Hardmask for high aspect ratio dielectric etch at cryo and elevated temperatures
US-2025308894-A1 · Oct 2, 2025 · US
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Shen Meihua patents
Shen Meihua is listed as an inventor on 50 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Shen Meihua |
| Total patents | 50 |
| First publication | Sep 3, 2015 |
| Latest publication | Oct 2, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Film stack simplification for high aspect ratio patterning and vertical scaling
US-2024387258-A1 · Nov 21, 2024 · US
Techniques and apparatuses for processing chalcogenides
US-2024381790-A1 · Nov 14, 2024 · US
Film stack simplification for high aspect ratio patterning and vertical scaling
US-12080592-B2 · Sep 3, 2024 · US
Conformal damage-free encapsulation of chalcogenide materials
US-11832533-B2 · Nov 28, 2023 · US
Self-aligned vertical integration of three-terminal memory devices
US-11792987-B2 · Oct 17, 2023 · US
Protection of channel layer in three-terminal vertical memory structure
US-2023143057-A1 · May 11, 2023 · US
Method and apparatus for reducing particle defects in plasma etch chambers
US-11488812-B2 · Nov 1, 2022 · US
Conformal damage-free encapsulation of chalcogenide materials
US-2022115592-A1 · Apr 14, 2022 · US
Film stack simplification for high aspect ratio patterning and vertical scaling
US-2022051938-A1 · Feb 17, 2022 · US
Recent patents
Latest publications not already listed above.
Conformal damage-free encapsulation of chalcogenide materials
US-11239420-B2 · Feb 1, 2022 · US
Self-aligned vertical integration of three-terminal memory devices
US-2021391355-A1 · Dec 16, 2021 · US
Cobalt etch back
US-10784086-B2 · Sep 22, 2020 · US
Method and apparatus for reducing particle defects in plasma etch chambers
US-10658161-B2 · May 19, 2020 · US
Conformal damage-free encapsulation of chalcogenide materials
US-2020066987-A1 · Feb 27, 2020 · US
Method and apparatus for reducing particle defects in plasma etch chambers
US-2019295826-A1 · Sep 26, 2019 · US
Ale smoothness: in and outside semiconductor industry
US-10304659-B2 · May 28, 2019 · US
Liner and barrier applications for subtractive metal integration
US-10199235-B2 · Feb 5, 2019 · US
Atomic layer etching of tungsten and other metals
US-10096487-B2 · Oct 9, 2018 · US
Ale smoothness: in and outside semiconductor industry
US-2018233325-A1 · Aug 16, 2018 · US
Liner and barrier applications for subtractive metal integration
US-2018211846-A1 · Jul 26, 2018 · US
Chamber for patterning non-volatile metals
US-2018204738-A1 · Jul 19, 2018 · US
ALE smoothness: in and outside semiconductor industry
US-9984858-B2 · May 29, 2018 · US
Chamber for patterning non-volatile metals
US-9953843-B2 · Apr 24, 2018 · US
Cobalt etch back
US-2018102236-A1 · Apr 12, 2018 · US
Liner and barrier applications for subtractive metal integration
US-9899234-B2 · Feb 20, 2018 · US
Cobalt etch back
US-9870899-B2 · Jan 16, 2018 · US
Equipment front end module for transferring wafers and method of transferring wafers
US-9818633-B2 · Nov 14, 2017 · US
Chamber for patterning non-volatile metals
US-2017229317-A1 · Aug 10, 2017 · US
Residue free oxide etch
US-9595452-B2 · Mar 14, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 45 |
| Applied Materials Inc | 5 |
| Shen Meihua | 2 |
| Wang Xikun | 1 |
| Nguyen Andrew | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P50/267 | 19 |
| H01L21/32136 | 17 |
| H10P50/242 | 17 |
| H10P50/283 | 14 |
| C23F4/00 | 12 |