Bridge interconnection with layered interconnect structures
US-2025015004-A1 · Jan 9, 2025 · US
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Schuckman Amanda E patents
Schuckman Amanda E is listed as an inventor on 37 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Schuckman Amanda E |
| Total patents | 37 |
| First publication | Sep 29, 2015 |
| Latest publication | Jan 9, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Bridge interconnection with layered interconnect structures
US-12132002-B2 · Oct 29, 2024 · US
High density organic interconnect structures
US-12062551-B2 · Aug 13, 2024 · US
Bridge interconnection with layered interconnect structures
US-2024014138-A1 · Jan 11, 2024 · US
Bridge interconnection with layered interconnect structures
US-11694960-B2 · Jul 4, 2023 · US
High density organic interconnect structures
US-11631595-B2 · Apr 18, 2023 · US
High density organic interconnect structures
US-2022059367-A1 · Feb 24, 2022 · US
Bridge interconnection with layered interconnect structures
US-2021384129-A1 · Dec 9, 2021 · US
High density organic interconnect structures
US-11195727-B2 · Dec 7, 2021 · US
Bridge interconnection with layered interconnect structures
US-11133257-B2 · Sep 28, 2021 · US
Recent patents
Latest publications not already listed above.
Semiconductor device including silane based adhesion promoter and method of making
US-10916486-B2 · Feb 9, 2021 · US
Electronic assembly that includes void free holes
US-10856424-B2 · Dec 1, 2020 · US
High density organic interconnect structures
US-10685850-B2 · Jun 16, 2020 · US
Bridge interconnection with layered interconnect structures
US-2020043852-A1 · Feb 6, 2020 · US
Systems and methods for semiconductor packages using photoimageable layers
US-10553453-B2 · Feb 4, 2020 · US
Semiconductor device and method of making
US-2019355642-A1 · Nov 21, 2019 · US
Bridge interconnection with layered interconnect structures
US-10475745-B2 · Nov 12, 2019 · US
Systems and methods for semiconductor packages using photoimageable layers
US-2019311916-A1 · Oct 10, 2019 · US
Nickel-tin microbump structures and method of making same
US-2019244922-A1 · Aug 8, 2019 · US
Tin-zinc microbump structures and method of making same
US-10373900-B2 · Aug 6, 2019 · US
High density organic interconnect structures
US-2019221447-A1 · Jul 18, 2019 · US
Copper seed layer and nickel-tin microbump structures
US-10297563-B2 · May 21, 2019 · US
Bridge interconnection with layered interconnect structures
US-2019013271-A1 · Jan 10, 2019 · US
Redundant through-hole interconnect structures
US-2018323138-A1 · Nov 8, 2018 · US
Bridge interconnection with layered interconnect structures
US-10103103-B2 · Oct 16, 2018 · US
Metal protected fan-out cavity
US-9953959-B1 · Apr 24, 2018 · US
Tin-zinc microbump structures and method of making same
US-2018076119-A1 · Mar 15, 2018 · US
Nickel-tin microbump structures and method of making same
US-2018076161-A1 · Mar 15, 2018 · US
Package with bi-layered dielectric structure
US-9917044-B2 · Mar 13, 2018 · US
Tin-zinc microbump structures
US-9837341-B1 · Dec 5, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 37 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/685 | 30 |
| H10W70/635 | 30 |
| H10W90/724 | 26 |
| H10W90/00 | 22 |
| H10W90/734 | 21 |