Prediction based chucking and lithography control optimization

Patent metadata

Field	Value
Publication number	US-10036964-B2
Application number	US-201514656422-A
Country	US
Kind code	B2
Filing date	Mar 12, 2015
Priority date	Feb 15, 2015
Publication date	Jul 31, 2018
Grant date	Jul 31, 2018

Abstract

Prediction based systems and methods for optimizing wafer chucking and lithography control are disclosed. Distortions predicted to occur when a wafer is chucked by a chucking device are calculated and are utilized to control chucking parameters of the chucking device. Chucking parameters may include chucking pressures and chucking sequences. In addition, predicted distortions may also be utilized to facilitate application of anticipatory corrections. Controlling chucking parameters and/or applying anticipatory corrections help reducing or minimizing overlay errors.

First claim

What is claimed is:

1. A method, comprising:
obtaining wafer geometry measurements of a wafer prior to the wafer being chucked by a chucking device;
calculating distortions of the wafer predicted to occur when the wafer is chucked by the chucking device, wherein the predicted distortions of the wafer are calculated at least partially based on the wafer geometry measurements and a mechanics model of the chucking device;
determining whether to adjust a chucking parameter of the chucking device at least partially based on the predicted distortions of the wafer;
determining the chucking parameter to correct overlay error based on shape data from two or more fabrication steps and an output of the mechanics model; and
upon determining to adjust the chucking parameter of the chucking device, providing control data to a chucking device of a fabrication tool and adjusting the chucking parameter.

2. The method of claim 1 , wherein the chucking parameter includes at least one of: a chucking pressure and a chucking sequence.

3. The method of claim 1 , wherein the predicted distortions include at least one of: a predicted in-plane distortion and a predicted out-plane distortion.

4. The method of claim 1 , wherein the predicted distortions are calculated at least in part utilizing a finite element (FE) prediction model.

5. The method of claim 1 , wherein the mechanics model is configured to simulate contact mechanics of the wafer and the chucking device based on the wafer geometry measurements and at least one of: chuck flatness data, initial contact configuration between the wafer and the chucking device, and frictions between the wafer and the chucking device.

6. The method of claim 1 , wherein the chucking parameter is adjusted to reduce distortions of the wafer predicted to occur when the wafer is chucked by the chucking device.

7. The method of claim 1 , wherein the chucking parameter is adjusted to reduce overlay errors.

8. The method of claim 1 , wherein said obtaining wafer geometry measurements of the wafer further comprises:
obtaining a first set of wafer geometry measurements of the wafer prior to the wafer undergoing a fabrication process; and
obtaining a second set of wafer geometry measurements of the wafer after the fabrication process.

9. The method of claim 1 , wherein the chucking device is utilized to chuck the wafer during at least one of: a lithography process, a chemical-mechanical polishing process, a rapid thermal processing process and a chemical vapor deposition process.

10. The method of claim 1 , wherein the chucking device is utilized to chuck the wafer during a lithography process, and wherein the chucking parameter is utilized to reduce distortions of the wafer during the lithography process.

11. The method of claim 10 , wherein the chucking parameter utilized to reduce distortions of the wafer during the lithography process includes an optimal chucking sequence.

12. The method of claim 11 , wherein the optimal chucking sequence reduces overlay errors, enables a lithography scanner to reduce focus or overlay mapping points and thereby improves throughput of the lithography scanner.

13. A method, comprising:
obtaining wafer geometry measurements of a wafer prior to the wafer being chucked by a chucking device;
calculating distortions of the wafer predicted to occur when the wafer is chucked by the chucking device, wherein the predicted distortions of the wafer are calculated at least partially based on the wafer geometry measurements and a mechanics model of the chucking device;
determining a chucking parameter to correct overlay error based on shape data from two or more fabrication steps and an output of the mechanics model; and
providing control data to a chucking device of a lithography tool and adjusting the chucking parameter.

14. The method of claim 13 , wherein the predicted distortions include at least one of: a predicted in-plane distortion and a predicted out-plane distortion.

15. The method of claim 13 , wherein the predicted distortions are calculated at least in part utilizing a finite element (FE) prediction model.

16. The method of claim 13 , wherein the mechanics model is configured to simulate contact mechanics of the wafer and the chucking device based on the wafer geometry measurements and at least one of: chuck flatness data, initial contact configuration between the wafer and the chucking device, and friction between the wafer and the chucking device.

17. The method of claim 13 , wherein said obtaining wafer geometry measurements of the wafer further comprises:
obtaining a first set of wafer geometry measurements of the wafer prior to the wafer undergoing a fabrication process; and
obtaining a second set of wafer geometry measurements of the wafer after the fabrication process.

18. The method of claim 13 , further comprising:
determining whether to adjust a chucking parameter of the chucking device at least partially based on the predicted distortions of the wafer, wherein the chucking parameter is utilized to reduce distortions of the wafer to reduce errors uncorrected by anticipatory corrections.

19. The method of claim 18 , wherein the chucking parameter includes an optimal chucking sequence.

20. The method of claim 19 , wherein the optimal chucking sequence reduces errors, enables a lithography scanner to reduce focus or overlay mapping points and thereby improves throughput of the lithography scanner.

21. A system, comprising:
a geometry measurement tool configured to obtain wafer geometry measurements of a wafer prior to the wafer being chucked by a chucking device; and
a prediction unit configured to:
calculate distortions of the wafer predicted to occur when the wafer is chucked by the chucking device, wherein the predicted distortions of the wafer are calculated at least partially based on the wafer geometry measurements and a mechanics model of the chucking device;
determine whether to adjust a chucking parameter of the chucking device at least partially based on the predicted distortions of the wafer;
determine the chucking parameter to correct overlay error based on shape data from two or more fabrication steps and an output of the mechanics model; and
upon determining to adjust the chucking parameter of the chucking device, provide control data to a chucking device of a fabrication tool and adjusting the chucking parameter.

22. The system of claim 21 , wherein the chucking parameter includes at least one of: a chucking pressure and a chucking sequence.

23. The system of claim 21 , wherein the predicted distortions include at least one of: a predicted in-plane distortion and a predicted out-plane distortion.

24. The system of claim 21 , wherein the predicted distortions are calculated at least in part utilizing a finite element (FE) prediction model.

25. The system of claim 21 , wherein the mechanics model is configured to simulate contact mechanics of the wafer and the chucking device based on the wafer geometry measurements and at least one of: chuck flatness data, initial contact configuration between the wafer and the chucking device, and frictions between the wafer and the chucking device.

26. The system of claim 21 , wherein the chucking parameter is adjusted to reduce distortions of the wafer predicted to occur when the wafer is chucked by the chucking device.

27. The system of claim 21 , wherein th

Assignees

• Kla Tencor Corp

Inventors

• Tsai Bin-Ming Benjamin
• Donzella Oreste
• Vukkadala Pradeep
• Sinha Jaydeep

Classifications

• G03F7/707 Primary

  Chucks, e.g. chucking or un-chucking operations or structural details · CPC title

• G03F7/70783

  Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight · CPC title