Cobalt etch back

Patent metadata

Field	Value
Publication number	US-10784086-B2
Application number	US-201715824987-A
Country	US
Kind code	B2
Filing date	Nov 28, 2017
Priority date	Apr 24, 2015
Publication date	Sep 22, 2020
Grant date	Sep 22, 2020

Abstract

Methods of etching cobalt on substrates are provided. Some methods involve exposing the substrate to a boron-containing halide gas and an additive, and exposing the substrate to an activation gas and a plasma. Additives improve selectively depositing a thicker layer of a boron-containing halide material on a surface of a mask than on a surface of a metal. Additives include H2, CH4, CF4, NF3, and Cl2. Boron-containing halide gases include BCl3, BBr3, BF3, and BI3. Exposures may be performed in two or more cycles, with variations in durations and/or bias power for each exposure in the two or more cycles.

First claim

What is claimed is:

1. An apparatus for processing a substrate, the apparatus comprising:
one or more process chambers, each process chamber comprising a chuck for supporting the substrate;
one or more gas sources for a boron-containing halide gas, an additive gas, and an activation gas;
one or more gas inlets into the process chambers and associated flow-control hardware; and
a controller having at least one processor and a memory, wherein
the at least one processor and the memory are communicatively connected with one another,
the at least one processor is at least operatively connected with the flow-control hardware, and
the memory stores computer-executable instructions for controlling the at least one processor to at least control the flow-control hardware by:
(i) flowing a boron-containing halide gas and an additive to at least one of the one or more process chambers, for a duration sufficient to selectively deposit a first layer of boron-containing halide material on a surface of a mask on the substrate, and the duration sufficient to selectively deposit a second layer of boron-containing halide material on a surface of a non-volatile metal of the substrate, wherein the first layer is thicker than the second layer; and
(ii) flowing an activation gas to the one of the one or more process chambers and igniting an activation source that ionizes the activation gas to form an activated activation gas reactive with the first and second layers of boron-containing halide material on the mask and the non-volatile metal to form etch products; and
wherein (i) and (ii) are conducted for a first set of cycles, followed by (i) and (ii) conducted for a second set of cycles, in which the duration of (i) is longer in the first set of cycles than the duration of (i) in the second set of cycles resulting in a net deposition process, and in which the duration of (ii) in the second set of cycles is longer than the duration of (ii) in the first set of cycles, resulting in a net etch process.

2. The apparatus of claim 1 , wherein the computer-executable instructions comprise that the second set of cycles is greater in number than the first set of cycles.

3. The apparatus of claim 2 , wherein the computer-executable instructions comprise that the first set of cycles numbers between 1 and 10, and the second set of cycles numbers between 20 and 30.

4. The apparatus of claim 3 , wherein the computer-executable instructions control a bias source to apply a bias during (ii) at a first bias power during the first set of cycles and a second bias power during the second set of cycles.

5. The apparatus of claim 4 , wherein the computer-executable instructions comprise that the second bias power is between about 30 V and about 150 V.

6. The apparatus of claim 1 , wherein the computer-executable instructions comprise that (ii) results in a self-limiting etch of the substrate.

7. The apparatus of claim 1 , wherein the computer-executable instructions control a bias source to apply a bias during (ii).

8. The apparatus of claim 1 , wherein the computer-executable instructions comprise that the additive is selected from the group consisting of H 2 , CH 4 , CF 4 , NF 3 , Cl 2 , and combinations thereof.

9. The apparatus of claim 1 , wherein the computer-executable instructions comprise that the computer-executable instructions comprise that the activation gas is selected from the group consisting of Ar, H 2 , CH 4 , CF 4 , He, Ne, Xe, NF 3 , and combinations thereof.

10. The apparatus of claim 1 , wherein the computer-executable instructions comprise that the boron-containing halide gas is selected from the group consisting of BCl 3 , BBr 3 , BF 3 , and BI 3 .

11. The apparatus of claim 1 , wherein the non-volatile metal is cobalt.

12. The apparatus of claim 1 , wherein the computer-executable instructions comprise that the activation source is a plasma.

13. The apparatus of claim 1 , wherein the computer-executable instructions comprise that (i) and (ii) are performed without breaking vacuum.

14. The apparatus of claim 1 , wherein the computer-executable instructions comprise that the computer-executable instructions comprise that (i) comprises a self-limiting reaction.

Assignees

• Lam Res Corp

Inventors

• Yang Jialing
• Zhou Baosuo
• Shen Meihua
• Lill Thorsten
• Hoang John

Classifications

• H10P50/267

  using plasmas · CPC title

• H10W72/013 Primary

  of die-attach connectors · CPC title

• H10P50/283

  by chemical means · CPC title

• H10P50/242 Primary

  of Group IV materials · CPC title

• H01J37/32926

  Software, data control or modelling · CPC title