers among the plurality of insulating base material layers.

10. The multilayer substrate according to claim 1 , wherein a length of the at least one second interlayer connection conductor in the stacking direction is larger than a length of an interlayer connection conductor in the stacking direction, the interlayer connection conductor being electrically connected to the at least one second interlayer connection conductor.

11. The multilayer substrate according to claim 1 , further comprising:
a signal line defining at least a portion of a high-frequency transmission line; wherein
the signal line includes the at least one of the plurality of first interlayer connection conductors and the at least one second interlayer connection conductor.

12. The multilayer substrate according to claim 1 , wherein at least one of the plurality of insulating base material layers includes at least one of the plurality of first interlayer connection conductors and the at least one second interlayer connection conductor, or the at least one third interlayer connection conductor and the at least one second interlayer connection conductor.

13. An interposer disposed between a first element and a second element and electrically connecting the first element and the second element, the interposer comprising:
a base body including:
a plurality of insulating base material layers stacked on one another; and
a first main surface and a second main surface perpendicular or substantially perpendicular to a stacking direction in which the plurality of insulating base material layers are stacked, the first main surface and the second main surface facing each other;

a plurality of first external electrodes on the first main surface and made of metal foils;
a second external electrode on the second main surface and made of metal foil;
a plurality of first interlayer connection conductors connected to the plurality of first external electrodes and disposed in the base body;
at least one second interlayer connection conductor disposed in the base body; and
at least one third interlayer connection conductor disposed in the base body; wherein
the interposer further includes a first interlayer connection portion connected to at least one metal foil of one of the plurality of first external electrodes and a second interlayer connection portion connected to at least another metal foil of the plurality of first external electrodes;
the first interlayer connection portion is provided by at least one of the plurality of first interlayer connection conductors, the at least one second interlayer connection conductor, and the at least one third interlayer connection conductor;
the second interlayer connection portion is provided by at least another one of the plurality of first interlayer connection conductors, or by at least another one of the plurality of first interlayer connection conductors and another third interlayer connection conductor;
the at least one second interlayer connection conductor has higher conductivity than the plurality of first interlayer connection conductors and the at least one third interlayer connection conductors; and
the plurality of first interlayer connection conductors, the at least one second interlayer connection conductor,

Assignees

• Murata Manufacturing Co

Inventors

• Koyama Hiromasa
• Takada Ryosuke
• Kasuya Atsushi

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W70/685

  comprising multiple insulating layers · CPC title

• H10W90/401

  characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title

• H05K3/4644

  by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602) · CPC title

• H05K2201/10378

  Interposers · CPC title