Resin multilayer substrate and method for manufacturing resin multilayer substrate

Patent metadata

Field	Value
Publication number	US-12036776-B2
Application number	US-202117331744-A
Country	US
Kind code	B2
Filing date	May 27, 2021
Priority date	Dec 13, 2018
Publication date	Jul 16, 2024
Grant date	Jul 16, 2024

Abstract

A resin multilayer substrate includes a laminate including resin layers including a first resin layer and a second resin layer that are laminated, a via conductor in the first resin layer, and a joint portion that includes at least a portion in the second resin layer and is joined to the via conductor. The joint portion is more brittle than the via conductor. A linear expansion coefficient of the second resin layer is larger than a linear expansion coefficient of the via conductor and a linear expansion coefficient of the joint portion, and is smaller than a linear expansion coefficient of the first resin layer.

First claim

What is claimed is:

1. A resin multilayer substrate comprising:
a laminate including a plurality of laminated resin layers including a first resin layer and a second resin layer;
a via conductor in the first resin layer;
a joint portion including at least a portion in the second resin layer and joined to the via conductor; and
a conductor in the laminate and connected to the via conductor by the joint portion; wherein
the joint portion is more brittle than the via conductor;
a Vickers hardness of the joint portion is lower than a Vickers hardness of the via conductor; and
a linear expansion coefficient of the second resin layer is larger than a linear expansion coefficient of the via conductor and a linear expansion coefficient of the joint portion, and is smaller than a linear expansion coefficient of the first resin layer.

2. The resin multilayer substrate according to claim 1 , wherein the joint portion is not in contact with the first resin layer.

3. The resin multilayer substrate according to claim 1 , wherein an interface between the via conductor and the joint portion is positioned in the second resin layer.

4. A resin multilayer substrate comprising:
a laminate including a plurality of laminated resin layers including a first resin layer and a second resin layer;
a via conductor in the first resin layer;
a joint portion including at least a portion in the second resin layer and joined to the via conductor;
a conductor in the laminate and connected to the via conductor by the joint portion; and
a planar conductor in the laminate; wherein
the joint portion is more brittle than the via conductor;
a linear expansion coefficient of the second resin layer is larger than a linear expansion coefficient of the via conductor and a linear expansion coefficient of the joint portion, and is smaller than a linear expansion coefficient of the first resin layer;
the via conductor has a circular or substantially circular truncated cone shape including a first surface and a second surface larger than the first surface;
the first surface of the via conductor is connected to the planar conductor and the second surface of the via conductor is joined to the joint portion; and
the planar conductor and the via conductor are made of a same material.

5. The resin multilayer substrate according to claim 4 , wherein
the via conductor includes a plurality of via conductors and the second resin layer includes a plurality of second resin layers;
two of the plurality of second resin layers are adjacent to each other; and
the second surface of two of the plurality via conductors in the two second resin layers are connected to each other by the joint portion only in contact with the second resin layers.

6. A resin multilayer substrate comprising:
a laminate including a plurality of laminated resin layers including a first resin layer and a second resin layer;
a via conductor in the first resin layer;
a joint portion including at least a portion in the second resin layer and joined to the via conductor; and
a conductor in the laminate and connected to the via conductor by the joint portion; wherein
the joint portion is more brittle than the via conductor;
a linear expansion coefficient of the second resin layer is larger than a linear expansion coefficient of the via conductor and a linear expansion coefficient of the joint portion, and is smaller than a linear expansion coefficient of the first resin layer;
a relative permittivity of the first resin layer is lower than a relative permittivity of the second resin layer; and
a thickness of the first resin layer is larger than a thickness of the second resin layer.

7. The resin multilayer substrate according to claim 6 , wherein
the first resin layer includes fluororesin as a main component; and
the second resin layer includes liquid crystal polymer as a main component.

8. A resin multilayer substrate comprising:
a laminate including a plurality of laminated resin layers including a first resin layer and a second resin layer;
a via conductor in the first resin layer;
a joint portion including at least a portion in the second resin layer and joined to the via conductor; and
a conductor in the laminate and connected to the via conductor by the joint portion; wherein
the joint portion is more brittle than the via conductor;
a linear expansion coefficient of the second resin layer is larger than a linear expansion coefficient of the via conductor and a linear expansion coefficient of the joint portion, and is smaller than a linear expansion coefficient of the first resin layer; and
the plurality of resin layers are made of thermoplastic resin.

9. A resin multilayer substrate, comprising:
a laminate including a plurality of laminated resin layers including a first resin layer and a second resin layer;
a via conductor in the first resin layer;
a joint portion including at least a portion in the second resin layer and joined to the via conductor; and
a conductor in the laminate and connected to the via conductor by the joint portion; wherein
the joint portion is more brittle than the via conductor;
a linear expansion coefficient of the second resin layer is larger than a linear expansion coefficient of the via conductor and a linear expansion coefficient of the joint portion, and is smaller than a linear expansion coefficient of the first resin layer; and
the laminate includes a bent portion.

Assignees

• Murata Manufacturing Co

Inventors

• Kamitsubo Yusuke
• Katsube Tsuyoshi
• Takada Ryosuke

Classifications

• B32B3/02

  characterised by features of form at particular places, e.g. in edge regions {(non-uniform thickness B32B3/263)} · CPC title

• H05K1/036

  Multilayers with layers of different types · CPC title

• H05K1/028

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• B32B7/027

  Thermal properties · CPC title