Prediction based chucking and lithography control optimization
US-10788759-B2 · Sep 29, 2020 · US
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Sinha Jaydeep patents
Sinha Jaydeep is listed as an inventor on 35 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Sinha Jaydeep |
| Total patents | 35 |
| First publication | Apr 30, 2015 |
| Latest publication | Sep 29, 2020 |
Notable patents
Publications ranked by popularity score, then publication date.
Patterned wafer geometry measurements for semiconductor process controls
US-10576603-B2 · Mar 3, 2020 · US
Systems, methods and metrics for wafer high order shape characterization and wafer classification using wafer dimensional geometry tool
US-2019271654-A1 · Sep 5, 2019 · US
Process-induced distortion prediction and feedforward and feedback correction of overlay errors
US-10401279-B2 · Sep 3, 2019 · US
Systems, methods and metrics for wafer high order shape characterization and wafer classification using wafer dimensional geometry tool
US-10379061-B1 · Aug 13, 2019 · US
Systems and methods for wafer structure uniformity monitoring using interferometry wafer geometry tool
US-10352691-B1 · Jul 16, 2019 · US
Prediction Based Chucking and Lithography Control Optimization
US-2018364579-A1 · Dec 20, 2018 · US
Prediction based chucking and lithography control optimization
US-10036964-B2 · Jul 31, 2018 · US
System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chucking
US-10025894-B2 · Jul 17, 2018 · US
Systems and methods for effective pattern wafer surface measurement and analysis using interferometry tool
US-9865047-B1 · Jan 9, 2018 · US
Recent patents
Latest publications not already listed above.
Process-induced asymmetry detection, quantification, and control using patterned wafer geometry measurements
US-9779202-B2 · Oct 3, 2017 · US
Predictive wafer modeling based focus error prediction using correlations of wafers
US-9707660-B2 · Jul 18, 2017 · US
Systems and methods for wafer surface feature detection and quantification
US-9702829-B1 · Jul 11, 2017 · US
Detection of selected defects in relatively noisy inspection data
US-9646379-B1 · May 9, 2017 · US
Hybrid phase unwrapping systems and methods for patterned wafer measurement
US-9632038-B2 · Apr 25, 2017 · US
Predicting and controlling critical dimension issues and pattern defectivity in wafers using interferometry
US-9558545-B2 · Jan 31, 2017 · US
Systems, methods and metrics for wafer high order shape characterization and wafer classification using wafer dimensional geometry tool
US-9546862-B2 · Jan 17, 2017 · US
Process-Induced Asymmetry Detection, Quantification, and Control Using Patterned Wafer Geometry Measurements
US-2016371423-A1 · Dec 22, 2016 · US
Using wafer geometry to improve scanner correction effectiveness for overlay control
US-9513565-B2 · Dec 6, 2016 · US
Hybrid Phase Unwrapping Systems and Methods for Patterned Wafer Measurement
US-2016321799-A1 · Nov 3, 2016 · US
System and Method to Emulate Finite Element Model Based Prediction of In-Plane Distortions Due to Semiconductor Wafer Chucking
US-2016283625-A1 · Sep 29, 2016 · US
System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chucking
US-9430593-B2 · Aug 30, 2016 · US
Prediction Based Chucking and Lithography Control Optimization
US-2016239600-A1 · Aug 18, 2016 · US
Enhanced patterned wafer geometry measurements based design improvements for optimal integrated chip fabrication performance
US-9373165-B2 · Jun 21, 2016 · US
Predicting and Controlling Critical Dimension Issues and Pattern Defectivity in Wafers Using Interferometry
US-2016163033-A1 · Jun 9, 2016 · US
Detection of selected defects in relatively noisy inspection data
US-9355440-B1 · May 31, 2016 · US
Enhanced Patterned Wafer Geometry Measurements Based Design Improvements for Optimal Integrated Chip Fabrication Performance
US-2016071260-A1 · Mar 10, 2016 · US
Systems and methods of advanced site-based nanotopography for wafer surface metrology
US-9177370-B2 · Nov 3, 2015 · US
Patterned Wafer Geometry Measurements for Semiconductor Process Controls
US-2015298282-A1 · Oct 22, 2015 · US
Predictive Modeling Based Focus Error Prediction
US-2015302312-A1 · Oct 22, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Kla Tencor Corp | 37 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G06T2207/30148 | 13 |
| G06T7/0004 | 10 |
| G01N21/9501 | 9 |
| G03F7/705 | 9 |
| H10P74/203 | 9 |