Atomic layer etching of tungsten and other metals

Patent metadata

Field	Value
Publication number	US-10096487-B2
Application number	US-201615239138-A
Country	US
Kind code	B2
Filing date	Aug 17, 2016
Priority date	Aug 19, 2015
Publication date	Oct 9, 2018
Grant date	Oct 9, 2018

Abstract

Provided herein are methods of atomic layer etching (ALE) of metals including tungsten (W) and cobalt (Co). The methods disclosed herein provide precise etch control down to the atomic level, with etching a low as 1 Å to 10 Å per cycle in some embodiments. In some embodiments, directional control is provided without damage to the surface of interest. The methods may include cycles of a modification operation to form a reactive layer, followed by a removal operation to etch only this modified layer. The modification is performed without spontaneously etching the surface of the metal.

First claim

The invention claimed is:

1. A method comprising:
(a) exposing a surface of a metal on a substrate to a halide chemistry to form a modified halide-containing surface layer, the metal being selected from the group consisting of tungsten (W) and cobalt (Co); and
(b) applying a bias voltage to the substrate while exposing the modified halide-containing surface layer to a plasma to thereby remove the modified halide-containing surface layer.

2. The method of claim 1 , wherein the plasma is an argon plasma and the bias voltage in (b) is between about 50 Vb and 80 Vb.

3. The method of claim 1 , wherein (a) comprises exposing the surface of the metal to a plasma.

4. The method of claim 3 , wherein a bias is applied to the substrate during (a).

5. The method of claim 3 , wherein the bias voltage during (a) is equal to or less than 100 Vb.

6. The method of claim 3 , wherein the bias voltage during (a) is equal to or less than 50 Vb.

7. The method of claim 1 , wherein the metal is tungsten (W).

8. The method of claim 7 , wherein (a) comprises exposing the surface of the metal to a chlorine-containing plasma.

9. The method of claim 8 , wherein the substrate temperature during (a) is less than 150° C.

10. The method of claim 8 , wherein the chlorine-containing plasma is generated from a Cl 2 /BCl 3 mixture.

11. The method of claim 10 , wherein the Cl 2 /BCl 3 mixture is between 0.5% and 10% (volumetric) BCl 3 .

12. The method of claim 1 , wherein the metal is cobalt (Co).

13. The method of claim 1 , wherein (a) is performed without etching the surface of the metal.

14. A method
(a) exposing a tungsten surface on a substrate to a chlorine-containing plasma to form a tungsten-containing and chlorine-containing surface layer at substrate temperature less than 150° C.; and
(b) applying a bias voltage to the substrate while exposing the tungsten-containing and chlorine-containing surface layer to ions generated from an inert gas plasma to thereby remove tungsten-containing and chlorine-containing surface layer.

15. The method of claim 14 , wherein the chlorine-containing plasma is generated from a Cl 2 /BCl 3 mixture.

16. The method of claim 15 , wherein the Cl 2 /BCl 3 mixture is between 0.5% and 10% (volumetric) BCl 3 .

Assignees

• Lam Res Corp

Inventors

• Yang Wenbing
• Tan Samantha
• Kanarik Keren Jacobs
• Marks Jeffrey
• Kim Taeseung
• Shen Meihua
• Lill Thorsten

Classifications

• H10P72/0421

  for drying etching · CPC title

• H10W20/031

  of conductive parts of the interconnections · CPC title

• H10P50/267 Primary

  using plasmas · CPC title

• H10W20/064 Primary

  by modifying the conductivity of conductive parts, e.g. by alloying · CPC title

• H10P72/04

  Apparatus for manufacture or treatment · CPC title