Resin multilayer substrate and electronic apparatus

Patent metadata

Field	Value
Publication number	US-11266016-B2
Application number	US-202117319396-A
Country	US
Kind code	B2
Filing date	May 13, 2021
Priority date	Dec 13, 2018
Publication date	Mar 1, 2022
Grant date	Mar 1, 2022

Abstract

A resin multilayer substrate includes a multilayer body including resin layers and adhesive layers that are laminated, via conductors in the resin layers, and bonding portions in the adhesive layers. The bonding portion is connected to the via conductor. One of the resin layer and the adhesive layer is a gas high-permeable layer having a higher gas permeability than the other one. The bonding portion includes an organic substance, or has a higher void content rate per unit plane sectional area than the via conductor. At least a portion of each of the bonding portions contacts the gas high-permeable layers.

First claim

What is claimed is:

1. A resin multilayer substrate comprising:
a multilayer body including a resin layer and an adhesive layer that are laminated;
via conductors in the resin layer; and
a bonding portion in the adhesive layer and connected to at least one of the via conductors; wherein
the bonding portion is conductive;
a first one of the resin layer and the adhesive layer is a gas high-permeable layer having gas permeability higher than gas permeability of a second one of the resin layer and the adhesive layer, and the second one is a gas low-permeable layer having the gas permeability lower than the gas permeability of the first one of the resin layer and the adhesive layer; and
the bonding portion includes an organic substance or a portion having a void content rate per unit plane sectional area higher than a void content rate per unit plane sectional area of the via conductor, and at least a portion of the bonding portion contacts the gas high-permeable layer.

2. The resin multilayer substrate according to claim 1 , wherein a thickness of the via conductor is thicker than a thickness of the bonding portion.

3. The resin multilayer substrate according to claim 1 , wherein a thickness of a portion of the bonding portion in contact with the gas high-permeable layer is thicker than a thickness of a portion of the bonding portion in contact with the gas low-permeable layer.

4. The resin multilayer substrate according to claim 1 , wherein the bonding portion is in contact with only the gas high-permeable layer.

5. The resin multilayer substrate according to claim 1 , wherein an interface between the via conductor and the bonding portion is located in the gas high-permeable layer.

6. The resin multilayer substrate according to claim 1 , wherein a thickness of the gas high-permeable layer is thicker than a thickness of the gas low-permeable layer.

7. The resin multilayer substrate according to claim 1 , wherein the resin layer and the adhesive layer are each made of a thermoplastic resin.

8. The resin multilayer substrate according to claim 1 , wherein a relative dielectric constant of the gas high-permeable layer is lower than a relative dielectric constant of the gas low-permeable layer.

9. The resin multilayer substrate according to claim 8 , wherein
the gas high-permeable layer is a resin sheet including fluororesin as a main component; and
the gas low-permeable layer is a resin sheet including a liquid crystal polymer as a main component.

10. The resin multilayer substrate according to claim 1 , further comprising:
a first protective layer having gas permeability lower than gas permeability of the gas high-permeable layer; wherein
the multilayer body includes a first principal surface orthogonal or substantially orthogonal to a lamination direction of the resin layer and the adhesive layer, and a side surface adjacent to the first principal surface;
the first protective layer is on the first principal surface; and
the gas high-permeable layer is exposed to the side surface.

11. The resin multilayer substrate according to claim 10 , wherein
an electrode is provided on the principal surface of the multilayer body; and
the protective layer includes an opening that corresponds to a position of the electrode on the principal surface of the multilayer body.

12. The resin multilayer substrate according to claim 10 , further comprising
a second protective layer having gas permeability lower than the gas permeability of the gas high-permeable layer; wherein
the multilayer body includes a second principal surface orthogonal or substantially orthogonal to a lamination direction of the resin layer and the adhesive layer;
the second protective layer is provided on the second principal surface; and
the first principal surface and the second principal surface are different surfaces.

13. The resin multilayer substrate according to claim 1 , wherein
the multilayer body has a shape extending in one direction orthogonal or substantially orthogonal to a thickness direction, and includes a bent portion in the extending direction; and
of a set of the via conductor and the bonding portion that is present at a position closest to the bent portion and also closest to the principal surface being orthogonal or substantially orthogonal to the thickness direction and defining an outer surface of the multilayer body, the via conductor is provided on the principal surface side relative to the bonding portion.

14. The resin multilayer substrate according to claim 13 , wherein
sets of the via conductor and the bonding portion are located with respect to a first principal surface and a second principal surface provided at both ends in the thickness direction of the multilayer body, respectively;
of the set of the via conductor and the bonding portion adjacent to or in a vicinity of the first principal surface, the via conductor is provided on the first principal surface side relative to the bonding portion; and
of the set of the via conductor and the bonding portion adjacent to or in a vicinity of the second principal surface, the via conductor is provided on the second principal surface side relative to the bonding portion.

15. The resin multilayer substrate according to claim 13 , wherein a positional relationship between the via conductor and the bonding portion is provided for a set of the via conductor and the bonding portion adjacent to or in a vicinity of the principal surface on a side where an area of a planar conductor in the multilayer body is smaller.

16. The resin multilayer substrate according to claim 1 , wherein the bonding portion is directly connected to two of the via conductors.

17. The resin multilayer substrate according to claim 1 , wherein the bonding portion is solidified by heat during a heating press.

18. The resin multilayer substrate according to claim 1 , wherein
the resin multilayer substrate includes a first connection portion, a second connection portion, and a line portion;
the first connection portion includes a first mounting electrode and a first ground electrode;
the second connection portion includes a second mounting electrode and a second ground electrode; and
the line portion connects the first connection portion and the second connection portion.

19. The resin multilayer substrate according to claim 1 , wherein the bonding portion connects at least two of the via conductors.

20. An electronic apparatus comprising:
a resin multilayer substrate; and
another structure; wherein
the resin multilayer substrate includes:
a multilayer body including a resin layer and an adhesive layer that are laminated;
via conductors in the resin layer; and
a bonding portion in the adhesive layer and connected to at least one of the via conductors,

the bonding portion is conductive;
a first one of the resin layer and the adhesive layer is a gas high-permeable layer having gas permeability higher than gas permeability of a second one of the resin layer and the adhesive layer, and the second one of the resin layer and the adhesive layer is a gas low-permeable layer having the gas permeability lower than the gas permeability of the first one of the resin layer and the adhesive layer;
the bonding portion is a portion including an organic substance or a portion having a void content rate per unit plane sectional area higher than a void content rate per unit plane sectional area of the via conductor, and at least a portion of the bonding portion contacts the gas high-permeable layer;

Assignees

• Murata Manufacturing Co

Inventors

• Kamitsubo Yusuke
• Takada Ryosuke
• Katsube Tsuyoshi
• Kuratani Yasuhiro
• Tago Shigeru
• FURUMURA Tomohiro

Classifications

• H05K3/4632 Primary

  laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets · CPC title

• H05K3/4655

  by using a laminate characterized by the insulating layer (general-purpose insulating materials H05K1/03, H05K3/4673) · CPC title

• H05K2201/0141

  Liquid crystal polymer [LCP] · CPC title

• H05K3/4623

  the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards (H05K3/462 takes precedence) · CPC title

• H05K3/429

  Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers · CPC title