Resin substrate and method for manufacturing resin substrate

Patent metadata

Field	Value
Publication number	US-11659652-B2
Application number	US-202117318265-A
Country	US
Kind code	B2
Filing date	May 12, 2021
Priority date	Nov 29, 2018
Publication date	May 23, 2023
Grant date	May 23, 2023

Abstract

A resin substrate includes an insulating base material including opposing first and second main surfaces, at least one of which is parallel or substantially parallel to each of an X-axis direction and a Y-axis direction. The insulating base material is divided into first and second sections arranged in the X-axis direction. The first section includes, when evenly divided into three in a Z-axis direction, a first region closest to the first main surface, a second region closest to the second main surface, and a third region between the first region and the second region. A degree of resin molecular orientation in the first region in the Y-axis direction is greater than a degree of resin molecular orientation in the second section of the insulating base material in the Y-axis direction.

First claim

What is claimed is:

1. A resin substrate comprising:
an insulating base material including a first main surface and a second main surface at least one of which is parallel or substantially parallel to each of an X-axis direction and a Y-axis direction in an X-Y-Z orthogonal coordinate system, the first main surface and the second main surface opposing each other; wherein
the insulating base material includes at least one resin layer including a liquid crystal polymer (LCP);
the insulating base material is divided into a first section and a second section each of which is arranged in the X-axis direction;
the first section includes, when evenly divided into three in a Z-axis direction, a first region closest to the first main surface, a second region closest to the second main surface, and a third region between the first region and the second region;
a degree of resin molecular orientation in the first region in the Y-axis direction is greater than a degree of resin molecular orientation in the second section of the insulating base material in the Y-axis direction; and
the degree of resin molecular orientation in the first region in the Y-axis direction is greater than a degree of resin molecular orientation in the first region in the X-axis direction.

2. The resin substrate according to claim 1 , wherein a degree of resin molecular orientation in the third region in the Y-axis direction is greater than the degree of resin molecular orientation in the second section of the insulating base material in the Y-axis direction.

3. The resin substrate according to claim 2 , wherein
the degree of resin molecular orientation in the first region in the Y-axis direction is greater than each of a degree of resin molecular orientation in the second region in the Y-axis direction and the degree of resin molecular orientation in the third region in the Y-axis direction; and
the degree of resin molecular orientation in the third region in the Y-axis direction is greater than the degree of resin molecular orientation in the second region in the Y-axis direction.

4. The resin substrate according to claim 1 , wherein a degree of resin molecular orientation in the second region in the X-axis direction is greater than a degree of resin molecular orientation in the second section of the insulating base material in the X-axis direction.

5. A resin substrate comprising:
an insulating base material including a first main surface and a second main surface at least one of which is parallel or substantially parallel to each of an X-axis direction and a Y-axis direction in an X-Y-Z orthogonal coordinate system, the first main surface and the second main surface opposing each other; wherein
the insulating base material is divided into a first section and a second section each of which is arranged in the X-axis direction;
the first section includes, when evenly divided into three in a Z-axis direction, a first region closest to the first main surface, a second region closest to the second main surface, and a third region between the first region and the second region; and
a degree of resin molecular orientation in the second region in the X-axis direction is greater than a degree of resin molecular orientation in the second section of the insulating base material in in the X-axis direction.

6. The resin substrate according to claim 4 , wherein a degree of resin molecular orientation in the third region in the X-axis direction is greater than the degree of resin molecular orientation in the second section of the insulating base material in the X-axis direction.

7. The resin substrate according to claim 6 , wherein
the degree of resin molecular orientation in the second region in the X-axis direction is greater than each of the degree of resin molecular orientation in the first region in the X-axis direction and the degree of resin molecular orientation in the third region in the X-axis direction; and
the degree of resin molecular orientation in the third region in the X-axis direction is greater than the degree of resin molecular orientation in the first region in the X-axis direction.

8. The resin substrate according to claim 1 , wherein the insulating base material includes a bent portion in the first section, the bent portion being bent in the Z-axis direction.

9. The resin substrate according to claim 1 , wherein in the second section, a degree of resin molecular orientation in the X-axis direction and the degree of resin molecular orientation in the Y-axis direction are isotropic.

10. The resin substrate according to claim 9 , further comprising a mounting electrode in the second section.

11. The resin substrate according to claim 9 , further comprising an interlayer connection conductor in the second section.

12. The resin substrate according to claim 1 , wherein the insulating base material includes a photo-oriented polymer.

13. The resin substrate according to claim 1 , wherein the insulating base material includes a plurality of the resin layers, each made of a thermoplastic resin and including the liquid crystal polymer (LCP), and the plurality of resin layers are laminated on each other.

14. The resin substrate according to claim 13 , wherein a dielectric constant of the third region is smaller than at least one of a dielectric constant of the first region and a dielectric constant of the second region.

15. The resin substrate according to claim 14 , further comprising:
a signal line in or on the insulating base material; wherein
at least a portion of the signal line is in the third region.

16. The resin substrate according to claim 14 , further comprising:
a ground conductor on the insulating base material; wherein
at least a portion of the ground conductor is in at least one of the first region and the second region.

17. A resin substrate comprising:
an insulating base material including a first main surface and a second main surface at least one of which is parallel or substantially parallel to each of an X-axis direction and a Y-axis direction in an X-Y-Z orthogonal coordinate system, the first main surface and the second main surface opposing each other; wherein
the insulating base material is divided into a first section and a second section each of which is arranged in the X-axis direction;
the first section includes, when evenly divided into three in a Z-axis direction, a first region closest to the first main surface, a second region closest to the second main surface, and a third region between the first region and the second region;
a Young's modulus in the first region in the Y-axis direction is greater than a Young's modulus in the second section in the Y-axis direction; and
a Young's modulus in the first region in the X-axis direction is smaller than a Young's modulus in the second section in the X-axis direction.

18. A resin substrate comprising:
an insulating base material including a first main surface and a second main surface at least one of which is parallel or substantially parallel to each of an X-axis direction and a Y-axis direction in an X-Y-Z orthogonal coordinate system, the first main surface and the second main surface opposing each other; wherein
the insulating base material is divided into a first section and a second section each of which is arranged in the X-axis direction;
the first section includes, when evenly divided into three in a Z-axis direction, a first region closest to the first main surface, a second region positioned to the second main surface, and a third region between the first region and the second reg

Assignees

• Murata Manufacturing Co

Inventors

• Takada Ryosuke

Classifications

• H05K1/148

  Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means · CPC title

• H05K2201/0195

  Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure · CPC title

• H05K1/028 Primary

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title

• H01R12/62

  connecting to rigid printed circuits or like structures · CPC title

• H05K2201/0129

  Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer · CPC title