Semiconductor device including silane based adhesion promoter and method of making

Patent metadata

Field	Value
Publication number	US-10916486-B2
Application number	US-201616335527-A
Country	US
Kind code	B2
Filing date	Sep 26, 2016
Priority date	Sep 26, 2016
Publication date	Feb 9, 2021
Grant date	Feb 9, 2021

Abstract

Various embodiments disclosed relate to semiconductor device and method of making the same using functional silanes. In various embodiments, the present invention provides a semiconductor device including a silicon die component having a first silica surface. The semiconductor device includes a dielectric layer having a second surface generally facing the first silica surface. The semiconductor device includes an interface defined between the first surface and the second surface. The semiconductor device also includes a silane based adhesion promoter layer disposed within the junction and bonded to at least one of the first silica surface and the dielectric layer second surface.

First claim

What is claimed is:

1. A semiconductor device comprising:
an embedded component having a first hydroxylated surface;
a dielectric layer having a second surface adjacent to the first hydroxylated surface;
a bond formed at an interface defined between the first hydroxylated surface and the second surface; and
a silane based adhesion promoter layer formed from a plurality of adhesion promotor molecules disposed within the interface and bonded to at least one of the first hydroxylated surface and the dielectric layer second surface, wherein at least one pair of adjacent adhesion promotor molecules are bonded to each other,
wherein the first hydroxylated surface is a silica surface of a silicon die.

2. The semiconductor device of claim 1 , wherein the silane based adhesion promotor layer is bonded to both of the first hydroxylated surface and the dielectric layer second surface.

3. The semiconductor device of claim 1 , wherein the silane based adhesion promotor layer is bonded to the first hydroxylated surface through a siloxane bond.

4. The semiconductor device of claim 3 , wherein the silane based adhesion promoter layer includes a nucleophilic end group.

5. The semiconductor device of claim 1 , wherein the dielectric layer is formed from an epoxy-based resin.

6. The semiconductor device of claim 1 , wherein the second surface of the dielectric layer comprises a layer of epoxy-based resin that is bonded to the dielectric component.

7. The semiconductor device of claim 6 , wherein the layer of epoxy-based resin has a thickness ranging from about 1 micron to about 5 microns.

8. The semiconductor device of claim 1 , wherein the silane based adhesion promotor layer is bonded to a terminal epoxy group of the dielectric layer second surface.

9. The semiconductor device of claim 1 , wherein the silane based adhesion promotor layer includes a hydroxyl group.

10. The semiconductor device of claim 1 , wherein the silane based adhesion promotor layer comprises:
a first silane group comprising:
a silicon atom;
a nucleophile bonded to the silicon;
a first hydroxyl group;
a second hydroxyl group; and
a third hydroxyl group.

11. The semiconductor device of claim 1 , wherein the silane based adhesion promoter layer further comprises a second silane group.

12. The semiconductor device of claim 11 , wherein the first hydroxyl group of the first bifunctional silane derivative adhesion promoter is bonded to the first hydroxylated surface of the die by a siloxane bond, and wherein the second hydroxyl group of the first silane group is bonded to at least one hydroxyl group of the second silane group by a siloxane bond.

13. The semiconductor device of claim 1 , wherein the silane based adhesion promotor layer forms a monolayer, wherein each adhesion promotor molecule is attached to the dielectric layer, the first hydroxylated surface, and at least one adjacent adhesion promotor molecule.

14. The semiconductor device of claim 1 , wherein the silicon die is further connected to a second silicon die.

Assignees

• Intel Corp

Inventors

• Brown Andrew J
• Chen Chi-Mon
• May Robert Alan
• Schuckman Amanda E
• Jen Wei-Lun Kane

Classifications

• H10W70/6525

  for securing the interconnections to the substrate, e.g. to prevent peeling · CPC title

• H10W70/618

  the bridge chips being embedded in the package substrates, interposers or redistribution layers · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W74/476

  Organic materials comprising silicon · CPC title

• H10W74/121

  by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation · CPC title