Platform voltage regulator circuitry configurations
US-12474759-B2 · Nov 18, 2025 · US
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Shekhar Sameer patents
Shekhar Sameer is listed as an inventor on 43 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Shekhar Sameer |
| Total patents | 43 |
| First publication | Jun 23, 2016 |
| Latest publication | Nov 18, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Em and rf mitigation silicon structures in stacked die microprocessors for die to platform and die-die rf noise suppression
US-2024355778-A1 · Oct 24, 2024 · US
Encoding differential signals for power and noise reduction
US-2024329715-A1 · Oct 3, 2024 · US
EM and RF mitigation silicon structures in stacked die microprocessors for die to platform and die-die RF noise suppression
US-12057433-B2 · Aug 6, 2024 · US
Package edge passive component array for improved power integrity
US-2024145450-A1 · May 2, 2024 · US
Technologies for low-leakage on-chip capacitors
US-2023317773-A1 · Oct 5, 2023 · US
Embedded bridge substrate having an integral device
US-11749606-B2 · Sep 5, 2023 · US
Voltage protection
US-2023229222-A1 · Jul 20, 2023 · US
Stacked semiconductor package and method of forming the same
US-11562963-B2 · Jan 24, 2023 · US
Magnetic sensing scheme for voltage regulator circuit
US-11502603-B2 · Nov 15, 2022 · US
Recent patents
Latest publications not already listed above.
Structures to facilitate heat transfer within package layers to thermal heat sink and motherboard
US-11437294-B2 · Sep 6, 2022 · US
Digital linear regulator clamping method and apparatus
US-11429172-B2 · Aug 30, 2022 · US
Shield to protect vias from electromagnetic interference
US-11380623-B2 · Jul 5, 2022 · US
Stiffener and socket embedded metal insert architectures for power delivery
US-2022199551-A1 · Jun 23, 2022 · US
Apparatus, system, and method for reducing voltage overshoot in voltage regulators
US-11342852-B2 · May 24, 2022 · US
Em and rf mitigation silicon structures in stacked die microprocessors for die to platform and die-die rf noise suppression
US-2021398944-A1 · Dec 23, 2021 · US
Stacked semiconductor package and method of forming the same
US-2021384135-A1 · Dec 9, 2021 · US
Per chiplet thermal control in a disaggregated multi-chiplet system
US-11175709-B2 · Nov 16, 2021 · US
Embedded bridge substrate having an integral device
US-2021335712-A1 · Oct 28, 2021 · US
Embedded bridge substrate having an integral device
US-11133256-B2 · Sep 28, 2021 · US
Digital linear regulator clamping method and apparatus
US-2021208656-A1 · Jul 8, 2021 · US
Multi-terminal inductors for voltage regulators
US-10972001-B2 · Apr 6, 2021 · US
Noise mitigation apparatus and method with positively and negatively coupled inductors
US-10719109-B2 · Jul 21, 2020 · US
Package edge mounted frame structures
US-2020098674-A1 · Mar 26, 2020 · US
Multi-terminal inductors for voltage regulators
US-2020052583-A1 · Feb 13, 2020 · US
Structures to facilitate heat transfer within package layers to thermal heat sink and motherboard
US-2020051884-A1 · Feb 13, 2020 · US
Device, method and system to mitigate a voltage overshoot event
US-10541615-B1 · Jan 21, 2020 · US
Per chiplet thermal control in a disaggregated multi-chiplet system
US-2019384367-A1 · Dec 19, 2019 · US
Input Voltage Protection
US-2019377405-A1 · Dec 12, 2019 · US
Multi-voltage apparatus for electronics package including magnetic inductor and capacitor and manufacturing thereof
US-10453705-B2 · Oct 22, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 43 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 18 |
| H10W90/00 | 18 |
| H10W70/63 | 14 |
| H10W90/701 | 13 |
| H10W70/685 | 11 |